本文選題：納米復(fù)合鍍 + 化學(xué)鍍�。� 參考：《齊齊哈爾大學(xué)》2017年碩士論文

【摘要】：納米復(fù)合化學(xué)鍍是在化學(xué)鍍?nèi)芤褐屑尤爰{米粒子,使之與化學(xué)鍍合金共沉積從而獲得各種不同物理化學(xué)性質(zhì)鍍層的一種工藝。隨著納米材料學(xué)的發(fā)展,人們對(duì)納米粒子性質(zhì)的認(rèn)識(shí)不斷深化。納米粒子具有很多獨(dú)特的物理及化學(xué)性能,包括量子尺寸效應(yīng)、表面效應(yīng)、量子隧道效應(yīng)等。納米復(fù)合鍍層與普通金屬鍍層相比,許多性能都得到了較大的提高,比如硬度、耐磨性、耐蝕性、抗高溫以及光催化性等。本文采用比較的方法得出了納米復(fù)合鍍操作簡(jiǎn)單、價(jià)格低廉且得到的鍍層也更為優(yōu)良的工藝條件。納米TiN作為納米分散粒子,將其分散到Ni-P鍍液中,在銅片基體上制得Ni-P-TiN復(fù)合鍍層。在改良原有的工藝基礎(chǔ)上,并探討了不同條件下對(duì)納米復(fù)合鍍層的影響,從而方便、快速的制得納米復(fù)合鍍層,檢測(cè)了鍍層的形貌、沉積速度和硬度并討論了納米粒子分散性能。本文通過(guò)不同的表面活性劑、表面活性劑含量、不同配位劑、配位劑含量、不同潤(rùn)濕劑、潤(rùn)濕劑含量、納米TiN含量、溫度、施鍍時(shí)間及pH等不同條件下對(duì)鍍液分散性、穩(wěn)定性的影響;并且對(duì)鍍層形貌和硬度進(jìn)行了測(cè)試和表征。借助SEM、XPS的分析,為鍍層表面納米粒子分散性能及鍍層形貌提供了充分的依據(jù)。納米化學(xué)復(fù)合鍍鍍銅的最佳工藝條件為:在機(jī)械攪拌下,溫度為85℃、pH為5.5、時(shí)間為50 min、硫酸鎳27 g/L、次亞磷酸鈉26 g/L、無(wú)水乙酸鈉13 g/L、乳酸4 g/L、丙三醇3 g/L、TiN3 g/L、聚乙烯亞胺2 g/L。
[Abstract]:Nano-composite electroless plating is a process in which nano-particles are added to electroless plating solution and codeposited with electroless plating alloy to obtain various kinds of electroless coatings. With the development of nanomaterials, people have a deeper understanding of the properties of nanoparticles. Nanoparticles have many unique physical and chemical properties, including quantum size effect, surface effect, quantum tunneling effect and so on. Compared with conventional metal coatings, nanocomposite coatings have been improved in many aspects, such as hardness, wear resistance, corrosion resistance, high temperature resistance and photocatalysis. In this paper, the process conditions of nanocomposite plating are obtained, which are simple operation, low price and better coating. Nano-sized TiN was dispersed into Ni-P solution as nano-dispersed particles, and Ni-P-TiN composite coating was prepared on copper substrate. On the basis of improving the original technology and discussing the influence of different conditions on the nano-composite coating, the nanocomposite coating was prepared conveniently and quickly, and the morphology of the coating was examined. Deposition rate and hardness were also discussed. In this paper, different surfactants, surfactant contents, different coordination agents, coordination agent contents, different wetting agents, wetting agent content, nanometer TiN content, temperature, plating time and pH were used to disperse the plating solution. The morphology and hardness of the coating were tested and characterized. With the help of the analysis of SEM XPS, it provides a sufficient basis for the dispersion of nanoparticles on the surface of the coating and the morphology of the coating. The optimum conditions of electroless copper plating are as follows: mechanical stirring, temperature 85 鈩，

本文編號(hào)：1951780