與Ca-B-Si生帶共燒的金導體漿料研究
發(fā)布時間：2018-10-17 18:35
【摘要】：基于低溫共燒陶瓷(LTCC)技術(shù)的多芯片組件(MCM)具有組裝密度高、重量輕、體積小等特點,是實現(xiàn)電子裝備高性能和小型化的有效方法之一,在軍用電子、航天航空、無線通信等領(lǐng)域具有廣泛的應用需求。制約我國LTCC技術(shù)應用的關(guān)鍵是LTCC材料,包括基板材料、導體漿料、內(nèi)埋元器件用材料等。其中與基板配套的導體漿料已經(jīng)成為亟待解決的關(guān)鍵性材料之一。論文針對軍用MCM應用需求,以與Ca-B-Si生帶匹配燒結(jié)的Au導體漿料為研究對象,系統(tǒng)研究功能相、玻璃相、有機載體對導體漿料絲網(wǎng)印刷性與匹配共燒性能的影響規(guī)律,指導金導體漿料的工程研制。論文主要工作如下:(1)借助流變儀研究了有機載體(增稠劑分子量、增稠劑含量、觸變劑種類、觸變劑含量)、功能相體積分數(shù)(φ=13%、20%、46%)、功能相粒徑(D50=0.9μm、1.8μm、3.1μm)及形貌對漿料流變性能的影響。結(jié)果表明:樹脂分子量及觸變劑含量的增加可以在漿料保持低的高剪切粘度下提高低剪切粘度;固相體積分數(shù)增大,漿料剪切粘度增加;當固相體積分數(shù)為13%時,可以忽略功能相粒徑、形貌對漿料流變性能的影響,而用銀導體漿料模擬研究金導體漿料的流變性能,獲得了線分辨率為80μm左右的金導體漿料。(2)借助表面輪廓儀、熱機械分析儀、掃描電鏡研究了功能相粒徑、粘結(jié)相組成及含量對漿料與生帶共燒后翹曲變形及厚膜導體與基板界面微觀結(jié)構(gòu)的影響。結(jié)果表明:功能相粒徑較小時,厚膜導體致密早,膜層與基板的界面處存在較多氣孔;功能相粒徑較大時,厚膜導體燒結(jié)不致密;銀粉功能相粒徑為1.8μm時,漿料與生帶的共燒匹配性最佳。燒結(jié)工藝下流動性較好的粘結(jié)相,可以促進厚膜導體燒結(jié)致密,且可以通過粘結(jié)相的移動來降低內(nèi)應力,調(diào)節(jié)共燒翹曲變形,但是厚膜導體致密早,在厚膜導體與基板的界面處留下大量氣孔。燒結(jié)工藝下流動性較差的粘結(jié)相,其將在一定程度上阻礙固相致密化的進行,可以為基板致密時氣體的排放提供較多的時間,但不能根據(jù)其位置變化調(diào)節(jié)共燒翹曲變形。(3)研究了功能相粒徑、粘結(jié)相組成及含量對漿料與生帶共燒后厚膜導體表面微觀結(jié)構(gòu)及粗糙度的影響。結(jié)果表明:功能相粒徑對厚膜導體表面粘結(jié)相的分布無明顯影響,但是隨著功能相粒徑的減小,厚膜導體表面粗糙度下降。采用流動性好的粘結(jié)相時,燒結(jié)后的厚膜導體表面致密且存在較多的粘結(jié)相,粘結(jié)相以葉片狀凸起存在時會增大厚膜導體的表面粗糙度。粘結(jié)相含量增加,燒結(jié)后厚膜導體表面的粘結(jié)相增加。(4)根據(jù)銀導體漿料的研究結(jié)果,優(yōu)選出了金粉功能相粒徑、有機載體配方、粘結(jié)相組成及含量,制備得到共燒匹配性能、絲焊性能良好的金導體漿料。
[Abstract]:Multichip (MCM) based on low temperature co-fired ceramic (LTCC) technology has the characteristics of high density, light weight and small volume. It is one of the effective methods to realize high performance and miniaturization of electronic equipment. Wireless communication and other fields have a wide range of applications. The key to the application of LTCC technology in China is the LTCC material, including substrate material, conductor paste material, embedded component material and so on. Among them, the conductor paste matched with the substrate has become one of the key materials to be solved. In order to meet the requirement of military MCM application, this paper studies the effect of functional phase, glass phase and organic carrier on the screen printing property and matching co-firing performance of the conductive paste, which is sintered with the Ca-B-Si belt, and the functional phase, glass phase and organic carrier are systematically studied. To guide the engineering development of gold conductor slurry. The main work of this paper is as follows: (1) the effects of organic carrier (thickener molecular weight, thickener content, thixotropic agent type, thixotropic agent content), functional phase volume fraction (蠁 = 1320%), functional phase particle size (D500.9 渭 m, 1.8 渭 m, 3.1 渭 m) and morphology on rheological properties of slurry were studied by means of rheometer. The results show that the increase of molecular weight of resin and thixotropic agent content can increase the low shear viscosity with low shear viscosity of the slurry, increase the volume fraction of solid phase, increase the shear viscosity of the slurry, and when the volume fraction of solid phase is 13, The influence of the particle size and morphology of functional phase on the rheological properties of the slurry can be ignored. The rheological properties of the gold conductor slurry are simulated with silver conductor slurry, and the gold conductor slurry with a linear resolution of about 80 渭 m is obtained. (2) with the aid of the surface profiler, The effects of particle size of functional phase, composition and content of bonding phase on the warpage and microstructure of the interface between thick film conductor and substrate after co-firing of slurry and raw strip were studied by scanning electron microscope (SEM). The results show that when the particle size of the functional phase is small, the thick film conductor is densified early, there are more pores at the interface between the film and the substrate, when the particle size of the functional phase is larger, the thick film conductor is not dense, and the particle size of the silver powder is 1.8 渭 m. The best matching property of co-firing between slurry and raw belt is obtained. The bonding phase with better fluidity under sintering process can promote the sintering densification of thick film conductor, and can reduce the internal stress and adjust the warpage deformation of co-firing by moving the bonding phase, but the thick film conductor is densified early. A large number of pores are left at the interface between the thick film conductor and the substrate. The bonding phase with poor fluidity under sintering process will hinder the solid phase densification to a certain extent and can provide more time for gas emission when the substrate is densified. But the warpage deformation of co-firing can not be adjusted according to the change of its position. (3) the effects of the particle size of functional phase, the composition and content of bonding phase on the microstructure and roughness of thick film conductor after co-firing of slurry and raw band are studied. The results show that the particle size of the functional phase has no effect on the distribution of the adhesive phase on the surface of the thick film conductor, but the roughness of the thick film conductor decreases with the decrease of the particle size of the functional phase. When good fluidity bonding phase is used, the surface of sintered thick film conductor is compact and there are many bonding phases, and the surface roughness of thick film conductor will be increased when the bonding phase exists as vane bulge. The content of binder phase increased and the bonding phase of thick film conductor surface increased after sintering. (4) according to the results of the research on silver conductor paste, the particle size of functional phase of gold powder, the formula of organic carrier, the composition and content of binder phase were selected, and the co-firing matching property was obtained. Gold conductor paste with good wire welding performance.
【學位授予單位】：國防科學技術(shù)大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TQ174.6
本文編號：2277590
[Abstract]:Multichip (MCM) based on low temperature co-fired ceramic (LTCC) technology has the characteristics of high density, light weight and small volume. It is one of the effective methods to realize high performance and miniaturization of electronic equipment. Wireless communication and other fields have a wide range of applications. The key to the application of LTCC technology in China is the LTCC material, including substrate material, conductor paste material, embedded component material and so on. Among them, the conductor paste matched with the substrate has become one of the key materials to be solved. In order to meet the requirement of military MCM application, this paper studies the effect of functional phase, glass phase and organic carrier on the screen printing property and matching co-firing performance of the conductive paste, which is sintered with the Ca-B-Si belt, and the functional phase, glass phase and organic carrier are systematically studied. To guide the engineering development of gold conductor slurry. The main work of this paper is as follows: (1) the effects of organic carrier (thickener molecular weight, thickener content, thixotropic agent type, thixotropic agent content), functional phase volume fraction (蠁 = 1320%), functional phase particle size (D500.9 渭 m, 1.8 渭 m, 3.1 渭 m) and morphology on rheological properties of slurry were studied by means of rheometer. The results show that the increase of molecular weight of resin and thixotropic agent content can increase the low shear viscosity with low shear viscosity of the slurry, increase the volume fraction of solid phase, increase the shear viscosity of the slurry, and when the volume fraction of solid phase is 13, The influence of the particle size and morphology of functional phase on the rheological properties of the slurry can be ignored. The rheological properties of the gold conductor slurry are simulated with silver conductor slurry, and the gold conductor slurry with a linear resolution of about 80 渭 m is obtained. (2) with the aid of the surface profiler, The effects of particle size of functional phase, composition and content of bonding phase on the warpage and microstructure of the interface between thick film conductor and substrate after co-firing of slurry and raw strip were studied by scanning electron microscope (SEM). The results show that when the particle size of the functional phase is small, the thick film conductor is densified early, there are more pores at the interface between the film and the substrate, when the particle size of the functional phase is larger, the thick film conductor is not dense, and the particle size of the silver powder is 1.8 渭 m. The best matching property of co-firing between slurry and raw belt is obtained. The bonding phase with better fluidity under sintering process can promote the sintering densification of thick film conductor, and can reduce the internal stress and adjust the warpage deformation of co-firing by moving the bonding phase, but the thick film conductor is densified early. A large number of pores are left at the interface between the thick film conductor and the substrate. The bonding phase with poor fluidity under sintering process will hinder the solid phase densification to a certain extent and can provide more time for gas emission when the substrate is densified. But the warpage deformation of co-firing can not be adjusted according to the change of its position. (3) the effects of the particle size of functional phase, the composition and content of bonding phase on the microstructure and roughness of thick film conductor after co-firing of slurry and raw band are studied. The results show that the particle size of the functional phase has no effect on the distribution of the adhesive phase on the surface of the thick film conductor, but the roughness of the thick film conductor decreases with the decrease of the particle size of the functional phase. When good fluidity bonding phase is used, the surface of sintered thick film conductor is compact and there are many bonding phases, and the surface roughness of thick film conductor will be increased when the bonding phase exists as vane bulge. The content of binder phase increased and the bonding phase of thick film conductor surface increased after sintering. (4) according to the results of the research on silver conductor paste, the particle size of functional phase of gold powder, the formula of organic carrier, the composition and content of binder phase were selected, and the co-firing matching property was obtained. Gold conductor paste with good wire welding performance.
【學位授予單位】：國防科學技術(shù)大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TQ174.6
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