本文選題：金包銅復(fù)合微絲　切入點(diǎn)：拉拔　出處：《中國(guó)有色金屬學(xué)報(bào)》2017年09期 　論文類(lèi)型：期刊論文

【摘要】：采用旋鍛-拉拔-擴(kuò)散退火-拉拔方法制備直徑60μm金包銅復(fù)合微絲,研究拉拔過(guò)程中復(fù)合微絲顯微組織、力學(xué)性能和導(dǎo)電率的變化規(guī)律。結(jié)果表明:所制備的微絲表面光潔和金/銅界面結(jié)合狀態(tài)良好,金層平均厚度約為2.0μm,橫斷面金包覆層面積比約為10.5%。在拉拔過(guò)程中,當(dāng)真應(yīng)變?cè)龃笾?.5時(shí),復(fù)合微絲銅芯由退火態(tài)的等軸晶組織逐漸轉(zhuǎn)變?yōu)闂l狀纖維組織,晶內(nèi)小角度晶界數(shù)量明顯增大,微絲的抗拉強(qiáng)度由退火態(tài)的235 MPa增大至最大值451 MPa,而斷后伸長(zhǎng)率由退火態(tài)的49.5%降低至1.2%,導(dǎo)電率由100.0%(IACS)下降為98.3%(IACS);繼續(xù)增大真應(yīng)變至3.5和4.8時(shí),加工過(guò)程中產(chǎn)生的變形熱使銅芯發(fā)生動(dòng)態(tài)回復(fù)和動(dòng)態(tài)再結(jié)晶,小角度晶界數(shù)量降低,大角度晶界數(shù)量增多;當(dāng)真應(yīng)變?yōu)?.8時(shí),微絲的抗拉強(qiáng)度為439MPa,伸長(zhǎng)率上升至3.0%,導(dǎo)電率下降到94.5%(IACS)。
[Abstract]:The microstructures of 60 渭 m gold coated copper composite microwires were prepared by the method of rotary forging, drawing, diffusion annealing and drawing, and the microstructure of the composite microwires during drawing was studied. The change of mechanical properties and conductivity. The results show that the surface of the prepared microfilament is smooth and the interface of gold / copper is good, the average thickness of gold layer is about 2.0 渭 m, and the area ratio of cross-section gold coating layer is about 10.5.The results show that during drawing process, the average thickness of gold layer is about 2.0 渭 m, and the area ratio of cross section gold coating layer is about 10.5. When the true strain is increased to 2.5, the microstructure of the composite microwire copper core changes gradually from the annealed equiaxed structure to the stripe structure, and the number of grain boundaries at small angles increases obviously. The tensile strength of the microwires increased from 235 MPa in the annealed state to the maximum value of 451MPa, while the elongation at break decreased from 49.5% in the annealed state to 1.2, and the conductivity decreased from 100.0and IACSC to 98.3IACSC, and when the true strain was increased to 3.5,4.8. The deformation heat produced in the process of processing causes dynamic recovery and dynamic recrystallization of the copper core. The number of small angle grain boundaries decreases and the number of large angle grain boundaries increases, when the true strain is 4.8, The tensile strength of the microfilament was 439 MPA, the elongation increased to 3.0 and the electrical conductivity decreased to 94.5a.
【作者單位】： 北京科技大學(xué)材料先進(jìn)制備技術(shù)教育部重點(diǎn)實(shí)驗(yàn)室;北京科技大學(xué)現(xiàn)代交通金屬材料與加工技術(shù)北京實(shí)驗(yàn)室;
【基金】：國(guó)家自然科學(xué)基金資助項(xiàng)目(51104016) 稀貴金屬綜合利用新技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室開(kāi)放課題資助項(xiàng)目(SKL-SPM-201204)~~
【分類(lèi)號(hào)】：TG359

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