本文選題：苯酚磺酸電鍍錫 + 低錫板��； 參考：《哈爾濱工業(yè)大學(xué)》2017年碩士論文

【摘要】：國(guó)際市場(chǎng)上錫資源日益緊張,減小鍍錫板鍍錫量已經(jīng)成為鍍錫工藝的發(fā)展趨勢(shì)。但鍍錫量的下降往往帶來鍍錫板可焊性和耐蝕性的下降。本文試圖開發(fā)出直接島狀錫和鎳系島狀錫兩套新型的鍍錫工藝,島狀錫鍍錫板屬于低錫板,但由于其凸起的結(jié)構(gòu),在相同鍍錫量下島狀錫軟熔后表現(xiàn)出優(yōu)于常規(guī)低錫板的性能,所以島狀錫鍍錫板是一種具有很大發(fā)展前景的低錫板種類。本文主要對(duì)苯酚磺酸體系電鍍島狀錫的工藝及其形成機(jī)理進(jìn)行研究,通過SEM,電化學(xué)工作站等方法,確定了直接島狀錫和鎳系島狀錫的工藝參數(shù),并考察了其軟熔后的焊接性能與耐蝕性能。通過電化學(xué)工作站研究了兩種島狀錫的成核過程。在使用低添加劑濃度和電流密度的情況下成功制備出直接島狀錫,其工藝參數(shù)為:SnSO4濃度為51g/L,添加劑EN+ENSA(α-氧基-萘+α-萘酚磺酸聚氧乙烯醚)濃度為0.5g/L,電鍍電流密度為1.4A/dm2。SEM測(cè)試顯示直接島狀錫顆粒粒徑在微米級(jí),最小粒徑為0.64μm,最大粒徑為3.64μm,平均粒徑為1.95μm,錫的覆蓋度為53%。鍍錫量測(cè)試結(jié)果表明,直接島狀錫在使用高頻感應(yīng)軟熔儀軟熔后自由錫含量維持在0.3g/m2以上,利于焊接。在閃鍍鎳經(jīng)過熱處理后的基體上制備出鎳系島狀錫,其工藝參數(shù)為:閃鍍鎳含量為0.05g/m2,熱處理的溫度為450℃,熱處理的時(shí)間為45s,SnSO4濃度為51g/L,添加劑EN+ENSA濃度為5g/L,電鍍電流密度為2.8A/dm2。SEM測(cè)試顯示鎳系島狀錫錫顆粒粒徑在微米級(jí),平均粒徑為1.65μm,錫的覆蓋度為41%;Tafel曲線和阻抗測(cè)試顯示鎳系島狀錫耐蝕性優(yōu)于常規(guī)低錫板和直接島狀錫,電化學(xué)測(cè)試顯示其在軟熔后自由錫含量維持在0.3g/L以上,可焊性優(yōu)于常規(guī)低錫板。對(duì)鍍錫層錫顆粒沉積處與露鐵處分別進(jìn)行EDS元素分布測(cè)試,測(cè)試結(jié)果表明,與貧碳區(qū)相比,富碳區(qū)為直接島狀錫沉積的活性區(qū)域,直接島狀錫在形成過程更接近于瞬時(shí)成核,鐵基體在苯酚磺酸鍍錫體系中錫的沉積過程為擴(kuò)散控制。與鍍鎳量少的地方相比,鍍鎳量多的的地方為鎳系島狀錫沉積的活性區(qū)域,鎳系島狀錫在形成過程更接近于瞬時(shí)成核,鎳經(jīng)熱擴(kuò)散處理后的基體在苯酚磺酸鍍錫體系中錫的沉積過程為擴(kuò)散控制。
[Abstract]:Tin resources are becoming increasingly scarce in the international market, and reducing tin plating on tin plate has become the development trend of tin plating process. However, the solderability and corrosion resistance of tinplate decrease with the decrease of tin plating amount. In this paper, two new tin plating processes, direct island tin and nickel island tin, are developed. The island tin plating plate belongs to low tin plate, but due to its raised structure, the island tin soft melting performance is superior to that of conventional low tin plate under the same amount of tin plating. Therefore, island tin plating plate is a kind of low tin plate with great development prospect. In this paper, the process and formation mechanism of island tin electroplating with phenol sulfonic acid system were studied. By means of SEM and electrochemical workstation, the technological parameters of direct island tin and nickel island tin were determined. The welding and corrosion resistance of the soft melt were investigated. The nucleation process of two kinds of island tin was studied by electrochemical workstation. Direct island tin was successfully prepared with low additive concentration and current density. The technological parameters are as follows: the concentration of SnSO4 is 51g / L, the concentration of additive en ENSA is 0.5g / L, the current density of electroplating is 1.4A / dm2.SEM test shows that the particle size of direct island tin particles is in micron order. The minimum particle size is 0.64 渭 m, the maximum particle size is 3.64 渭 m, the average particle size is 1.95 渭 m, and the covering degree of tin is 53 渭 m. The results of tin plating test show that the free tin content of direct island tin is above 0.3g/m2 after soft melting with high frequency induction soft melt, which is favorable for welding. The nickel insular tin was prepared on the substrate after heat treatment. The technological parameters were as follows: the content of nickel plating was 0.05g / m ~ 2, the temperature of heat treatment was 450 鈩，

本文編號(hào)：1994771