本文關(guān)鍵詞： 微通道 導熱柱 LTCC微波組件 散熱性能　出處：《桂林電子科技大學》2017年碩士論文　論文類型：學位論文

【摘要】：低溫共燒陶瓷(Low Temperature Co-fired Ceramic)具備低成本、高電阻率、低介電常數(shù)、可埋置無源器件以及與硅匹配的熱膨脹系數(shù)等優(yōu)越特性,廣泛應(yīng)用于高密度混合集成與微波射頻的微波組件中。但是,LTCC微波組件的高度集成、功率密度的不斷提高,使復雜工作環(huán)境下LTCC微波組件的熱問題愈加明顯,嚴重影響了LTCC微波組件的可靠性。在LTCC微波組件中采用微通道及導熱柱結(jié)構(gòu),調(diào)控其結(jié)構(gòu)參數(shù)能夠改善LTCC微波組件的散熱問題。本文結(jié)合相關(guān)科研項目工程應(yīng)用所需,以某新型LTCC微波組件為研究對象,研究了微通道及導熱柱結(jié)構(gòu)參數(shù)對LTCC微波組件散熱性能的影響,主要研究內(nèi)容和結(jié)論如下:(1)針對微通道及導熱柱結(jié)構(gòu)散熱機理進行了研究,確定了影響LTCC微波組件散熱性能的主要結(jié)構(gòu)參數(shù)和流體冷卻方式。采用ANSYS有限元軟件建立了LTCC微波組件有限元分析模型,進行了熱-流耦合仿真分析。對流體四種不同進出口位置的布局方式Z型、I型、C型及L型進行了仿真優(yōu)選分析。仿真結(jié)果表明,LTCC微波組件的整體溫度分布均勻,最高溫度出現(xiàn)在功率芯片上,微通道內(nèi)的流體溫度最低。對流體不同進出口布局方式的優(yōu)選分析結(jié)果表明I型方式中LTCC微波組件功率芯片結(jié)溫最低,為50.24℃;C型方式最高,為55.70℃;I型方式中流體進出口壓強損失最小,為41.79KPa;Z型方式最大,為102.75KPa,即I型方式較優(yōu)。(2)采用正交試驗設(shè)計方法針對微通道及導熱柱結(jié)構(gòu)參數(shù)設(shè)計了6因素4水平的正交試驗方案,根據(jù)試驗方案進行了仿真分析,以LTCC微波組件功率芯片結(jié)溫為響應(yīng)結(jié)果,并對結(jié)果進行了數(shù)據(jù)有效性分析與極差分析。結(jié)果表明在一定范圍內(nèi),結(jié)構(gòu)參數(shù)對LTCC微波組件散熱性能影響的程度依次是:導熱柱直徑導熱柱個數(shù)出水口與進水口半徑微通道截面寬度微通道截面高度導熱柱高度。(3)采用基于JMP的逐步回歸分析方法擬合得到了微通道及導熱柱結(jié)構(gòu)參數(shù)與LTCC微波組件散熱性能數(shù)學關(guān)系模型,并對擬合的數(shù)學關(guān)系模型進行了評價分析與驗證分析。分析結(jié)果數(shù)據(jù)表明,關(guān)系模型的擬合度高,顯著性較強,初步描述了結(jié)構(gòu)參數(shù)與LTCC微波組件散熱性能的函數(shù)映射關(guān)系。(4)利用遺傳算法對微通道及導熱柱結(jié)構(gòu)參數(shù)與LTCC散熱性能數(shù)學關(guān)系模型進行了優(yōu)化研究。得到的最優(yōu)結(jié)構(gòu)參數(shù)為:導熱柱直徑選用189μm;導熱柱高度選用508μm;導熱柱個數(shù)選用8個;微通道截面寬度選用0.716mm;微通道截面高度選用508μm;進水口與出水口半徑選用1.047mm。優(yōu)化后得到的LTCC微波組件功率芯片結(jié)溫為32.41℃,降低了15.51%。表明優(yōu)化后組件功率芯片結(jié)溫明顯降低,可以改善LTCC微波組件的散熱性能。
[Abstract]:Low Temperature Co-fired Ceramic (low Temperature Co-fired Ceramic) has the advantages of low cost, high resistivity, low dielectric constant, buried passive devices and thermal expansion coefficient matching with silicon. It is widely used in microwave components with high density mixing integration and microwave RF. However, the high integration of LTCC microwave module and the continuous improvement of power density make the thermal problems of LTCC microwave modules more obvious in complex working environment. The reliability of LTCC microwave module is seriously affected. Adopting microchannel and heat conduction column structure in LTCC microwave module and adjusting its structural parameters can improve the heat dissipation problem of LTCC microwave module. Taking a new LTCC microwave module as the research object, the influence of the structure parameters of microchannel and heat conduction column on the heat dissipation performance of LTCC microwave module is studied. The main contents and conclusions are as follows: (1) the heat dissipation mechanism of microchannel and heat conduction column structure is studied. The main structural parameters and fluid cooling methods affecting the heat dissipation performance of LTCC microwave module are determined. The finite element analysis model of LTCC microwave module is established by using ANSYS finite element software. The thermo-fluid coupling simulation analysis was carried out. The layout of four different inlet and outlet locations of fluid, Z type I type C and L type, were selected and optimized. The simulation results show that the whole temperature distribution of LTCC microwave module is uniform. The highest temperature appears on the power chip and the fluid temperature in the microchannel is the lowest. The results of optimal selection and analysis of the different inlet and outlet configurations of the fluid show that the LTCC microwave module has the lowest junction temperature and the highest junction temperature is 50.24 鈩，

本文編號：1504575