石墨陰極弧增強(qiáng)放電及ta-C涂層沉積研究
本文選題:ta-C涂層 + 真空陰極電弧離子鍍; 參考:《哈爾濱工業(yè)大學(xué)》2017年碩士論文
【摘要】:ta-C涂層具有許多能和金剛石相媲美的卓越性能,例如良好的化學(xué)穩(wěn)定性、較高的硬度和優(yōu)異的抗磨損性能,良好的生物力學(xué)性能和生物相容性。ta-C涂層與高速鋼基體間熱膨脹系數(shù)相差1個(gè)數(shù)量級(jí),在高速鋼上直接沉積ta-C涂層,硬度和彈性模量以及膨脹系數(shù)的巨大差異,會(huì)導(dǎo)致涂層與基體界面之間產(chǎn)生很高的內(nèi)應(yīng)力,膜基結(jié)合強(qiáng)度很差。為了提高ta-C膜層與高速鋼基體的膜基結(jié)合強(qiáng)度通常在ta-C膜層與基體之間沉積打底層和過(guò)渡層,實(shí)現(xiàn)硬度、彈性模量和膨脹系數(shù)等物理性能的梯度變化。本文通過(guò)改變線(xiàn)圈電流、直流電弧電流、工作氣壓、平均脈沖電流等實(shí)驗(yàn)參數(shù)研究石墨陰極弧放電特性。本文設(shè)計(jì)基體/Cr/CrC/ta-C梯度膜層結(jié)構(gòu)來(lái)沉積ta-C涂層,利用真空陰極電弧離子鍍技術(shù)在M2高速鋼和單晶Si片上制備了ta-C涂層,并研究了不同參數(shù)下涂層組織形貌、相結(jié)構(gòu)的變化及機(jī)理以及工藝參數(shù)的改變對(duì)涂層膜基結(jié)合強(qiáng)度、摩擦磨損性能、硬度的影響。放電測(cè)試結(jié)果表明,工藝參數(shù)對(duì)石墨陰極弧放電特性有很大影響;w電流隨電弧電流增加而增大,電弧電壓幾乎保持不變;基體電流隨著線(xiàn)圈電流的增加而增大,電弧電壓也不斷增加;基體電流隨著Ar氣氣壓的增大先增大后減小,電弧電壓幾乎保持不變;基體電流變化波形與脈沖電流波形相似,電弧電壓在脈沖部分明顯增大。ta-C涂層結(jié)構(gòu)分析表明,沉積時(shí)間超過(guò)30min時(shí),ta-C涂層開(kāi)始脫落,ID/IG值隨著時(shí)間延長(zhǎng)不斷增大,sp3鍵含量不斷降低。線(xiàn)圈電流增大對(duì)試樣轟擊作用加強(qiáng),ID/IG值總體趨勢(shì)增大。ID/IG值隨電弧電流增加先減小后增大,60A時(shí)sp3鍵含量最高。ta-C涂層性能分析表明,隨時(shí)間延長(zhǎng)膜基結(jié)合強(qiáng)度逐漸下降,50min的涂層表面出現(xiàn)褶皺現(xiàn)象。線(xiàn)圈電流增大,膜基結(jié)合強(qiáng)度想降低后升高。電弧電流增大,膜基結(jié)合強(qiáng)度下降,但都在HF2級(jí)別以上。電流相等時(shí),脈沖電流的膜基結(jié)合強(qiáng)度明顯低于直流。線(xiàn)圈系列納米硬度最大的為0.1A,硬度為33.5GPa。脈沖系列納米硬度最大的為脈沖平均電流80A,硬度為45GPa。硬度和石墨化是影響摩擦系數(shù)的兩大因素。
[Abstract]:The ta-C coating has many excellent properties comparable to diamond, such as good chemical stability, high hardness and excellent wear resistance. Good biomechanical properties and biocompatibility. The difference of thermal expansion coefficient between ta-C coating and high speed steel substrate is 1 order of magnitude. The difference of hardness, modulus of elasticity and expansion coefficient of ta-C coating deposited directly on high speed steel is great. The interfacial stress between the coating and the substrate is very high, and the bonding strength of the film substrate is very poor. In order to improve the bonding strength between ta-C film and high speed steel substrate, a gradient change of physical properties such as hardness, modulus of elasticity and coefficient of expansion is realized by depositing the bottom layer and transition layer between ta-C film and substrate. The discharge characteristics of graphite cathode arc are studied by changing the experimental parameters such as coil current DC arc current working pressure and average pulse current. In this paper, the substrate / Cr / Cr / C gradient film structure was designed to deposit ta-C coating. Ta-C coating was prepared on M2 high speed steel and single crystal Si substrate by vacuum cathode arc ion plating. The microstructure of the coating was studied under different parameters. The effect of the change of phase structure, mechanism and process parameters on the bonding strength, friction and wear properties and hardness of the coating. The discharge test results show that the process parameters have great influence on the discharge characteristics of graphite cathode arc. The substrate current increases with the increase of the arc current, and the arc voltage increases with the increase of the coil current, and the base current increases with the increase of ar gas pressure, and then decreases with the increase of ar gas pressure. The arc voltage is almost unchanged, the variation waveform of substrate current is similar to that of pulse current, and the arc voltage increases obviously in the pulse part. When the deposition time is longer than 30min, the ID-IG value of the coating begins to fall off, and the content of sp3 bond decreases with the increase of the deposition time. When the coil current increases, the general trend of ID-R / IG value increases. When the arc current increases, the sp3 bond content of the coating decreases first and then increases with the increase of the arc current. The results show that: 1) when the arc current increases, the content of sp3 bond is the highest in the coating. When the bonding strength of the film decreased for 50 min, the surface of the coating was wrinkled. When the coil current increases, the bonding strength of the film base increases after decreasing. When the arc current increases, the bonding strength of the film base decreases, but all of them are above the level of HF2. When the current is equal, the bonding strength of the film base of the pulse current is obviously lower than that of the DC. The maximum hardness of the coil series is 0.1A and the hardness is 33.5 GPA. Pulse series nanocrystalline hardness is the maximum pulse average current 80 A, hardness of 45 GPA. Hardness and graphitization are two main factors affecting friction coefficient.
【學(xué)位授予單位】:哈爾濱工業(yè)大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2017
【分類(lèi)號(hào)】:TG174.4
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