【摘要】：研究了TB6合金β相區(qū)加熱過程中的β晶粒生長規(guī)律,計算了β晶粒生長激活能,并建立了β晶粒生長相關(guān)模型。結(jié)果表明:β晶粒尺寸隨保溫時間增加,先快速增加,后緩慢增加;隨加熱溫度升高,β晶粒尺寸先緩慢增加,加熱溫度超過940℃時,β晶粒尺寸快速增加;β晶粒尺寸與保溫時間存在冪函數(shù)關(guān)系,與加熱溫度存在指數(shù)關(guān)系。計算了合金β相區(qū)晶粒生長激活能為92.77 k J/mol,并建立了β晶粒生長模型,模型計算值與實驗數(shù)據(jù)的平均誤差為8.9%。
[Abstract]:The 尾 -grain growth in TB6 alloy during 尾 -phase heating was studied, the activation energy of 尾 -grain growth was calculated, and the correlation model of 尾 -grain growth was established. The results show that the 尾 grain size increases rapidly first and then slowly with the increase of holding time, and slowly increases with the increase of heating temperature, and increases rapidly when the heating temperature exceeds 940 鈩，

本文編號：2298572