本文選題：量子點(diǎn)　切入點(diǎn)：環(huán)氧樹脂復(fù)合材料(QD-Ep)　出處：《華東理工大學(xué)》2017年碩士論文

【摘要】：裂紋作為結(jié)構(gòu)中最危險(xiǎn)的一種缺陷,往往容易導(dǎo)致設(shè)備的失效甚至造成重大安全事故。然而,工業(yè)生產(chǎn)過程由于經(jīng)濟(jì)性及結(jié)構(gòu)復(fù)雜性等因素的制約,對于裂紋的實(shí)時(shí)在線監(jiān)測始終難以實(shí)現(xiàn)大面積覆蓋,因此,新的實(shí)時(shí)在線監(jiān)測手段的開發(fā)便顯得尤為重要。由于量子點(diǎn)(QD)對于應(yīng)力應(yīng)變具有相應(yīng)的熒光響應(yīng),基于此,本文主要使用CdSe/ZnS量子點(diǎn)環(huán)氧樹脂復(fù)合材料,并覆于被測試樣表面成膜,從而實(shí)現(xiàn)對于裂紋的實(shí)時(shí)監(jiān)測,并對相關(guān)影響因素進(jìn)行考察。論文主要獲得以下研究結(jié)果:(1)實(shí)驗(yàn)發(fā)現(xiàn)在宏觀裂紋監(jiān)測的過程中,膜裂紋處會(huì)出現(xiàn)一條熒光亮線,而在微裂紋的監(jiān)測過程中,通過熒光顯微鏡會(huì)在裂紋周圍發(fā)現(xiàn)明顯的熒光增強(qiáng)區(qū)域。(2)實(shí)驗(yàn)通過對相應(yīng)宏觀裂紋與微裂紋監(jiān)測過程進(jìn)行觀測,確立了監(jiān)測不同尺寸大小的裂紋所適用的最佳覆膜厚度。同時(shí)通過對宏觀裂紋與微裂紋二者熒光增強(qiáng)情況進(jìn)行相應(yīng)的表征,提出了二者之間形成熒光增強(qiáng)現(xiàn)象機(jī)理的差異。(3)對于宏觀裂紋,進(jìn)行了相應(yīng)膜裂紋與金屬基底裂紋在長度方向同步性的考察;對于微裂紋,通過模擬以及相關(guān)因素的實(shí)驗(yàn)探究,進(jìn)一步證明了該熒光增強(qiáng)現(xiàn)象與基體的應(yīng)力分布,量子點(diǎn)與基體之間的相互作用息息相關(guān)。
[Abstract]:As one of the most dangerous defects in structures, cracks often lead to equipment failure and even serious safety accidents. However, the industrial production process is restricted by economy and structural complexity. It is always difficult to realize large area coverage for the real-time on-line monitoring of cracks, so it is very important to develop a new real-time on-line monitoring method. Because quantum dots (QD) have a corresponding fluorescence response to stress and strain, based on this, In this paper, the CdSe/ZnS quantum dot epoxy composite is used to form film on the surface of the tested sample, so that the crack can be monitored in real time. The main results of this paper are as follows: 1) in the process of macroscopic crack monitoring, there will be a fluorescent bright line in the film crack, while in the process of microcrack monitoring, there will be a fluorescent bright line in the film crack monitoring process. The obvious fluorescence enhancement region around the crack can be found by fluorescence microscope. The experiment observed the corresponding macroscopic crack and microcrack monitoring process. The optimum film thickness for monitoring cracks of different sizes was established. Meanwhile, the fluorescence enhancement of macroscopic crack and microcrack were characterized accordingly. It is suggested that the mechanism of fluorescence enhancement is different between them.) for macroscopic cracks, the synchronism of the corresponding film cracks and metal substrate cracks in the length direction is investigated, and for microcracks, the simulation and experimental investigation of related factors are carried out. It is further proved that the fluorescence enhancement phenomenon is closely related to the stress distribution of the matrix and the interaction between the quantum dots and the matrix.
【學(xué)位授予單位】：華東理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：O657.3

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