【摘要】：藍(lán)寶石和TC4的連接本質(zhì)上屬于陶瓷與金屬的連接。而接頭較大的殘余應(yīng)力是目前急需解決的問題。釬焊是連接陶瓷與金屬最主要的研究方法,因此本課題采用釬焊對(duì)藍(lán)寶石和TC4合金進(jìn)行連接。把原位自生反應(yīng)和增強(qiáng)相強(qiáng)化的思想以及中間層的方法應(yīng)用到本課題中。對(duì)Ag-28Cu+x Ti體系A(chǔ)g基釬料釬焊藍(lán)寶石的可行性進(jìn)行了研究,研究了Ag基釬料在藍(lán)寶石拋光001晶面上的潤濕性能,在Ti含量達(dá)到9wt.%時(shí)獲得了理想的潤濕角。使用Ag-28Cu+9wt.%Ti釬料實(shí)現(xiàn)了藍(lán)寶石的釬焊連接并確定了典型釬焊接頭的界面組織及相組成。進(jìn)而探究了Ag-28Cu+x Ti體系釬料與藍(lán)寶石結(jié)合的熱力學(xué)條件和連接過程中界面組織的形成過程。為了緩解藍(lán)寶石/TC4釬焊過程中較大的殘余應(yīng)力,采用原位自生Ti B晶須強(qiáng)化的方法對(duì)藍(lán)寶石和TC4合金進(jìn)行釬焊。對(duì)典型接頭的界面組織進(jìn)行了分析,接頭組織為藍(lán)寶石/Ti3(Cu,Al)3O/Ti2(Cu,Al)+Ti2Cu/Ti B+Ti B2+Ag(s.s)+Ti2Cu+Ti(Cu,Al)/(αTi+Ti2Cu)+Ti3Al+Ti2Cu/TC4合金。并闡述了溫度以及復(fù)合釬料中Ti B2含量對(duì)接頭組織及力學(xué)性能的影響。結(jié)合EDS能譜和熱力學(xué)分析,解釋了接頭組織的形成機(jī)制。整個(gè)過程如下:釬料與母材間的固態(tài)接觸階段;界面Ti3(Cu,Al)3O反應(yīng)層及Ti B晶須的形成階段;Ti B晶須繼續(xù)生成,界面反應(yīng)層的生長及Ti2Cu、Ti2(Cu,Al)的形成階段;Ti(Cu,Al)、Ti Cu的形成及(αTi)+Ti2Cu組織及Ag(s.s)相的析出階段。采用原位自生Ti B晶須強(qiáng)化的方法對(duì)藍(lán)寶石和TC4合金進(jìn)行釬焊時(shí),接頭的強(qiáng)度并沒有得到明顯的強(qiáng)化,并且接頭母材產(chǎn)生了裂紋。因此選擇中間層方法來緩解接頭的殘余應(yīng)力。通過采用Mo中間層和Ag-28Cu+9wt.%Ti+Mo粉復(fù)合釬料兩種方法對(duì)藍(lán)寶石和TC4合金進(jìn)行釬焊,對(duì)接頭的組織進(jìn)行觀察分析,并對(duì)各參數(shù)下的試件進(jìn)行強(qiáng)度測試。通過金相和剪切強(qiáng)度測試結(jié)果對(duì)藍(lán)寶石開裂的原因進(jìn)行了分析。通過研究Mo中間層厚度對(duì)接頭組織和性能的影響,發(fā)現(xiàn)隨著接頭中Mo中間層厚度的增加,裂紋尺寸減小并消失。Mo中間層厚度達(dá)到300μm時(shí),強(qiáng)度達(dá)到最大值,13.25MPa。
[Abstract]:The connection between sapphire and TC4 is essentially a connection between ceramic and metal. However, the large residual stress of the joint is an urgent problem to be solved at present. Brazing is the most important research method to connect ceramics with metals, so brazing is used to connect sapphire and TC4 alloys. The idea of in situ autogenous reaction and enhancement phase strengthening and the method of interlayer are applied to this subject. The feasibility of Ag base brazing sapphire with Ag-28Cu x Ti system was studied. The wettability of Ag-base brazing filler metal on the polished 001 crystal plane of sapphire was studied. The ideal wetting angle was obtained when Ti content reached 9wt.%. Using Ag-28Cu 9wt.Ti filler metal, the brazing joint of sapphire was realized and the interface structure and phase composition of typical brazing joint were determined. Furthermore, the thermodynamic conditions for the bonding of Ag-28Cu x Ti solder with sapphire and the formation of interfacial structure in the bonding process were investigated. In order to alleviate the large residual stress during sapphire / TC4 brazing, in situ Ti B whisker strengthening method was used to braze sapphire and TC4 alloys. The interfacial microstructure of typical joints was analyzed. The microstructure of the joints is sapphire / Ti3 (Cunal) 3O / Ti2 (Cunal) Ti2Cu/ TiB2 Ag (s.s) Ti2CuTi (Cunal) / (偽 TiTi2Cu) Ti3AlTi2Cu- / TC4 alloy. The effects of temperature and TiB2 content on the microstructure and mechanical properties of the joint were discussed. The formation mechanism of joint microstructure was explained by EDS energy spectrum and thermodynamic analysis. The whole process is as follows: the solid contact stage between the filler metal and the base metal, the Ti _ 3 (Cu-Al) _ 3O reaction layer at the interface and the formation stage of the Ti _ B whisker. The growth of the interface reaction layer and the formation of Ti _ 2Cu _ 2O _ 2 (Cu-Al) and the precipitation of (偽 Ti) Ti _ 2Cu structure and Ag (s.s) phase. In situ brazing of sapphire and TC4 alloys by in-situ Ti B whisker strengthening, the strength of the joint was not obviously strengthened, and the crack occurred in the base metal of the joint. Therefore, the interlayer method is chosen to alleviate the residual stress of the joint. The sapphire and TC4 alloys were brazed by Mo interlayer and Ag-28Cu 9wt.Ti Mo composite solder. The microstructure of the joints was observed and analyzed, and the strength of the specimens under various parameters was tested. The causes of sapphire cracking were analyzed by metallography and shear strength test. By studying the effect of Mo interlayer thickness on the microstructure and properties of the joint, it is found that with the increase of Mo interlayer thickness in the joint, the crack size decreases and disappears. When the thickness of Mo interlayer reaches 300 渭 m, the strength reaches the maximum value of 13.25 MPA.
【學(xué)位授予單位】：哈爾濱工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TG454

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