【摘要】：近年來,隨著各種電子產(chǎn)品的普及以及更新?lián)Q代的速度加快,具有體積小、容量大、耐腐蝕、耐高溫等優(yōu)點(diǎn)的陶瓷電容器的市場(chǎng)需求量與日俱增。陶瓷電容器的電極材料一般采用貴金屬銀,其高昂的價(jià)格使得陶瓷電容器成本偏高,采用賤金屬電極代替貴金屬電極已成為陶瓷電容器行業(yè)發(fā)展的必然趨勢(shì)。本論文圍繞陶瓷電容器電極賤金屬化展開研究。本論文選取賤金屬銅為電極材料,采用化學(xué)鍍法來實(shí)現(xiàn)陶瓷電極賤金屬化。利用噴墨打印技術(shù)在陶瓷基材上形成圖形化的活化層,以此作為后續(xù)化學(xué)沉銅的催化種子層。以金屬銅層的外觀色澤、微觀形貌、方阻以及附著力為考察指標(biāo),優(yōu)化化學(xué)沉銅的溫度以及沉積時(shí)間。結(jié)果表明,在沉積溫度為45~50℃,沉積時(shí)間約為20 min條件下,所得到的銅層外觀色澤光亮,銅顆粒大小較均勻,方阻以及附著力最佳。論文在優(yōu)化施鍍工藝條件基礎(chǔ)上,以傳統(tǒng)化學(xué)鍍銅效果為參照,探討了超聲輔助化學(xué)鍍的超聲參數(shù)對(duì)鍍層質(zhì)量的影響。結(jié)果表明,在化學(xué)沉銅過程中引入超聲輔助沉積可有效提高電極質(zhì)量,這是因?yàn)槌暡ㄔ诨瘜W(xué)沉積中能促進(jìn)氫氣的排出,加快沉積速度,提升鍍層的結(jié)合力。在噴墨印制化學(xué)沉銅催化種子層前對(duì)陶瓷基材進(jìn)行粗化預(yù)處理,探討了粗化時(shí)間對(duì)銅層附著力的影響。在優(yōu)化制備條件下所得到的銅電極色澤光亮、銅顆粒致密均勻、銅層抗熔蝕性強(qiáng)、可焊性優(yōu)良,銅層在陶瓷基材上的附著力可達(dá)到2.6kg/cm2,電阻率低至3.6μ?·cm。銅電極陶瓷電容器的電容量和損耗均達(dá)到了工業(yè)應(yīng)用要求。本論文所開發(fā)的陶瓷電容器賤金屬電極制備技術(shù)具有工藝簡(jiǎn)單、成本低、可批量化制備的優(yōu)點(diǎn),且整個(gè)制備過程無需高溫?zé)Y(jié),即可獲得性能優(yōu)良的賤金屬電極。這可為陶瓷電容器電極的賤金屬化提供實(shí)用的技術(shù)參考。
[Abstract]:In recent years, with the popularity of various electronic products and the speed of upgrading, the market demand of ceramic capacitors with the advantages of small volume, large capacity, corrosion resistance and high temperature resistance is increasing day by day. The electrode material of ceramic capacitor is usually made of precious metal silver, and its high price makes the cost of ceramic capacitor on the high side. It has become an inevitable trend of ceramic capacitor industry to replace precious metal electrode with base metal electrode. In this paper, the base metal of ceramic capacitor electrode is studied. In this paper, base metal copper is chosen as electrode material and electroless plating method is used to realize base metal of ceramic electrode. The ink-jet printing technique was used to form a graphical activation layer on the ceramic substrate, which was used as the catalytic seed layer for the subsequent chemical deposition of copper. The temperature and deposition time of copper deposition were optimized by using the appearance, color, micromorphology, square resistance and adhesion of metal copper layer as the index of investigation. The results show that when the deposition temperature is 45 ~ 50 鈩，

本文編號(hào)：2280352