第二相粒子與織構(gòu)對高強Cu-Ni-Si系合金薄板各向異性的影響
發(fā)布時間:2019-03-02 09:18
【摘要】:利用利用X射線衍射、電子背散射衍射和透射電子顯微鏡等手段研究了Cu-Ni-Si系合金在不同固溶溫度下第二相與織構(gòu)對其平面各向異性的影響.結(jié)果表明:隨固溶溫度的升高,合金強度和伸長率均出現(xiàn)先升高后降低的趨勢,且存在明顯的各向異性;800℃固溶時,Cu'和S'為主織構(gòu),部分形變晶粒誘發(fā)少量Brass、Goss和{011}〈511〉取向的形成,使得合金各向異性減弱;高溫固溶時(≥850℃),晶粒發(fā)生完全再結(jié)晶,Cu'和S'織構(gòu)強度顯著增加,Brass等織構(gòu)減弱甚至消失,各向異性增強;850℃固溶時效后形成δ-Ni_2Si析出相,并與基體滿足[001]_(Cu)//[110]_δ,(010)_(Cu)//(001)_δ位向關(guān)系,溫度進一步增加,第二相析出體積分數(shù)降低,有利于改善材料的各向異性.
[Abstract]:By means of X-ray diffraction, electron backscattering diffraction and transmission electron microscopy, the influence of the second phase and texture on the plane anisotropy of Cu-Ni-Si alloy at different solid solution temperatures has been investigated by means of X-ray diffraction, electron backscattering diffraction and transmission electron microscopy. The results show that with the increase of solid solution temperature, the strength and elongation of the alloy increase first and then decrease, and there is obvious anisotropy. At 800 鈩,
本文編號:2432915
[Abstract]:By means of X-ray diffraction, electron backscattering diffraction and transmission electron microscopy, the influence of the second phase and texture on the plane anisotropy of Cu-Ni-Si alloy at different solid solution temperatures has been investigated by means of X-ray diffraction, electron backscattering diffraction and transmission electron microscopy. The results show that with the increase of solid solution temperature, the strength and elongation of the alloy increase first and then decrease, and there is obvious anisotropy. At 800 鈩,
本文編號:2432915
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