【摘要】：隨著制造領(lǐng)域不斷向微型化推進(jìn),微型零件的需求日益增加。銅箔成形性能優(yōu)良,經(jīng)微氣壓脹形可以獲得結(jié)構(gòu)微小、形狀復(fù)雜的零部件,特別是微機(jī)電系統(tǒng)部件,其中電鑄是一種常見的銅箔制備方法。微氣壓脹形作為微成形技術(shù)之一,成形精度高、少無回彈、可一次成形復(fù)雜零件,受到越來越多關(guān)注。提高坯料厚度均勻性與性能均一性有助于提高微氣壓脹形件的質(zhì)量。因此開展電鑄銅箔的厚度均勻性與性能均一性研究,并進(jìn)行微氣壓脹形工藝探索,對于發(fā)展微成形技術(shù)具有重要的理論意義和實(shí)用價值。本文研究了占空比、電流密度、電源屬性及電鑄時間四個因素對電鑄銅箔材均勻性的影響,并用正交實(shí)驗(yàn)法優(yōu)化了工藝,確定了制備出均勻性良好銅箔材的工藝。采用該工藝制備的銅箔作為微氣壓脹形原材料,研究了電鑄銅箔各位置內(nèi)應(yīng)力、組織和拉伸性能差異,后采用正交試驗(yàn)法研究脹形溫度、壓力和熱處理工藝對極限脹形高度的影響以獲得最優(yōu)參數(shù)。本文主要結(jié)論如下:成功制備出具有均勻性良好的銅箔,均勻性優(yōu)于現(xiàn)有文獻(xiàn)報導(dǎo)。電鑄最優(yōu)工藝為采用雙脈沖電源,正向占空比30%,負(fù)向占空比10%,電流密度為2A/dm2,電鑄時間92min;CV值最低達(dá)到1.54%。厚度呈現(xiàn)位置51234的規(guī)律性。本論文采用雙脈沖電流制備的銅箔各位置內(nèi)應(yīng)力差異顯著,微觀組織基本相同。電鑄銅箔純度高、強(qiáng)度高、塑性差。厚度相同時,其抗拉強(qiáng)度高于現(xiàn)有文獻(xiàn)報導(dǎo)�？估瓘�(qiáng)度存在位置效應(yīng),與不同位置晶粒的擇優(yōu)取向有很大關(guān)系。(111)和(200)織構(gòu)能提升銅箔的抗拉強(qiáng)度;(220)織構(gòu)會降低銅箔的抗拉強(qiáng)度。熱處理工藝對極限脹形高度影響最大,不經(jīng)過熱處理的原始組織晶粒細(xì)小,脹形高度最高。脹形最優(yōu)工藝為不經(jīng)過熱處理原料、脹形溫度450℃C、壓力2.4MPa。
[Abstract]:With the development of miniaturization in manufacturing field, the demand for micro-parts is increasing day by day. Copper foil has good formability, and parts with small structure and complicated shape can be obtained by micropneumatic bulging, especially micro electromechanical system. Electroforming is a common method of copper foil preparation. As one of the micro forming technologies, micro pressure bulging has attracted more and more attention because of its high precision and little springback, which can be used to form complex parts at one time. Improving the uniformity of blank thickness and property is helpful to improve the quality of micropneumatic bulging parts. Therefore, it is of great theoretical significance and practical value to study the uniformity of thickness and properties of electroforming copper foil and to explore the micro-pressure bulging process. In this paper, the effects of duty cycle, current density, power properties and electroforming time on the uniformity of electroforming copper foil are studied. The process of preparing copper foil with good uniformity is determined by orthogonal experiment. The stress, microstructure and tensile properties of electroforming copper foil were studied by using the copper foil prepared by this process as the raw material of micro-pressure bulging, and then the bulging temperature was studied by orthogonal test. The effect of pressure and heat treatment process on the limit bulging height to obtain the optimal parameters. The main conclusions are as follows: copper foil with good homogeneity is successfully prepared, and the uniformity is better than that reported in the literature. The optimum process of electroforming is to adopt double pulse power supply, the positive duty cycle is 30, the negative duty cycle is 10, the current density is 2A / dm ~ 2, and the electroforming time is 92 min CV is the lowest 1.54. The thickness shows the regularity of position 51234. In this paper, the internal stress of copper foil prepared by double pulse current has significant difference, and the microstructure of copper foil is basically the same. High purity, high strength and poor plasticity of electroforming copper foil. When the thickness is the same, the tensile strength is higher than that reported in the existing literature. The tensile strength has a position effect, which is related to the preferred orientation of grain in different position. (111) and (200) texture can increase the tensile strength of copper foil, (220) texture can reduce the tensile strength of copper foil. The effect of heat treatment process on the ultimate bulging height is the greatest, the original microstructure without heat treatment is fine, and the bulging height is the highest. The optimum bulging process is that the bulging temperature is 450 鈩，

本文編號：2124662