【摘要】：激光加熱固化設(shè)備由激光加熱固化裝置和纖維纏繞成型裝置共同構(gòu)成,在碳纖維復(fù)合材料纏繞的同時(shí)利用半導(dǎo)體激光器對(duì)復(fù)合材料進(jìn)行加熱,能夠使復(fù)合材料纏繞更加均勻,與其他加熱方式相比較,激光加熱固化時(shí)間更短,固化效果更好,裝置更簡(jiǎn)單。論文綜述了激光加熱固化技術(shù)和纖維纏繞成型技術(shù)的國(guó)內(nèi)外現(xiàn)狀,詳細(xì)介紹了碳纖維和環(huán)氧樹(shù)脂的特點(diǎn)及性能,闡述了碳纖維-環(huán)氧樹(shù)脂復(fù)合材料纏繞成型工藝及其特點(diǎn)。應(yīng)用ANSYS有限元分析軟件對(duì)復(fù)合材料加熱固化過(guò)程進(jìn)行溫度場(chǎng)分布的計(jì)算模擬,獲得了動(dòng)態(tài)纏繞過(guò)程中復(fù)合材料的溫度場(chǎng)分布。提出了一種回轉(zhuǎn)體纏繞的激光加熱固化實(shí)驗(yàn)研究方案,針對(duì)半導(dǎo)體激光器的輸出的光場(chǎng)分布特性,應(yīng)用ZEMAX軟件仿真模擬了含有三個(gè)bar條的半導(dǎo)體激光器陣列的傳輸特性,采用三個(gè)微柱面鏡對(duì)半導(dǎo)體激光陣列的快軸整形獲得了尺寸為1.2mm×10mm的輻照光斑;設(shè)計(jì)了一維運(yùn)動(dòng)與一維回轉(zhuǎn)相結(jié)合的二維運(yùn)動(dòng)工作臺(tái)及其運(yùn)動(dòng)控制單元,通過(guò)上位機(jī)來(lái)控制二維運(yùn)動(dòng)臺(tái)的運(yùn)動(dòng)速度;采用張力控制裝置實(shí)現(xiàn)復(fù)合材料帶的預(yù)緊;采用紅外測(cè)溫技術(shù)實(shí)現(xiàn)輻照的復(fù)合材料表面的溫度測(cè)量,通過(guò)功率反饋控制電路實(shí)現(xiàn)激光輻照功率的調(diào)節(jié),搭建了激光加熱固化實(shí)驗(yàn)裝置。在輻照功率為60W時(shí),復(fù)合材料表面加熱溫度為200℃±10℃,經(jīng)測(cè)定復(fù)合材料的剪切強(qiáng)度達(dá)到了60MPa。
[Abstract]:The laser heating and curing equipment is composed of a laser heating curing device and a filament winding molding device. While the carbon fiber composite material is wound, a semiconductor laser is used to heat the composite material, which can make the composite winding more uniform. Compared with other heating methods, laser heating has shorter curing time, better curing effect and simpler device. In this paper, the present situation of laser heating curing technology and filament winding molding technology at home and abroad is reviewed. The characteristics and properties of carbon fiber and epoxy resin are introduced in detail, and the winding process and characteristics of carbon fiber-epoxy resin composites are described in detail. The temperature distribution of composites during heating and curing process was simulated by using ANSYS finite element analysis software, and the temperature distribution of composites during dynamic winding was obtained. An experimental scheme of laser heating solidification with rotating body winding is proposed. Aiming at the light field distribution of semiconductor laser output, the transmission characteristics of semiconductor laser array with three bar bars are simulated by ZEMAX software. Three microcylindrical mirrors were used to shape the fast axis of the semiconductor laser array and the irradiated spot with the size of 1.2mm 脳 10mm was obtained. A two-dimensional moving table combined with one-dimensional motion and one-dimensional rotation and its motion control unit are designed to control the motion speed of the two-dimensional moving table through the upper computer, and the tension control device is used to realize the pre-tightening of the composite belt. The infrared temperature measurement technique was used to measure the surface temperature of irradiated composite materials. The laser irradiation power was adjusted by power feedback control circuit, and the experimental equipment of laser heating and curing was set up. When the irradiation power is 60 W, the surface heating temperature of the composite is 200 鈩，

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