本文關(guān)鍵詞： 單顆磨粒 CrMo 成屑過(guò)程 磨削 有限元仿真　出處：《材料導(dǎo)報(bào)》2017年10期 　論文類型：期刊論文

【摘要】：為研究20CrMo材料的磨削去除機(jī)理與微觀成屑過(guò)程,采用Johnson-Cook模型作為20CrMo的本構(gòu)模型,應(yīng)用有限元軟件Abaqus建立了單顆CBN磨粒磨削20CrMo成屑過(guò)程的三維有限元分析模型。通過(guò)該模型探究不同磨削參數(shù)下的微觀成屑過(guò)程,仿真分析結(jié)果表明:磨削速度對(duì)成屑過(guò)程中的耕犁與成屑階段影響較大,磨削深度對(duì)滑擦與成屑階段影響較大。設(shè)計(jì)了單顆磨粒磨削實(shí)驗(yàn)裝置,對(duì)微觀成屑進(jìn)行了實(shí)驗(yàn)研究與分析,從磨痕溝槽和磨屑的整體特征來(lái)看,實(shí)驗(yàn)結(jié)果與仿真結(jié)果都較為吻合,驗(yàn)證了該三維仿真模型的正確性。
[Abstract]:In order to study the grinding removal mechanism of 20CrMo material and the process of microchip formation, the Johnson-Cook model was used as the constitutive model of 20CrMo. A 3D finite element analysis model for the chip forming process of single CBN abrasive grinding 20CrMo was established by using the finite element software Abaqus. The micro chip forming process under different grinding parameters was investigated by using the model. The simulation results show that the grinding speed has a great influence on the plow and the shaving stage in the process of chip forming, and the grinding depth has a great influence on the sliding and chip forming stages. A single abrasive grinding experimental device is designed. Experimental research and analysis on microchip formation are carried out. From the overall characteristics of the grooves and chips, the experimental results are in good agreement with the simulation results, which verifies the correctness of the 3D simulation model.
【作者單位】： 湖南大學(xué)國(guó)家高效磨削工程技術(shù)研究中心;
【基金】：國(guó)家科技重大專項(xiàng)(2013ZX04012-051)
【分類號(hào)】：TG580.6

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本文編號(hào)：1513360