本文選題：離心鑄造 + 軸承合金��； 參考：《材料導(dǎo)報》2017年20期

【摘要】：銅基軸瓦因具有更好的導(dǎo)熱性能而被廣泛使用,然而Cu/Sn界面反應(yīng)問題影響了銅基軸瓦的結(jié)合強度和服役壽命。通過電鍍技術(shù)在銅基體上制備Ni層,并采用離心鑄造法制備了具有Ni層的銅基軸瓦。結(jié)果表明,Ni層可有效阻止?jié)茶T過程巴氏合金中Sn與銅基體的反應(yīng),同時不降低巴氏合金與基體的結(jié)合強度。經(jīng)過175℃、500h時效后,發(fā)現(xiàn)具有Ni層的銅基軸瓦試樣的結(jié)合強度仍高于50 MPa,其原因在于Ni層阻止了Cu_6Sn_5相在結(jié)合界面的大量生成與長大。
[Abstract]:The results show that the Ni layer can effectively prevent the reaction between Sn and Cu matrix in the process of casting . The results show that the Ni layer can effectively prevent the reaction between Sn and Cu matrix in the casting process , and at the same time , the bonding strength of the Cu - based bearing pad with Ni layer is still higher than 50 MPa after aging at 175 鈩，

本文編號：1944806