【摘要】：釔鐵石榴石鐵氧體(YIG)作為一種典型的微波鐵氧體,常用于雷達(dá)、微波通訊、導(dǎo)彈等領(lǐng)域。在實(shí)際應(yīng)用中,YIG陶瓷常需要與Cu進(jìn)行連接,本文提出了先對(duì)YIG陶瓷進(jìn)行表面金屬化處理,再對(duì)Cu/金屬化YIG進(jìn)行釬焊實(shí)現(xiàn)連接。研究了CuO含量、釬焊溫度及保溫時(shí)間對(duì)Ag-CuO釬料在YIG陶瓷表面潤(rùn)濕的影響,YIG陶瓷顆粒含量對(duì)金屬化層微觀組織的影響。YIG陶瓷顆粒含量、釬焊溫度及保溫時(shí)間對(duì)Cu/金屬化YIG接頭組織和力學(xué)性能的影響,分析了陶瓷表面金屬化機(jī)理和釬焊接頭形成機(jī)理。CuO含量的增加、釬焊溫度的升高和保溫時(shí)間的延長(zhǎng)均可提高Ag-CuO釬料在YIG表面的潤(rùn)濕性,CuO與YIG陶瓷反應(yīng)生成CuFe_2O_4,提高釬料的潤(rùn)濕性。YIG陶瓷表面金屬化結(jié)構(gòu)的典型組織為:Ag+CuO+CuFe_2O_4/YIG。綜合考慮各因素的影響,確定了釬料配比為Ag-7.5CuO,表面金屬化的工藝參數(shù)為:釬焊溫度為1040℃,保溫時(shí)間為20min。YIG陶瓷顆粒的加入大大改善了Ag-CuO釬料潤(rùn)濕性,增加CuFe_2O_4產(chǎn)量,可得到表面平整可進(jìn)行間接釬焊的金屬化層。使用Ag-7.5CuO/5YIG復(fù)合釬料時(shí),YIG陶瓷表面金屬化結(jié)構(gòu)的典型組織為:Ag+Y_3Fe_5O_(12)+CuO+CuFe_2O_4/YIG。釬料中YIG陶瓷顆粒含量的增加,導(dǎo)致金屬化層中YIG和CuFe_2O_4相增多,金屬化層表面平整度下降。向Ag7.5CuO/5YIG復(fù)合釬料加入1%TiO_2時(shí),可生成更多的CuFe_2O_4相,并在金屬化層/YIG界面附近富集。使用Sn-3.5Ag-0.75Cu釬料完成了金屬化YIG陶瓷/Cu的釬焊連接,釬料與母材Cu及金屬化層發(fā)生界面反應(yīng),得到的釬焊接頭典型微觀組織為:Cu/Cu_3Sn/Cu_6Sn_5/Sn+Ag_3Sn+Cu_6Sn_5/Ag_3Sn/Ag+Y_3Fe_5O_(12)+CuO+CuFe_2O_4/YIG。隨著YIG含量的增加,焊縫中YIG和CuFe_2O_4相增多,接頭剪切強(qiáng)度隨YIG含量增加而減小。釬焊溫度的升高和保溫時(shí)間的延長(zhǎng)會(huì)使Sn基固溶體兩側(cè)的反應(yīng)層增厚。隨著釬焊溫度升高,接頭剪切強(qiáng)度先增加后減小。而隨著保溫時(shí)間的延長(zhǎng),接頭剪切強(qiáng)度隨著下降。當(dāng)復(fù)合釬料中YIG含量為5%,釬焊溫度為270℃,保溫時(shí)間為1min時(shí),獲得最高接頭剪切強(qiáng)度,為28.7MPa。向復(fù)合釬料中加入少量TiO_2后,改變了YIG陶瓷顆粒在焊縫中分布情況,提高了接頭力學(xué)性能。
[Abstract]:Yttrium iron garnet ferrite (YIG), as a typical microwave ferrite, is often used in radar, microwave communication, missile and other fields. In practical application, YIG ceramics often need to be connected with Cu. In this paper, surface metallization of YIG ceramics and brazing of Cu / metallized YIG ceramics are proposed. The effects of CuO content, brazing temperature and holding time on the wettability of Ag-CuO solder on YIG ceramic surface were studied. The effects of brazing temperature and holding time on the microstructure and mechanical properties of Cu / metallized YIG joints were investigated. The wettability of Ag-CuO solder on YIG surface can be increased with the increase of brazing temperature and the prolongation of holding time. CuFe2O4 is formed by the reaction of CuO and YIG ceramics. The typical structure of the metallized structure on the surface of YIG ceramics is: 1% Ag CuO CuFe2O2O4 / YIG0.The typical structure for improving the wettability of the filler metal is: 1% Ag CuO CuFe2O4. Considering the influence of various factors, it is determined that the ratio of solder is Ag-7.5CuO, and the technological parameters of surface metallization are as follows: brazing temperature is 1040 鈩，

本文編號(hào)：2131459