本文選題：無氰 + 堿性鍍銅��； 參考：《電鍍與環(huán)保》2017年04期

【摘要】：研究出一種鈦合金無氰堿性鍍銅工藝。通過實(shí)驗(yàn),確定了最佳的鍍液配方及工藝條件為:CuSO_4·5H_2O 25~30g/L,KOH 90~100g/L,K_2CO_3 30~50g/L,DS116添加劑110~130mL/L,pH值9.0~10.5,電流密度0.5~4.0A/dm~2,溫度40~60℃。同時(shí),對鍍層和鍍液的性能進(jìn)行了測試。
[Abstract]:A cyanide free alkaline copper plating process for titanium alloy was studied.The optimum solution formula and process conditions were determined as follows: 1 CuSOS 4 5H_2O 25g / L KOH 90 g / L C / L K2CO3 30 / 50 g / L DS-116 additive 11010mL / L DS-116, pH value 9.0mL / L, current density 0.54.0Ar / dmm-2, temperature 4060 鈩，

本文編號：1751422