【摘要】：仿金電鍍作為一種裝飾性鍍層,備受研究人員的關注。Cu-Sn合金電鍍作為代鉻鍍層已有多年的歷史,電鍍工藝成熟且鍍層抗腐蝕性良好。若應用于仿金電鍍,極具發(fā)展前景。因此,開發(fā)一種鍍液穩(wěn)定、鍍層色澤金黃且耐腐蝕性能良好的新型無氰Cu-Sn合金仿金鍍液,具有一定的社會價值和經(jīng)濟效益。若應用于實際工業(yè)生產(chǎn),意義更為重大。本論文首先通過Hull槽實驗探討了在前人實驗的基礎上改變鍍液組分實現(xiàn)無氰仿金電鍍的可行性,研究結果表明:單純地加入其它金屬無法實現(xiàn)仿金電鍍。其次,探討了不同類型電鍍添加劑對無氰Cu-Sn合金仿金電鍍的影響,發(fā)現(xiàn)添加劑二甲氨基丙胺與環(huán)氧氯丙烷縮合物(H-3)和陽離子季銨鹽(DDS)影響最為明顯。正交實驗分別確定了添加劑H-3和DDS的最佳電鍍工藝,并評價了各添加劑對仿金鍍層性能的影響。結果表明:添加劑H-3更適用于無氰Cu-Sn合金仿金電鍍,其出光速度快,鍍層光亮、平整,厚度分布均勻,耐腐蝕性能優(yōu)良。接著,以含錫量(Sn%為13~15%)為衡量標準,通過方槽實驗確定了含添加劑H-3的無氰Cu-Sn合金仿金電鍍的最佳鍍液組成及工藝條件,即Cu2P2O7·3H2O 14~22 g/L,Sn2P2O7 2.0~2.3 g/L,添加劑H-3 0.8~1.2 m L/L,K4P2O7·3H2O 240 g/L,電流密度0.7~1.0 A/dm2,電鍍時間4~8 min。通過鹽霧實驗、電化學測試、SEM等測試手段對仿金鍍層耐腐蝕性能進行表征。結果表明:無氰Cu-Sn合金仿金鍍層具有良好的耐腐蝕性能,相對于基體鐵是一種陰極保護鍍層。最后,通過掛鍍實驗探討了不同中間層(光亮鎳層、光亮酸銅、無氰白銅錫)的仿金鍍層色澤。結果表明:不同中間層的無氰Cu-Sn合金仿金電鍍均能獲得20 K仿金鍍層,以光亮鎳和無氰白銅錫中間層色澤最為金黃。考慮成本問題,本仿金電鍍體系以無氰白銅錫中間層為最佳。
[Abstract]:As a decorative coating, Cu-Sn alloy plating has been used for many years, and the plating process is mature and corrosion resistance is good. If used in imitation gold plating, it has great development prospects. Therefore, it is of certain social value and economic benefit to develop a new cyanide-free Cu-Sn alloy gold-imitating bath with stable plating solution, golden color and good corrosion resistance. If applied to actual industrial production, the significance is even greater. In this paper, the feasibility of gold imitating electroplating without cyanide by changing the composition of bath on the basis of previous experiments was discussed by Hull cell experiment. The results showed that gold imitating electroplating could not be realized by adding other metals alone. Secondly, the effect of different kinds of electroplating additives on gold imitating plating of non-cyanide Cu-Sn alloy was discussed. It was found that the additive dimethylaminopropylamine had the most obvious effect on the condensation of epichlorohydrin (H-3) and cationic quaternary ammonium salt (DDS). The optimum electroplating process of additives H-3 and DDS was determined by orthogonal experiment, and the effects of additives on the properties of gold-imitating coatings were evaluated. The results show that the additive H-3 is more suitable for gold imitating electroplating of non-cyanide Cu-Sn alloy. It has the advantages of high luminous speed, bright and smooth coating, uniform thickness distribution and excellent corrosion resistance. Then, with the standard of tin content (Sn% = 13? 15%), the optimum bath composition and process conditions of gold imitating gold plating of Cu-Sn alloy containing additive H-3 were determined by square tank experiment, that is, Cu2P2O7 3H2O 144g / L, 22 g / L, Sn2P2O7 2.0 + 2.3 g / L, additive H-3 0.8 m / L 1.2 mL / L K4P 2O 7 3H2O 240 g / L, current density 0.7 + 1.0 A / dm2, electroplating time 48 min. The corrosion resistance of gold imitated coating was characterized by salt spray test, electrochemical test and SEM. The results show that the gold imitated coating of cyanide free Cu-Sn alloy has good corrosion resistance and is a cathodic protective coating compared with the substrate iron. Finally, the color and color of different intermediate layers (bright nickel layer, bright copper acid layer, cyanide free copper tin coating) were studied by hanging plating experiment. The results showed that 20 K gold imitated coating could be obtained by gold imitating plating of cyanide free Cu-Sn alloy in different interlayers, and bright nickel and cyanide free copper tin interlayer had the most golden color. Considering the cost, the gold-imitating electroplating system is the best intermediate layer of cyanide-free copper-tin.
【學位授予單位】：華南理工大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TQ153

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