發(fā)布時(shí)間：2018-10-24 17:59

【摘要】：微細(xì)加工在許多工業(yè)領(lǐng)域中有著重要而廣闊的應(yīng)用前景。金屬電沉積是指利用電化學(xué)原理,在外接電場作用下,陽極與陰極通過電沉積液連成回路,沉積液中的金屬離子沉積到陰極表面上的過程。當(dāng)金屬達(dá)到納米尺度時(shí),會出現(xiàn)一些新的效應(yīng),如量子尺寸效應(yīng)、小尺寸效應(yīng)和宏觀量子隧道效應(yīng)等。這些效應(yīng)往往同時(shí)起作用,并由此導(dǎo)致納米材料的力、熱、光、電,磁,以及化學(xué)性能與其對應(yīng)的塊體材料不同�；谝延械奈⒓�(xì)加工技術(shù)基礎(chǔ),本文提出利用毛細(xì)管輔助微細(xì)電沉積制備金屬結(jié)構(gòu)的新方法,該方法以獨(dú)特設(shè)計(jì)的微電極作為電沉積反應(yīng)中的陽極,結(jié)合局部電沉積微加工技術(shù),能夠快速、簡單地實(shí)現(xiàn)金屬微結(jié)構(gòu)制備。本課題主要從理論分析、實(shí)驗(yàn)裝置系統(tǒng)設(shè)計(jì)、數(shù)值模擬仿真及工藝試驗(yàn)分析這幾個(gè)方面對這種金屬微結(jié)構(gòu)制備方法進(jìn)行研究,主要研究內(nèi)容及創(chuàng)新點(diǎn)如下:(1)提出一種毛細(xì)管輔助微細(xì)電沉積制備金屬結(jié)構(gòu)的加工方法。該方法是利用毛細(xì)玻璃管作為絕緣裝置,微細(xì)鉑絲插入毛細(xì)管內(nèi)部并與其底部管口齊平作為電化學(xué)反應(yīng)中的陽極。陽極固定在Z向高精度電控平移臺上,在自動(dòng)控制系統(tǒng)的控制下能實(shí)現(xiàn)微細(xì)金屬結(jié)構(gòu)的快速且高效制備。(2)利用COMSOL Multiphysics仿真軟件對微細(xì)電沉積制備金屬銅柱結(jié)構(gòu)的過程進(jìn)行電場數(shù)值模擬。分別針對未套有絕緣裝置和套有絕緣裝置(毛細(xì)管)的兩種物理模型進(jìn)行仿真研究,從理論上驗(yàn)證毛細(xì)管輔助微細(xì)電沉積制備金屬結(jié)構(gòu)的可行性。(3)設(shè)計(jì)并搭建以毛細(xì)管輔助微細(xì)電沉積進(jìn)行微細(xì)加工的試驗(yàn)系統(tǒng)平臺。完成核心電沉積加工單元的設(shè)計(jì)、步進(jìn)系統(tǒng)的自動(dòng)控制以及利用CCD監(jiān)控系統(tǒng)對沉積過程進(jìn)行實(shí)時(shí)監(jiān)測,及時(shí)完成各項(xiàng)工藝參數(shù)的調(diào)整。(4)為探究微細(xì)金屬結(jié)構(gòu)生長的最佳工藝參數(shù),以制備微細(xì)金屬銅柱為例,分別從脈沖電源的工作電壓和占空比兩種工藝參數(shù)進(jìn)行加工試驗(yàn),得出制備銅柱的最佳工藝參數(shù)。在此研究基礎(chǔ)上,根據(jù)制備微細(xì)銅柱的最佳電參數(shù)來進(jìn)一步指導(dǎo)其他微細(xì)金屬結(jié)構(gòu)的制備過程,并由此獲得不同的微細(xì)金屬結(jié)構(gòu)。
[Abstract]:Micro-machining has an important and broad application prospect in many industrial fields. Metal electrodeposition refers to the process of metal ion deposition on the surface of cathode under the action of electrochemistry and external electric field, and the anode and cathode are connected through the electrodeposition liquid to form a loop, and the metal ions in the deposition solution are deposited on the surface of the cathode. When metal reaches nanometer scale, some new effects will appear, such as quantum size effect, small size effect and macroscopic quantum tunneling effect. These effects often work at the same time, which leads to the force, heat, light, electricity, magnetic, and chemical properties of nanomaterials being different from their corresponding bulk materials. Based on the existing micromachining technology, a new method for the preparation of metal structures by capillary assisted micro-electrodeposition is proposed, in which the uniquely designed microelectrode is used as the anode in electrodeposition reaction. Combined with local electrodeposition micromachining technology, metal microstructures can be fabricated quickly and simply. In this paper, the preparation methods of the metal microstructures are studied from the aspects of theoretical analysis, experimental device system design, numerical simulation and process test analysis. The main research contents and innovations are as follows: (1) A capillary assisted micro-electrodeposition method is proposed to prepare metal structures. In this method, the capillary glass tube is used as the insulating device, the thin platinum wire is inserted into the capillary tube and is used as the anode in the electrochemical reaction. The anode is fixed on the Z direction high precision electronic control translation platform, Under the control of automatic control system, micro metal structure can be fabricated quickly and efficiently. (2) the electric field numerical simulation of micro electrodeposition process of metal copper column structure is carried out by using COMSOL Multiphysics software. Two kinds of physical models of uninsulated devices and capillaries (capillary tubes) were simulated and studied respectively. The feasibility of preparing metal structure by capillary assisted micro electrodeposition was verified theoretically. (3) A test system platform for micro electrodeposition with capillary assisted micro electrodeposition was designed and built. Complete the design of the core electrodeposition processing unit, the automatic control of the step system and the real-time monitoring of the deposition process by using the CCD monitoring system. (4) in order to explore the best technological parameters for the growth of micro-metal structure, taking the preparation of micro-metal copper column as an example, the processing tests were carried out from the working voltage and duty cycle of the pulse power supply. The optimum technological parameters for the preparation of copper column were obtained. On the basis of this study, the preparation process of other micro-metal structures is further guided by the optimum electrical parameters of the preparation of copper microcolumns, and different micro-metal structures are obtained.
【學(xué)位授予單位】：南京航空航天大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TG662

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