本文選題：釬焊 + 界面　； 參考：《鑄造技術(shù)》2017年11期

【摘要】：研究微量Ni元素對Sn2.5Ag0.7Cu釬料顯微組織和力學(xué)性能的影響。結(jié)果表明,Sn2.5Ag0.7Cu合金主要由β-Sn相、Ag3Sn相和Cu6Sn5相組成;添加微量的Ni元素后,可以有效地細(xì)化合金的內(nèi)部組織,且共晶組織內(nèi)部產(chǎn)生以Cu6Sn5相為基的(Cu,Ni)6Sn5相,或Ag3Sn相為基的(Ag,Ni)3Sn相。焊點界面主要為Cu基體、IMC層和釬料3個區(qū)域;隨著釬焊時間的延長或釬焊溫度的增加,IMC層在Cu基體側(cè)較為光滑平坦,而釬料側(cè)呈現(xiàn)扇貝狀分布;釬焊接頭的剪切強度都是呈先增大后減小趨勢,在釬焊時間240 s和釬焊溫度300℃達(dá)到最大值48 MPa。
[Abstract]:The effect of trace Ni on microstructure and mechanical properties of Sn2.5Ag0.7Cu solder was studied.The results show that Sn2.5Ag0.7Cu alloy is mainly composed of 尾 -Sn phase, Ag3Sn phase and Cu6Sn5 phase, and the internal microstructure of the alloy can be effectively refined by adding trace Ni element, and the Cu6Sn5 phase is formed in the eutectic structure, or the Agni Ni3Sn phase based on Ag3Sn phase is formed.The interface of the solder joint is mainly composed of three regions: cu substrate IMC layer and brazing filler metal. With the prolongation of brazing time or the increase of brazing temperature, the IMC layer is smooth and flat on the Cu substrate side, while the brazing alloy side presents a scallop distribution.The shear strength of brazed joints increased first and then decreased, reaching a maximum of 48 MPA at the brazing time of 240 s and the brazing temperature at 300 鈩，

本文編號：1767494