本文選題：單晶硅電池 + 焊帶��； 參考：《哈爾濱工業(yè)大學》2015年碩士論文

【摘要】：太陽能被認為是21世紀最重要的新能源,對解決人類能源危機和環(huán)境問題具有重要的意義。太陽能發(fā)電技術(shù)的核心是太陽能電池組件,而硅電池板和焊帶的釬焊連接作為太陽能電池組件制作過程中最重要的工序,直接影響著電池組件的光電轉(zhuǎn)化效率和使用壽命。目前,準備將民用的單晶硅電池板用于空間衛(wèi)星,但其焊點在空間大溫差的工作條件下可靠性不足,無法滿足空間衛(wèi)星的使用要求。本課題的目標是研究滿足空間衛(wèi)星使用要求的新的釬焊工藝,使焊點滿足熱循環(huán)性能要求和剝離力要求,并對互連焊點進行可靠性研究。本課題對比研究了手工點焊和熱壓釬焊兩種釬焊工藝方案,甄選出熱循環(huán)性能較好的熱壓釬焊方案,應用正交試驗方法對熱壓釬焊方案進行了參數(shù)優(yōu)化,通過正交試驗直觀分析和方差分析,確定最優(yōu)參數(shù)組,并明確參數(shù)對試驗結(jié)果的影響程度。最優(yōu)參數(shù)組所焊接的焊點熱循環(huán)測試和剝離力測試表明,其性能滿足了航天測試標準。對Sn-37Pb、Sn-3.5Ag和Sn-3.0Ag-0.5Cu釬料與銀漿界面進行了界面反應研究和失效分析,熱壓釬焊焊后三種釬料與銀漿的界面均出現(xiàn)了Ag_3Sn薄層。本課題對熱循環(huán)實驗后界面化合物Ag_3Sn的厚度和釬料微觀組織進行了表征,隨著熱循環(huán)試驗的不斷進行,界面的變化主要包括兩部分,一是界面化合物Ag_3Sn不斷變厚,且Sn-37Pb/Ag界面處Ag_3Sn生長最快;二是釬料中金屬間化合物或固溶體相逐漸粗化。對熱壓釬焊工藝所焊接的Sn-37Pb/Ag、Sn-3.0Ag-0.5Cu/Ag和Sn-3.5Ag/Ag三種接頭Ag_3Sn的時效生長和動力學進行了研究,確定Ag_3Sn為拋物線型生長。計算了不同溫度下Ag_3Sn的生長速率常數(shù),得到Sn-37Pb/Ag、Sn-3.5Ag/Ag和Sn-3.0Ag-0.5Cu/Ag界面化合物生長激活能,分別為113.3 kJ/mol、129.9 kJ/mol、123.1 kJ/mol。
[Abstract]:Solar energy is regarded as the most important new energy in the 21st century. The core of the solar power generation technology is the solar cell module. As the most important process in the process of making the solar cell module, the soldering connection between the silicon battery panel and the soldering tape directly affects the photoelectric conversion efficiency and service life of the battery module. At present, the single crystal silicon battery panel for civil use is ready to be used in space satellite, but the solder joint is not reliable enough to meet the requirements of space satellite under the condition of large temperature difference in space. The aim of this paper is to study the new brazing technology to meet the requirements of space satellite, to make the solder joints meet the requirements of thermal cycling performance and peeling force, and to study the reliability of interconnect solder joints. In this paper, two kinds of brazing schemes, manual spot welding and hot press brazing, are compared and studied. The hot pressing brazing schemes with better thermal cycling performance are selected. The parameters of the hot pressing brazing schemes are optimized by orthogonal test method. The optimal parameter group was determined by means of visual analysis and variance analysis of orthogonal test, and the degree of influence of parameters on the test results was determined. The thermal cycle test and peeling force test of solder joint welded by the optimal parameter group show that its performance meets the aerospace test standard. The interfacial reaction and failure analysis of Sn-37PbSn-3.5Ag and Sn-3.0Ag-0.5Cu solder with silver paste were carried out. After hot pressing brazing, Ag_3Sn thin layers were found at the interface between the three solders and the paste. The thickness of interfacial compound Ag_3Sn and the microstructure of solder were characterized in this paper. With the development of thermal cycling experiment, the change of interface mainly includes two parts, one is that the interfacial compound Ag_3Sn is thicker and thicker. At the interface of Sn-37Pb/Ag, Ag_3Sn grows fastest, and the intermetallic compound or solid solution phase in solder gradually coarsenes. The aging growth and kinetics of Sn-37Pb / AgSn-3.0 Ag-0.5Cu / Ag and Sn-3.5Ag/Ag joints were studied. The results show that Ag_3Sn is parabolic growth. The growth rate constants of Ag_3Sn at different temperatures were calculated and the activation energies of Sn-37Pb / AgSn-3.5 Ag- / Ag and Sn-3.0Ag-0.5Cu/Ag interfacial compounds were obtained, which were 113.3 KJ / mol / 129.9 KJ / mol / 123.1 KJ / mol, respectively.
【學位授予單位】：哈爾濱工業(yè)大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TM914.41;TG454

【參考文獻】

相關(guān)期刊論文 前10條

1 王志彬;賀虎;陳萌炯;黃三玻;王訓春;;太陽電池陣新型互連片微連接技術(shù)探討[J];航天器環(huán)境工程;2015年01期

2 余建;張紅;王勛榮;;硅太陽能電池片焊接不良分析及對策[J];常州信息職業(yè)技術(shù)學院學報;2014年02期

3 帥爭峰;楊宏;雷咸道;;晶體硅太陽電池組件封裝的電學損失分析[J];電源技術(shù);2014年01期

4 施學斌;;太陽能電池焊接工藝改進及全自動焊機的介紹[J];制造業(yè)自動化;2013年15期

5 任現(xiàn)坤;徐振華;姜言森;賈河順;張春艷;馬繼磊;;晶體硅太陽電池焊接工藝研究[J];當代化工;2013年06期

6 喬鳳斌;張松;趙維剛;蔡智亮;;太陽電池陣槍式微型電阻焊接系統(tǒng)設(shè)計與分析[J];電焊機;2013年05期

7 張雨晗;張淑杰;包軼穎;;飛船電源系統(tǒng)太陽電池銀焊點的熱應力分析[J];航天器環(huán)境工程;2012年06期

8 蘇彬;李洋;;空間太陽電池焊接影響因素研究[J];電源技術(shù);2012年10期

9 周志華;;電阻焊與激光焊技術(shù)在手機鋰電池制造工藝中的應用與發(fā)展[J];制造業(yè)自動化;2012年14期

10 王海東;帥爭鋒;王鶴;楊宏;;晶體硅太陽能電池焊接技術(shù)及其發(fā)展趨勢[J];電子工藝技術(shù);2012年03期

，

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