固溶鉭原子與晶界偏析鉭原子對(duì)納米晶銅力學(xué)性能的影響
[Abstract]:In recent decades, nanocrystalline materials have received great attention, and more people begin to study nanocrystalline materials. The material of this size not only has excellent mechanical properties, such as high strength and high strain rate sensitivity, but also has good physical properties, such as magnetism. This excellent property comes from its ultra-small grain size, or its high grain boundary volume fraction, known as the size effect. But this kind of high grain boundary volume fraction also brings some problems, internal instability is a big problem. Many nanocrystalline materials, whether used in basic research or engineering applications, are now considered to be essentially in a non-equilibrium state, even at room temperature will spontaneously change to coarse crystal. This trend of coarse crystallization hinders its application at room temperature, especially when it is used as a structural material for a long time. The trend of coarse crystallization of nanocrystalline materials is mainly caused by the internal activities of grain boundaries (such as grain boundary slip, migration, turnover). Although these grain boundary activities are necessary to increase plastic deformation, however, In order to obtain stable structure and excellent properties of nanocrystalline materials, we still need to stop it. Alloying with solid insoluble elements is a very effective method, analogous to the fact that adding surfactants to the emulsion stabilizes the surface area, and the insoluble elements distribute at the grain boundaries, thus reducing the free energy. And slow down the grain growth, insoluble elements can also play the role of pinning at grain boundaries. Copper tantalum is a very suitable system. Each component of the system has a different crystal structure and a very small mutual solubility in solid state. The atomic radius of tantalum atom is much larger than that of copper atom, which causes the tantalum atom to distribute at the grain boundary of copper. In this experiment, nanocrystalline copper and copper tantalum alloy (5% tantalum) thin films with thickness of about 6 microns were prepared on glass substrates by magnetron sputtering. The insoluble nanocrystalline copper-tantalum alloy system was compared with nano-crystalline copper. The microstructure of nanocrystalline copper and nanocrystalline copper-tantalum alloy samples was analyzed by X-ray diffractometer. The surface morphology of nanocrystalline copper and tantalum alloy was observed by transmission electron microscope, and the mechanical properties were measured by nano-indentation instrument. It is found that nanocrystalline copper and nanocrystalline copper tantalum alloys have the same crystal structure and grain size, and nanocrystalline copper tantalum alloys have higher hardness and creep resistance at room temperature. The results show that the addition of tantalum in solid solution can not change the crystal structure of nanocrystalline copper and can improve the mechanical properties of nanocrystalline copper. The microstructure of nanocrystalline copper and nanocrystalline copper-tantalum alloy samples was analyzed by X-ray diffraction (XRD) after tempering the samples of nanocrystalline copper and nanocrystalline copper tantalum. The surface morphology of nanocrystalline copper tantalum alloy was observed by transmission electron microscope and its mechanical properties were measured by nano-indentation instrument. It was found that after tempering, tantalum atoms in nanocrystalline copper-tantalum alloy segregated to grain boundary. Nanocrystalline copper-tantalum alloy has higher hardness and creep resistance, indicating that grain boundary segregation of tantalum atoms can improve the mechanical properties and thermal stability of nanocrystalline copper.
【學(xué)位授予單位】:吉林大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2017
【分類(lèi)號(hào)】:O614.121;TB383.1
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