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聚晶金剛石復合片非脆性去除磨削機理研究

發(fā)布時間:2018-03-13 21:58

  本文選題:聚晶金剛石 切入點:磨削 出處:《大連理工大學學報》2015年03期  論文類型:期刊論文


【摘要】:聚晶金剛石(polycrystalline diamond,PCD)的磨削是PCD刀具制造中的關鍵環(huán)節(jié),磨削參數(shù)的變化影響PCD的去除方式,進而決定刀具的切削性能.通過掃描電鏡觀察分析腐蝕后的PCD磨削表面微觀形貌,研究了金剛石砂輪磨削PCD中的刻劃作用、滑擦作用和熱化學反應等非脆性去除機理,及其與磨削參數(shù)的關系.結果表明:刻劃作用僅在砂輪磨粒較鋒利時產(chǎn)生作用,多存在于濕磨初期;砂輪磨鈍后,滑擦作用和熱化學反應是PCD的主要去除方式,且滑擦作用與熱化學反應同時發(fā)生.通過設計一組特殊磨削試驗,間接證明了磨削后的PCD表面存在由熱化學反應產(chǎn)生的軟化層.
[Abstract]:The grinding of polycrystalline diamond diamond is a key link in the manufacture of PCD tool. The change of grinding parameters affects the removal mode of PCD and then determines the cutting performance of the tool. The microstructure of the corroded PCD grinding surface is observed and analyzed by scanning electron microscope (SEM). The mechanism of non-brittle removal such as scratching, sliding and thermochemical reaction in PCD grinding with diamond grinding wheel and its relation with grinding parameters are studied. The results show that the scratching effect is only effective when the grinding wheel is sharper. Most of them exist in the early stage of wet grinding. After grinding wheel is blunt, sliding friction and thermal chemical reaction are the main removal methods of PCD. It is proved indirectly that there is a softening layer produced by thermal chemical reaction on the surface of PCD after grinding.
【作者單位】: 大連理工大學機械工程學院;
【分類號】:TG580.1

【參考文獻】

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本文編號:1608289


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