【摘要】：B270光學(xué)玻璃具有良好的透光反射效果、表面硬度較高,廣泛應(yīng)用在光學(xué)鍍膜領(lǐng)域。鈦合金憑借其優(yōu)異的比強(qiáng)度、耐蝕性和耐熱性而被廣泛應(yīng)用于各個(gè)領(lǐng)域,因此,利用光學(xué)玻璃與TC4鈦合金組成復(fù)合結(jié)構(gòu),改善玻璃本身延展性和沖擊韌性低的缺陷,最終能夠?qū)崿F(xiàn)玻璃/金屬連接件在微電子和光學(xué)等領(lǐng)域的廣泛使用。目前在工業(yè)領(lǐng)域技術(shù)成熟且得到大規(guī)模運(yùn)用的是玻璃/可伐合金、玻璃/鋁連接件,科研領(lǐng)域?qū)ΣＡ?TC4鈦合金的研究較少,二者的連接技術(shù)有待開(kāi)發(fā)。本課題主要研究了采用真空熱壓和陽(yáng)極鍵合兩種工藝實(shí)現(xiàn)TC4鈦合金/玻璃的穩(wěn)固連接和良好氣密性。本課題研究分析了 TC4鈦合金預(yù)表面處理對(duì)TC4鈦合金/玻璃真空熱壓連接效果的影響。分析了不同厚度的氧化膜對(duì)熱壓過(guò)程中玻璃/TC4鈦合金連接效果的影響,觀察界面形貌,測(cè)定界面元素分布;對(duì)比分析了不同噴砂顆粒大小對(duì)TC4鈦合金表面形貌的影響,噴砂與噴蝕在TC4鈦合金表面粗化的優(yōu)劣,確定了最合適的TC4鈦合金表面預(yù)處理工藝。研究了真空熱壓參數(shù)(熱壓溫度T、熱壓時(shí)間t、熱壓壓力P)對(duì)TC4鈦合金/玻璃連接界面結(jié)構(gòu)、結(jié)合成效的影響,并探討了影響連接強(qiáng)度的殘余應(yīng)力的成因和解決方法以及真空熱壓的連接機(jī)制。結(jié)果表明:通過(guò)TC4鈦合金表面粗化處理增加了金屬表面積,加強(qiáng)了氧化膜與金屬基體、玻璃與TC4鈦合金的結(jié)合強(qiáng)度,氧化處理不僅提升了玻璃的潤(rùn)濕性,更是在氧化膜與玻璃緊密接觸的過(guò)程中,與玻璃發(fā)生化合反應(yīng),剪切強(qiáng)度可達(dá)11MPa,界面結(jié)合率達(dá)到95%以上。對(duì)應(yīng)的真空熱壓參數(shù)為:T=750℃,t=2h,P=0.5MPa。本課題研究了 TC4鈦合金/玻璃的陽(yáng)極鍵合工藝,分析了不同鍵合工藝參數(shù)(鍵合溫度T、鍵合電壓V)下的工藝特征,并通過(guò)對(duì)鍵合界面的結(jié)構(gòu)與元素分析界定,對(duì)比了真空熱壓與陽(yáng)極鍵合工藝特點(diǎn)的差異,并最終探討了 TC4鈦合金/玻璃陽(yáng)極鍵合機(jī)理,當(dāng)鍵合溫度T在350-550℃,電場(chǎng)電壓V在500-700V時(shí),能夠?qū)崿F(xiàn)TC4鈦合金/玻璃的穩(wěn)固連接,剪切強(qiáng)度達(dá)到15MPa以及100%結(jié)合率。鍵合界面結(jié)構(gòu)分析發(fā)現(xiàn):整個(gè)鍵合區(qū)域是由玻璃-中間過(guò)渡層-TC4鈦合金的結(jié)構(gòu)組成,界面兩側(cè)的化學(xué)元素呈梯度分布。TC4鈦合金與玻璃的鍵合過(guò)程分為界面極化致使堿金屬離子遷移、形成電勢(shì)實(shí)現(xiàn)緊密接觸階段、金屬離子與玻璃內(nèi)氧離子互相遷移發(fā)生氧化反應(yīng),最終過(guò)渡層形成三個(gè)階段。堿金屬離子受電場(chǎng)和溫度場(chǎng)作用發(fā)生遷移是界面結(jié)合的先決條件,內(nèi)部靜電力的產(chǎn)生以及化學(xué)濃度差為離子遷移發(fā)生氧化反應(yīng)最終形成過(guò)渡層提供了動(dòng)力。
[Abstract]:B270 optical glass is widely used in the field of optical coating due to its good transmittance and high surface hardness. Titanium alloys are widely used in various fields because of their excellent specific strength, corrosion resistance and heat resistance. Therefore, the composite structure of optical glass and TC4 titanium alloy is used to improve the defects of low ductility and impact toughness of glass. Finally, glass / metal connectors can be widely used in the fields of microelectronics and optics. At present, glass / Kovar alloy and glass / aluminum joint are the mature and widely used technology in the industrial field. The research on glass / TC4 titanium alloy is rare in the field of scientific research, and the connection technology between them needs to be developed. In this paper, vacuum hot pressing and anodic bonding are used to realize the stable connection and good airtightness of TC4 titanium alloy / glass. The effect of pre-surface treatment of TC4 titanium alloy on TC4 titanium alloy / glass vacuum hot pressing bonding was studied. The influence of different thickness of oxide film on the bonding effect of glass / TC4 titanium alloy during hot pressing was analyzed, the interface morphology was observed, the distribution of interface elements was measured, and the effect of different sand blasting particle size on the surface morphology of TC4 titanium alloy was compared. The surface coarsening of TC4 titanium alloy by sandblasting and pitting was studied. The most suitable surface pretreatment process of TC4 titanium alloy was determined. The effect of vacuum hot pressing parameters (hot pressing temperature T, hot pressing time t, hot pressing pressure P) on the interface structure and bonding effect of TC4 titanium alloy / glass was studied. The cause and solution of residual stress which affect the bonding strength and the connection mechanism of vacuum hot pressing are discussed. The results showed that the surface area of TC4 titanium alloy was increased by coarsening treatment, and the bonding strength of glass and TC4 titanium alloy was strengthened, and the wettability of glass was not only improved by oxidation treatment, but also by the surface coarsening treatment of TC4 titanium alloy. In the process of close contact between the oxide film and the glass, the composite reaction takes place with the glass, the shear strength is up to 11 MPA, and the interface bonding rate is over 95%. The corresponding vacuum hot pressing parameters are as follows: 1: TX 750 鈩，

本文編號(hào)：2187920