發(fā)布時(shí)間：2018-07-16 16:32

【摘要】：采用了熱壓-陽(yáng)極鍵合復(fù)合連接工藝對(duì)B270玻璃/TC4鈦合金進(jìn)行連接,分析了真空熱壓參數(shù)對(duì)B270玻璃/TC4鈦合金連接界面結(jié)構(gòu)、結(jié)合效果的影響,并研究了B270玻璃/TC4鈦合金的陽(yáng)極鍵合工藝,分析了不同鍵合工藝參數(shù)下的工藝特征。結(jié)果表明,當(dāng)對(duì)應(yīng)的真空熱壓參數(shù)為:T=750℃,t=2 h,P=0.5 MPa,當(dāng)鍵合溫度T在350~550℃,電場(chǎng)電壓V在500~700 V時(shí),有最佳的連接效果。鍵合界面結(jié)構(gòu)分析發(fā)現(xiàn),整個(gè)鍵合區(qū)域是由玻璃-中間過(guò)渡層-TC4鈦合金的結(jié)構(gòu)組成,界面兩側(cè)的化學(xué)元素呈梯度分布。
[Abstract]:B270 glass / TC4 titanium alloy was bonded by hot pressing and anodic bonding process. The effect of vacuum hot pressing parameters on the interface structure and bonding effect of B270 glass / TC4 titanium alloy was analyzed. The anodic bonding process of B270 glass / TC4 titanium alloy was studied, and the process characteristics of B270 glass / TC4 titanium alloy under different bonding parameters were analyzed. The results show that the optimal bonding effect is obtained when the corresponding vacuum hot pressing parameters are as follows: 1: TX 750 鈩，

本文編號(hào)：2126968