【摘要】：在以5,5'-二甲基已內(nèi)酰脲(DMH)為配位劑的鍍液體系中研究了添加劑C_4H_6O_2、C_7H_4NNa O_3S和C_(12)H_(25)SO_4Na對(duì)金電沉積工藝和電結(jié)晶過程的影響。陰極極化曲線測(cè)試中,金電沉積的最佳電勢(shì)區(qū)間是-0.60~-1.2V,添加劑濃度在研究的范圍內(nèi)對(duì)陰極極化電勢(shì)的影響較小。循環(huán)伏安曲線結(jié)果表明,反應(yīng)界面上添加劑的吸附能夠影響成核生長超電勢(shì),對(duì)金還原過程表現(xiàn)出抑制作用。電化學(xué)阻抗譜研究表明,鍍液中加入添加劑后,電荷轉(zhuǎn)移過程變得更加困難。SEM觀察表明,添加劑改善了鍍層質(zhì)量,晶粒變得細(xì)致、均勻。XRD分析證實(shí),兩種鍍液體系中獲得的鍍金層都沿著Au(111)和(220)晶面擇優(yōu)生長。
[Abstract]:The effects of additive C4H6O2S / C7H4NNaO3S and C12H25H25 SO_4Na on the electrodeposition process and electrocrystallization process of gold were studied in the plating bath system with 5-dimethylhexanoylurea (DMH) as the coordination agent, and the effects of the additives C4H6O2S and C7H4NNaO3S and C12H25 SO_4Na on the electrodeposition process and the electrocrystallization process of gold were studied. In the measurement of cathodic polarization curve, the optimum potential range of gold electrodeposition is -0.60 ~ 1.2V, and the concentration of additive has little effect on the cathodic polarization potential in the range of study. The results of cyclic voltammetry show that the adsorption of additives at the reaction interface can affect the superpotential of nucleation growth and inhibit the gold reduction process. Electrochemical impedance spectroscopy (EIS) showed that the charge transfer process became more difficult after the addition of additives in the bath. SEM observation showed that the additive improved the quality of the coating, and the grain size became fine and uniform. XRD analysis confirmed that, The gold-plated coatings obtained in both bath systems are preferred along the crystal planes of Au (111) and (220).
【作者單位】： 中國工程物理研究院電子工程研究所;哈爾濱工業(yè)大學(xué)化工學(xué)院;
【基金】：中國工程物理研究院科學(xué)技術(shù)發(fā)展基金(2014B0302043)
【分類號(hào)】：TQ153.18

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