本文關(guān)鍵詞：高密封裝用BGA焊球制備工藝研究　出處：《河南科技大學(xué)》2017年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： BGA焊球 切絲重熔法 工藝參數(shù) 真球度 表面質(zhì)量 含氧量

【摘要】：電子信息產(chǎn)品的迅猛發(fā)展使得集成電路封裝快速向高密度、智能化模式發(fā)展。球柵陣列(Ball Grid Array,BGA)封裝技術(shù)的誕生使得電子產(chǎn)品具有更高的可靠性和更好的散熱性及電學(xué)性能等,成為目前使用最普遍的封裝技術(shù)。錫球是BGA封裝技術(shù)的關(guān)鍵材料,錫球質(zhì)量決定著封裝質(zhì)量,因此研究錫球的生產(chǎn)工藝具有重要意義。本文利用切絲重熔法制備BGA焊球,通過(guò)設(shè)定不同球化工藝參數(shù)研究了球化溫度、球化介質(zhì)和球化區(qū)間分別對(duì)BGA焊球真球度、表面質(zhì)量和含氧量的影響,以及相同工藝參數(shù)下不同釬料BGA焊球的質(zhì)量。研究結(jié)果表明:BGA焊球真球度隨球化溫度升高先增大后減小,表面質(zhì)量先變優(yōu)后變差,含氧量逐漸升高,300℃時(shí)釬焊球真球度最高,為97.73%,含氧量為0.009wt%,且表面平整度與光潔度高,無(wú)明顯缺陷,表面質(zhì)量最優(yōu),為最優(yōu)制球溫度。以花生油為球化介質(zhì)的BGA焊球真球度最高,氧化程度最低,表面質(zhì)量最優(yōu),球化效果最好;蓖麻油球化效果次之,釬焊球真球度為97.28%,表面略顯粗糙,含氧量為0.028wt%;機(jī)油球化效果較差,釬焊球真球度為96.85%,表面質(zhì)量差,氧化程度大;硅油球化效果最差,釬焊球真球度僅為88.67%,且表面質(zhì)量差,含氧量高。BGA焊球真球度隨球化區(qū)間的增加呈增大趨勢(shì),表面質(zhì)量先變優(yōu)后變差,含氧量逐漸升高。球化區(qū)間為600mm和700mm時(shí),焊球真球度分別為97.73%和97.85%,含氧量分別為0.009wt%和0.0093wt%,且兩者表面質(zhì)量較好,球化區(qū)間為800mm時(shí),釬焊球真球度較高,為97.87%,但表面質(zhì)量稍差,含氧量較高,綜合考慮,球化區(qū)間為600-700mm時(shí)球化效果最佳。相同工藝條件下,Sn3Ag0.5Cu焊球真球度為98.2%,含氧量為0.015wt%,釬焊球表面略顯粗糙;Sn0.7Cu焊球真球度為97.86%,含氧量為0.026wt%,釬焊球表面存在有少量凸瘤,且表面粗糙,局部區(qū)域有不同程度的氧化現(xiàn)象,表面質(zhì)量較差;63Sn37Pb焊球真球度為97.73%,含氧量為0.009wt%,焊球表面光滑平整無(wú)明顯缺陷,表面質(zhì)量較好。
[Abstract]:With the rapid development of electronic information products, integrated circuit packaging is rapidly developing to high density and intelligent mode. Ball Grid Array. Due to the birth of BGA packaging technology, electronic products have higher reliability, better thermal and electrical properties, and become the most popular packaging technology. Tin ball is the key material of BGA packaging technology. The quality of tin ball determines the packaging quality, so it is of great significance to study the production process of tin ball. In this paper, BGA solder balls are prepared by wire cutting remelting method, and the spheroidizing temperature is studied by setting different spheroidizing process parameters. The effects of spheroidizing medium and spheroidizing interval on the true sphericity, surface quality and oxygen content of BGA solder balls were investigated. The results show that the true sphericity of the BGA solder ball increases firstly and then decreases with the increase of spheroidizing temperature, and the surface quality first improves and then becomes worse, and the oxygen content increases gradually. At 300 鈩，

本文編號(hào)：1429333