發(fā)布時間：2018-01-24 19:14

  本文關鍵詞： 電解銅箔 添加劑 電沉積 在線監(jiān)測　出處：《華南理工大學》2015年碩士論文　論文類型：學位論文

【摘要】：隨著鋰離子電池行業(yè)的迅猛發(fā)展,對鋰離子電池負極集流體所用的電解銅箔的要求也越來越高。開發(fā)優(yōu)良的添加劑配方是制備高性能電解銅箔的重要途徑之一。本文模擬工廠生產電解銅箔的工藝條件,致力于開發(fā)能在高電流密度條件下制備光亮整平電解銅箔的添加劑配方,并研究了添加劑作用下銅的電沉積過程。此外,還采取簡單有效的方法對電解液中銅離子、硫酸、添加劑濃度進行檢測。主要內容如下:1.確定了6組雙組份,3組三組分添加劑配方,在高電流密度7500A·m-2條件下,制備電解銅箔。掃描電鏡分析表明制備的銅箔顯微結構平整致密、無明顯缺陷,光澤度測試表明所制備銅箔毛面光亮度都在100-200GS之間,粗糙度測試表明銅箔毛面Ra0.2μm,Rz2.0μm,X射線衍射分析表明鍍層均呈現(111)晶面較大擇優(yōu)取向,從而說明所制備銅箔比較平整。2.用線性電勢掃描、循環(huán)伏安和計時電流法研究50℃下Cl-、BSP、RPE單獨存在與同時存在時,在含320g/LCu SO4?5H2O,110g/LH2SO4溶液中,銅在銅電極上的電沉積過程。研究表明Cl-、BSP在銅的電沉積過程中起去極化作用,隨著RPE濃度的增大極化作用在增強。添加30mg?L-1Cl-+5mg?L-1BSP+5mg?L-1RPE會增大表觀傳遞系數和擴散系數,加快銅的電沉積過程;RPE會降低成核數密度,而BSP使成核數密度增大,但同時會降低銅離子的擴散系數。在Cl-、RPE、30mg?L-1Cl-+5mg?L-1BSP+5mg?L-1RPE作用下,銅的電沉積都是在開始時接近瞬時成核,隨時間延長向連續(xù)成核靠近,最終偏離理論模型,而在BSP作用下,始終接近瞬時成核理論。3.結合光電技術,自主設計制作設備,對電解液中銅離子濃度進行在線監(jiān)測,銅離子濃度與微安表讀數有很好的線性關系。此外,校正了溫度對銅離子監(jiān)測的影響。4.用測量電導率的方法,對電解液中硫酸濃度進行檢測,電解液中硫酸濃度與電解液的電導率有很好的線性關系,同樣校正了溫度對電導率的影響。5.沉淀分離電解液中硫酸銅,測含不同濃度DPS的上清液在波長為270nm處吸光度,發(fā)現吸光度與DPS濃度有很好的線性關系,從而實現對DPS濃度的檢測。
[Abstract]:With the rapid development of lithium ion battery industry. The requirement of electrolytic copper foil for negative electrode collector of lithium ion battery is higher and higher. The development of excellent additive formula is one of the important ways to prepare high performance electrolytic copper foil. This paper simulates the production process of electrolytic copper foil in the factory. Conditions. This paper is devoted to the development of additive formula for the preparation of bright leveling electrolytic copper foil under high current density, and the electrodeposition process of copper under the action of additive. The concentration of copper ion, sulfuric acid and additive in electrolyte was also determined by simple and effective method. The main contents are as follows: 1. Six groups of two-component and three groups of three-component additive formula were determined. Electrolytic copper foil was prepared at high current density of 7500A 路m ~ (-2). SEM analysis showed that the microstructure of the prepared copper foil was flat and compact without obvious defects. The gloss test shows that the luminance of the copper-foil surface is between 100-200GS, and the roughness test shows that the copper foil surface Ra0.2 渭 m Rz 2.0 渭 m. X-ray diffraction analysis shows that the coating exhibits a large preferred orientation on the crystal plane, which indicates that the copper foil prepared is relatively flat. 2. The coating is scanned by linear potential. The cyclic voltammetry and chronoamperometric method were used to study the existence and co-existence of Cl-O BSPN RPE at 50 鈩，

本文編號：1460809