本文選題：單顆磨粒磨削 + SiC陶瓷��； 參考：《南京航空航天大學》2017年碩士論文

【摘要】：SiC陶瓷磨削加工對成形精度和表面完整性有著極高要求。針對SiC陶瓷的硬脆特性,采用大粒徑金剛石的單層釬焊砂輪,具有較大的容屑空間和較高的磨粒把持力,在提高加工效率和減少工具磨損方面有著巨大優(yōu)勢。目前,關于SiC陶瓷的磨削機理研究,一般使用單顆磨粒磨削方法,但現(xiàn)有的研究方法不能夠真實反映實際磨削過程。本文采用單顆磨粒釬焊砂輪,表征砂輪表面實際磨粒形態(tài),同時通過控制磨削工藝參數(shù),模擬磨粒實際運動軌跡。在此基礎上,研究磨削參數(shù)和磨粒形狀對SiC磨削加工的影響,對于提高磨削表面質(zhì)量,以及減少磨削損傷有著重要意義。主要內(nèi)容如下:(1)基于有限元分析軟件,研究裂紋擴展形式,應力應變場及溫度場的分布,并建立SiC陶瓷去除方式與應力形式之間的定性關系。結(jié)合磨削力仿真結(jié)果,初步選取相關工藝參數(shù)用于單顆磨粒磨削試驗。(2)設計和制作單顆磨粒砂輪裝置,開展單顆磨粒磨削試驗。對比分析磨削速度和單顆磨粒最大切厚對SiC磨削加工的影響。測量磨削力并計算磨削比能,觀測磨痕表面形貌和亞表面損傷。(3)基于“最小二乘法”,擬合計算金剛石磨粒刃圓半徑。對比分析刃圓半徑變化對SiC磨削加工的影響。研究刃圓半徑與實際磨削前角之間的關系,及其對脆延轉(zhuǎn)變的影響。(4)基于磨粒磨損不同形式,建立SiC陶瓷材料累積去除量與金剛石磨粒磨損量之間的定量關系。研究磨粒磨損對磨痕表面質(zhì)量和磨削力的影響。
[Abstract]:SiC ceramic grinding has high requirements for forming accuracy and surface integrity. According to the hardness and brittleness of SiC ceramics, the single-layer brazed grinding wheel with large diameter diamond has great advantages in improving machining efficiency and reducing tool wear because of its large chip-holding space and high abrasive holding force. At present, the grinding mechanism of SiC ceramics is generally studied by single particle grinding method, but the existing research methods can not reflect the actual grinding process. In this paper, a single abrasive soldering wheel is used to characterize the actual abrasive particle shape on the surface of the grinding wheel, and the actual motion trajectory of the abrasive particle is simulated by controlling the grinding process parameters. On this basis, it is of great significance to study the effect of grinding parameters and particle shape on SiC grinding process, which is of great significance to improve the surface quality of grinding and reduce grinding damage. The main contents are as follows: (1) based on the finite element analysis software, the distribution of crack propagation, stress-strain field and temperature field is studied, and the qualitative relationship between the removal mode of SiC ceramics and the stress form is established. According to the simulation results of grinding force, the relevant parameters are selected to design and manufacture a single abrasive grinding wheel device, and to carry out a single abrasive grinding test. The effects of grinding speed and maximum cutting thickness of single grain on SiC grinding are analyzed. The grinding force was measured and the grinding specific energy was calculated. The surface morphology and subsurface damage were observed. Based on the "least square method", the diamond abrasive edge radius was fitted and calculated. The influence of the radius of the edge circle on the SiC grinding process is compared and analyzed. The relationship between the radius of the edge and the actual grinding angle and its effect on brittle ductility transition are studied. (4) based on the different wear patterns of abrasive particles, the quantitative relationship between the cumulative removal amount of SiC ceramic materials and the wear rate of diamond particles is established. The effects of abrasive wear on the surface quality and grinding force of wear mark were studied.
【學位授予單位】：南京航空航天大學
【學位級別】：碩士
【學位授予年份】：2017
【分類號】：TQ174.6

【參考文獻】

相關期刊論文 前10條

1 劉偉;鄧朝暉;萬林林;趙小雨;皮舟;;單顆金剛石磨粒切削氮化硅陶瓷仿真與試驗研究[J];機械工程學報;2015年21期

2 張貝;傅玉燦;蘇宏華;;單層釬焊金剛石砂輪的修整實驗研究[J];中國機械工程;2014年13期

3 戴逢明;蘇宏華;張昆;傅玉燦;徐九華;;粗磨粒金剛石砂輪精密磨削工程陶瓷的試驗研究[J];金剛石與磨料磨具工程;2014年01期

4 王健全;田欣利;張保國;王朋曉;;單顆粒金剛石劃擦Si_3N_4陶瓷的磨削力研究[J];現(xiàn)代制造工程;2013年08期

5 王海燕;李旭升;歷長云;;SiC相變和熱動力學性質(zhì)的第一性原理計算(英文)[J];四川大學學報(自然科學版);2010年05期

6 沈琳燕;李蓓智;楊建國;;光學玻璃磨削機理的仿真研究[J];制造技術與機床;2010年02期

7 林思煌;黃輝;徐西鵬;;單顆金剛石劃擦玻璃的實驗研究[J];金剛石與磨料磨具工程;2008年05期

8 王星;賀子杏;趙波;;計算機仿真磨削溫度場的研究現(xiàn)況及發(fā)展趨勢[J];精密制造與自動化;2008年03期

9 謝桂芝;黃紅武;黃含;盛曉敏;宓海青;熊萬里;;工程陶瓷材料高效深磨的試驗研究[J];機械工程學報;2007年01期

10 張璧,孟鑒;工程陶瓷磨削加工損傷的探討[J];納米技術與精密工程;2003年01期

相關博士學位論文 前2條

1 田霖;基于磨粒有序排布砂輪的高速磨削基礎研究[D];南京航空航天大學;2013年

2 李曙生;新型單層釬焊金剛石砂輪磨削工程陶瓷的基礎研究[D];南京航空航天大學;2008年

，

本文編號：1852565