本文選題：無鎘銀基釬料　切入點：粉末冶金　出處：《武漢理工大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：無鉛無鎘釬焊材料是全球性的環(huán)保發(fā)展需求,在計算機、汽車、航空航天等領(lǐng)域中的微電子產(chǎn)品封裝和一些特殊材料的焊接方面具有廣闊應(yīng)用前景。如何高效率低成本地制造性能優(yōu)良的環(huán)保釬料一直是企業(yè)界和學(xué)術(shù)界致力解決的關(guān)鍵問題。近年來,用電磁壓制方法制備環(huán)保釬焊材料薄片是一種新的探索,可有效回避傳統(tǒng)方法因熔煉、凝固產(chǎn)生大量脆性相導(dǎo)致后續(xù)成形加工難以進行的瓶頸問題,且壓制模具可直接根據(jù)封裝產(chǎn)品形狀、尺寸進行設(shè)計,壓制成形的釬料經(jīng)燒結(jié)后即可直接用于釬焊封裝工序,在滿足微電子封裝用釬焊材料多樣性需求的同時,也簡化了后續(xù)工藝、降低了生產(chǎn)成本。本文將電磁成形與粉末冶金技術(shù)結(jié)合,充分利用各自的特點與優(yōu)勢,采用電磁壓制方法制備微電子封裝所用的環(huán)保釬焊材料,不僅能夠較好地解決環(huán)保釬料難以加工成形的難題,還能通過提高壓坯壓制密度和致密均勻性來進一步改善釬料最終的焊接性能。探索了一種優(yōu)質(zhì)高效的環(huán)保釬料制備新技術(shù),對推進微電子封裝產(chǎn)業(yè)的發(fā)展、豐富難成形材料制備加工理論與方法具有重要意義和經(jīng)濟價值。本文采用理論分析、工藝實驗和微觀分析的方法對粉末電磁壓制壓坯和液相燒結(jié)體進行了系統(tǒng)的研究。以釬料性能和環(huán)境保護作為研究目的,通過分析各元素對釬料性能的影響,確定BAg44Cu28Zn25Sn3無鎘中溫銀基釬料作為研究對象,在低電壓電磁脈沖成形機上進行電磁壓制,通過觀察不同放電電壓下壓坯的斷口形貌,采用控制變量法計算不同放電電壓以及儲能電容下壓坯的密度,分析多金屬混合粉料高速壓制成形的機理與規(guī)律,有針對性地構(gòu)建高速率壓型方程,為多金屬混合粉料高速壓制過程的模擬分析提供模型與方法。結(jié)果顯示隨著放電電壓的增大,電磁脈沖力不斷增大,壓坯內(nèi)的粉末顆粒結(jié)合越緊密顆粒變形越小,壓坯致密性越好;放電電容越大,電磁脈沖力增大的同時也延長了壓制時間,致使壓坯密度出現(xiàn)先增大后減小的趨勢。電磁壓制后的壓坯在SX2-4-10箱式節(jié)能電阻爐中采用氬氣的保護氣氛進行液相燒結(jié),以燒結(jié)溫度和燒結(jié)時間為變量,結(jié)合燒結(jié)體密度計算、顯微硬度測量、顯微組織及斷口形貌分析、EPMA面分布分析、XRD物相測試及相圖分析,討論了燒結(jié)工藝參數(shù)對燒結(jié)體性能的影響,為合理制定燒結(jié)工藝提供了參考。結(jié)果顯示燒結(jié)溫度增加保溫時間減小會使燒結(jié)體內(nèi)孔洞變小變少,顯微組織細化,元素分布均勻,組成成分和內(nèi)部組織越接近于完全合金化的燒結(jié)體,性能越好。
[Abstract]:Cadmium free lead-free soldering materials is a global environmental development needs, in the computer, automobile, has the broad application prospect of welding microelectronics packaging in aerospace field and some special materials. How to high efficiency and low cost of environmental protection solder has excellent local manufacturing performance is a key problem in business and academic circles in recent years committed to solve. With the preparation method of electromagnetic compaction, environmental protection brazing material sheet is a kind of new exploration, can effectively avoid the traditional method for melting and solidification to produce a large number of brittle phase leads to subsequent forming the bottle neck problem processing difficult, and pressing directly according to the package of product shape, size design, forming the solder after sintering. Directly used for brazing packaging process in microelectronic packaging with a brazing material demand diversity at the same time, it simplifies the follow-up process, reducing the cost of production. The electromagnetic forming. This paper combined with powder metallurgy technology, make full use of their own characteristics and advantages, environmental protection brazing material by electromagnetic used in microelectronic packaging by pressing method system, not only can solve the environmental problems difficult to solder forming, but also through high density and tight pressing provided to further improve the uniformity of solder end the welding performance are discussed. A kind of high quality environmental protection solder preparation technology, to promote the development of microelectronic packaging industry, rich hard forming has important significance and economic value of materials preparation and processing theory and method. This paper uses the method of theoretical analysis, experiments and microscopic analysis was carried out on the blank and pressing the liquid phase sintering of powder. The electromagnetic properties of solder joints and environmental protection as the research objective, through the analysis of the influence of various elements on the properties of BAg44Cu solder, determine 28Zn25Sn3 cadmium free silver filler metal temperature as the research object, in the low voltage electromagnetic pulse electromagnetic compaction machine. The fracture morphology was observed by different discharge voltage compacts, using control variable method to calculate different discharge voltage and capacitor under the compact density of metal powder mixture mechanism and rule of high speed press forming, targeted to build high rate pressure equation, model and method for providing multi metal powder mixture simulation analysis of high speed pressing process. The results showed that with the increase of discharge voltage, electromagnetic pulse force increasing, pressure of powder particles in blank with more closely particle deformation is small, compact and compact the better; discharge capacity increases, while the increase of electromagnetic pulse force also extended the pressing time, resulting in the emergence of compact density first increased and then decreased. The compact electromagnetic compaction after SX2-4-10 box section Can the resistance furnace with protective atmosphere of argon by liquid phase sintering, the sintering temperature and sintering time is variable with the sintered body density calculation, microhardness measurement, microstructure analysis and fracture morphology analysis, surface analysis of distribution of EPMA, XRD phase test and phase diagram, the effects of sintering parameters on the properties of sintered body are discussed and provide a reference for establishing reasonable sintering process. The results showed that the increasing of sintering temperature holding time reduces the sintering body cavity becomes smaller and less, microstructure, element distribution, composition and internal organization is closer to the sintered body to completely alloyed performance better.

【學(xué)位授予單位】：武漢理工大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TG425

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本文編號：1602536