本文選題：激光刻蝕 + 等離子體�。� 參考：《溫州大學(xué)》2017年碩士論文

【摘要】：由于Pyrex7740玻璃(一種硼硅酸鹽玻璃)具有良好的生物適應(yīng)性、高的熱阻和電絕緣性能、優(yōu)良的光學(xué)性能,在一定溫度內(nèi)熱膨脹系數(shù)與硅非常接近,并且含有適量的Na+和K+,非常適合與硅片進(jìn)行陽(yáng)極鍵合,因而越來(lái)越多的應(yīng)用于生物、射頻、光學(xué)等MEMS器件,微傳感器和封裝技術(shù)等領(lǐng)域。隨著微機(jī)電系統(tǒng)(micro-electro-mechanical-system, MEMS)研究和應(yīng)用的快速發(fā)展,MEMS器件對(duì)封裝的可靠性、器件的互聯(lián)和尺寸精度的要求越來(lái)越高。因此對(duì)Pyrex7740玻璃的加工精度和表面質(zhì)量提出了非常高的加工要求。但由于Pyrex7740玻璃屬于硬脆材料,具有脆性高,斷裂韌性低,材料的彈性極限和強(qiáng)度極限非常接近。當(dāng)材料所承受的載荷超過(guò)強(qiáng)度極限時(shí)就會(huì)發(fā)生斷裂破壞,在已加工玻璃表面產(chǎn)生裂紋和崩邊,嚴(yán)重影響Pyrex7740玻璃表面質(zhì)量和性能。到目前為止,該材料的精密加工仍然是一件困難的事情。本論文針對(duì)目前采用激光直寫加工Pyrex7740玻璃要求能量密度閾值太高,采用其他方法加工則存在加工精度低、易崩邊、刻蝕深寬比小、易引入污染雜質(zhì)和加工效率低等問(wèn)題,提出了一種水輔助激光誘導(dǎo)等離子體背部刻蝕Pyrex7740玻璃的新方法。通過(guò)加工試驗(yàn)和理論分析探究了激光能量密度、激光加工次數(shù)對(duì)平均刻蝕深度的影響,以及刻蝕過(guò)程中去離子水的作用。實(shí)驗(yàn)結(jié)果表明:平均刻蝕深度與激光能量密度和激光加工次數(shù)有較大的關(guān)系;只有在有去離子水輔助的情況下才能實(shí)現(xiàn)持續(xù)刻蝕,在沒(méi)有去離子水輔助的情況下,激光能量密度為3.4 J/cm2時(shí),能刻蝕的最大深度為2.8 μm。通過(guò)控制變量法研究了激光能量密度、加工速度、重復(fù)頻率、刻蝕次數(shù)等激光加工參數(shù)對(duì)水輔助激光誘導(dǎo)等離子體刻蝕Pyrex7740玻璃刻蝕質(zhì)量(包括邊緣是否齊整、崩邊、碎裂等)的影響規(guī)律。最后,選擇合適的加工參數(shù),成功制備了溝槽寬度為77.8μm,刻蝕深度為20.4μm,刻蝕邊緣齊整無(wú)明顯崩邊現(xiàn)象,槽底光滑的縮小型十字通道微流控芯片。同時(shí),本論文提出的水輔助激光誘導(dǎo)等離子體刻蝕Pyrex7740玻璃工藝,也可以應(yīng)用在石英玻璃、水晶、透明陶瓷等其他光學(xué)透明介質(zhì)的微結(jié)構(gòu)刻蝕上,有望在MEMS器件的制造和封裝技術(shù)領(lǐng)域得到廣泛的應(yīng)用。
[Abstract]:Because Pyrex7740 glass (a borosilicate glass) has good biological adaptability, high thermal resistance and electrical insulation, excellent optical properties, at a certain temperature the thermal expansion coefficient is very close to silicon, and contains a proper amount of Na and K,It is very suitable for anode bonding with silicon wafer, so it is more and more used in biology, radio frequency, optics and other MEMS devices, microsensors and packaging technology and so on.With the rapid development of research and application of micro-electro-mechanical system (MEMSs), the requirements of packaging reliability, interconnection and dimensional accuracy of MEMS devices are becoming higher and higher.Therefore, the machining accuracy and surface quality of Pyrex7740 glass are very high.However, because Pyrex7740 glass is a hard brittle material with high brittleness and low fracture toughness, the elastic limit and strength limit of the material are very close.When the load of the material exceeds the strength limit, the fracture will occur, and cracks and breakdowns will occur on the surface of the processed glass, which will seriously affect the surface quality and properties of the Pyrex7740 glass.Up to now, the precise processing of this material is still a difficult task.In this paper, the energy density threshold is too high for Pyrex7740 glass fabricated by laser direct-writing, but other processing methods have some problems, such as low machining precision, easy breakage, low ratio of etching depth to width, easy introduction of contaminated impurities and low processing efficiency.A new water-assisted laser-induced plasma back etching method for Pyrex7740 glass is proposed.The effects of laser energy density, laser processing times on the average etching depth and the role of deionized water in the etching process were investigated through processing experiments and theoretical analysis.The experimental results show that the average etching depth is closely related to the laser energy density and laser processing times, and that the continuous etching can be realized only with the aid of deionized water, and without the aid of deionized water,When the laser energy density is 3.4 J/cm2, the maximum depth of energy etching is 2.8 渭 m.The effect of laser processing parameters, such as laser energy density, processing speed, repetition rate and etching times, on the etching quality of water-assisted laser-induced plasma etching of Pyrex7740 glass was studied by controlling variable method.The law of influence of fragmentation, etc.Finally, a narrow cross channel microfluidic chip with a groove width of 77.8 渭 m and a etching depth of 20.4 渭 m was successfully fabricated with suitable machining parameters.At the same time, the water-assisted laser-induced plasma etching process proposed in this paper can also be applied to the microstructure etching of quartz glass, crystal, transparent ceramics and other optical transparent media.It is expected to be widely used in manufacturing and packaging of MEMS devices.
【學(xué)位授予單位】：溫州大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TQ171.6

【參考文獻(xiàn)】

相關(guān)期刊論文 前10條

1 魯建英;耿德s，

本文編號(hào)：1764284