【摘要】：LED(Light Emitting Diode)由于其相對普通照明技術(shù)的諸多優(yōu)點而被廣泛使用。然而,由于LED芯片電光轉(zhuǎn)換效率低,在工作狀態(tài)中有約80%-90%的電能轉(zhuǎn)換為了熱量,熱量的聚集將對LED的工作狀態(tài)產(chǎn)生許多不良影響。所以,散熱問題成為了當(dāng)下急需解決的LED發(fā)展應(yīng)用的難題之一。針對LED的散熱問題,綜述了近年來研究LED散熱的相關(guān)文獻(xiàn),主要分析了關(guān)于LED的主動散熱的諸多方式,并進行相互優(yōu)缺點比較,采用了適合大功率LED陣列的散熱方法——水冷式多孔微熱沉。主要研究內(nèi)容如下:第一,搭建實驗臺架對多孔微熱沉LED陣列的傳熱效果進行研究,多孔芯采用銅絲制作,多孔微熱沉LED陣列采用5×5的芯片布置方式。研究表明,在輸入功率為45W和75W時溫度測量點T3的實驗溫度分別為38.3℃和45.4℃。第二,對實驗所用多孔微熱沉進行建模仿真,并將實驗結(jié)果和仿真結(jié)果進行對比,發(fā)現(xiàn)模擬結(jié)果與實驗結(jié)果的溫差在1℃以內(nèi),可為后續(xù)的研究工作提供可靠的仿真分析工具。第三,利用已驗證的仿真方法探討多孔介質(zhì)的進出口數(shù)目、流速、孔隙率等對系統(tǒng)散熱性能的影響。發(fā)現(xiàn)相同流量下,進出口由一進一出改為兩進兩出能改善系統(tǒng)換熱;流速由0.25m/s增大至0.5m/s時,系統(tǒng)換熱效果提升幅度最明顯;孔隙率越小,散熱效果越明顯,但是流動阻力也隨之增大;而且即使在環(huán)境溫度高達(dá)36℃的情況下,系統(tǒng)芯片的最高溫度也才45.8℃。第四,為了改善系統(tǒng)的換熱效果,根據(jù)前文實驗和仿真模擬工作,利用已驗證的仿真模型,發(fā)現(xiàn)一種下空結(jié)構(gòu),無論是從芯片基板的溫度均勻性、安裝便捷性或經(jīng)濟性角度考慮,該結(jié)構(gòu)都具有優(yōu)良的特性。本文工作目的是希望能提供一些理論與實際方面的設(shè)計依據(jù),能更好解決大功率LED陣列系統(tǒng)的散熱難題并推動其發(fā)展與應(yīng)用。
[Abstract]:LED (Light Emitting Diode) is widely used because of its advantages over ordinary lighting technology. However, because of the low efficiency of electro-optic conversion of LED chip, about 80% to 90% of the electrical energy is converted to heat in the working state. The accumulation of heat will have a lot of adverse effects on the working state of LED. Therefore, the problem of heat dissipation has become one of the most difficult problems in the development and application of LED. In view of the heat dissipation of LED, this paper summarizes the related literatures on LED heat dissipation in recent years, mainly analyzes many ways of active heat dissipation of LED, and compares the advantages and disadvantages of each other. Water cooled porous micro heat sink, which is suitable for high power LED array, is adopted. The main research contents are as follows: first, the heat transfer effect of porous micro-heat-sink LED array is studied by building an experimental bench. The porous core is made of copper wire, and the porous micro-heat-sink LED array is arranged with 5 脳 5 chips. The results show that the experimental temperature of temperature measurement point T3 is 38.3 鈩，

本文編號：2428767