本文選題：電鑄　切入點(diǎn)：模具　出處：《廣東工業(yè)大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：微流控芯片可應(yīng)用于微檢測、藥物輸送(微型泵,微針)、工業(yè)和環(huán)境分析裝置、制藥和生命科學(xué)研究、食品檢測、新材料制備,市場需求潛力巨大。作為微流控技術(shù)的重要載體,微流控芯片是在幾平方厘米的芯片上構(gòu)建化學(xué)或生物實(shí)驗(yàn)室,具有費(fèi)用低、效率高、便攜性好、準(zhǔn)確度高等優(yōu)點(diǎn)。但目前微流控芯片的產(chǎn)業(yè)化成本相對較高,基于熱壓成型、注塑成型的模具成型工藝是解決微流控芯片大批量制造難題的重要方法,而制造加工出含有大規(guī)模微結(jié)構(gòu)的精密微流控芯片模具是該技術(shù)的關(guān)鍵所在,電鑄作為一種低成本的大面積微結(jié)構(gòu)制造技術(shù),可用于微流控芯片金屬模具的制備。結(jié)合微流控芯片金屬模具加工工藝要求,制定了照相制版技術(shù)、化學(xué)蝕刻技術(shù)和電鑄技術(shù)相結(jié)合的工藝方法。通過對被加工件進(jìn)行光刻處理來制作掩膜,然后進(jìn)行化學(xué)蝕刻和電鑄成型來加工微流控芯片金屬模具�；瘜W(xué)蝕刻采用噴淋蝕刻機(jī)床,電鑄實(shí)驗(yàn)平臺通過PID控制方式來實(shí)現(xiàn)對溫度的精確控制,陰極工裝夾具設(shè)計(jì)了軌跡式運(yùn)動(dòng),提高電鑄鑄層的均勻性。圍繞電鑄工藝,研究了電鑄陰極平動(dòng)、陰極電流密度、掩膜厚度、二次輔助陰極等方面對微流控芯片金屬模具電鑄成型微結(jié)構(gòu)側(cè)壁陡直度和鑄層均勻性的影響。實(shí)驗(yàn)設(shè)計(jì)的含有外加電勢二次輔助陰極的三電極電鑄體系可以提高鑄層的均勻性。針對電鑄工藝因素較為復(fù)雜的問題,以鑄前蝕刻深度、溫度、掩膜厚度和陰極電流密度為重點(diǎn)工藝因素,進(jìn)行正交實(shí)驗(yàn),得到優(yōu)化的實(shí)驗(yàn)工藝方案。研究對比了化學(xué)微蝕刻法和微細(xì)電鑄法制備微流控芯片金屬模具。化學(xué)微蝕刻法制備的模具微結(jié)構(gòu)側(cè)壁呈不規(guī)則弧形、尺寸均勻性相對較差,表面粗糙度較大(Ra3.58μm)。而微細(xì)電鑄法制備的模具微結(jié)構(gòu)的側(cè)壁呈規(guī)則的梯形、尺寸均勻性好、表面粗糙度較低(Ra 0.65 μm)。綜合比較,微細(xì)電鑄法制備的微流控芯片金屬模具在微結(jié)構(gòu)的側(cè)壁陡度、尺寸均勻性和粗糙度方面比化學(xué)微蝕刻好。采用控制電鑄過程電源脈沖頻率、脈沖波形的實(shí)驗(yàn)方案,進(jìn)行微流控芯片模具流道表面微納結(jié)構(gòu)制備的初步工藝研究,較高的頻率和一定的脈沖波形可以制備得到具有一定尺寸表面微納結(jié)構(gòu)的芯片微流道。
[Abstract]:Microfluidic chips can be used for microdetection, drug delivery (micro pumps, microneedles, industrial and environmental analysis devices, pharmaceutical and life sciences research, food testing, preparation of new materials, As an important carrier of microfluidic technology, microfluidic chips are built on several square centimeters of chips to build chemical or biological laboratories, with low cost, high efficiency, good portability. However, the industrialization cost of microfluidic chips is relatively high at present. The molding process based on hot pressing and injection molding is an important method to solve the problem of mass manufacturing of microfluidic chips. The key of this technology is to manufacture and manufacture precision microfluidic chip mould with large scale microstructures. Electroforming is a low cost and large area microstructure manufacturing technology. It can be used in the preparation of metal die for microfluidic chip. According to the process requirements of metal die of microfluidic chip, the photographic plate making technology is established. The process of combining chemical etching with electroforming. Mask is made by photolithography of the workpiece. Then chemical etching and electroforming were carried out to process metal die of microfluidic chip. Spray etching machine was used for chemical etching. The electroforming experiment platform realized precise control of temperature by PID control method. In order to improve the uniformity of electroforming layer, the traverse motion of cathode fixture is designed. The translational motion of cathode, cathode current density and mask thickness are studied around the electroforming process. The influence of secondary auxiliary cathode on the sidewall steepness and uniformity of microstructures in metal die electroforming of microfluidic chip was studied. The experimental design of three-electrode electroforming system with secondary auxiliary cathode with external potential can be improved. Uniformity of the cast layer. For the more complicated factors of electroforming process, The orthogonal experiments were carried out with the emphasis on etching depth, temperature, mask thickness and cathode current density before casting. The optimized experimental process was obtained. The preparation of microfluidic chip metal dies by chemical micro-etching and micro-electroforming was studied and compared. The side wall of microstructures prepared by chemical micro-etching was irregular arc, and the size uniformity was relatively poor. The surface roughness is larger than Ra3.58 渭 m, while the side wall of the microstructure prepared by micro-electroforming is regular trapezoid, the dimension uniformity is good, the surface roughness is lower than Ra 0.65 渭 m. The metal die of microfluidic chip prepared by microelectroforming is better than that of chemical micro-etching in aspect of sidewall steepness, dimension uniformity and roughness of microstructure. The experiment scheme of controlling power pulse frequency and pulse waveform in electroforming process is adopted. The fabrication process of micro / nano structure on the surface of mold runner of microfluidic chip was studied. The microchannel with certain size surface micro / nano structure could be fabricated with high frequency and a certain pulse waveform.
【學(xué)位授予單位】：廣東工業(yè)大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TQ153.4

【共引文獻(xiàn)】

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相關(guān)碩士學(xué)位論文 前2條

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2 白龍彪;IEEE迷宮電腦鼠的設(shè)計(jì)與研究[D];西安科技大學(xué);2014年

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本文編號：1629283