【摘要】：進入新世紀,微電子的發(fā)展進入納電子/集成微系統(tǒng)時代,人們在繼續(xù)發(fā)展摩爾定律的同時,創(chuàng)新了超越摩爾定律的微系統(tǒng)三維集成技術(shù)。介紹了在成像傳感、光集成微系統(tǒng)、慣性傳感微系統(tǒng)、射頻微系統(tǒng)、生物微系統(tǒng)和邏輯微系統(tǒng)的三維集成技術(shù)的新發(fā)展,包含MEMS和IC的3D異構(gòu)集成、具有Si插入器的SiP3D集成和異質(zhì)3D集成等技術(shù)和各自相應(yīng)的特點,以及在各應(yīng)用領(lǐng)域所產(chǎn)生的革命性成果。還介紹了微系統(tǒng)三維集成中有關(guān)TSV的可靠性研究的最新進展。
[Abstract]:In the new century, the development of microelectronics has entered the era of nanoelectronics / integrated microsystems. While people continue to develop Moore's law, they have innovated the three-dimensional integration technology of microsystems beyond Moore's law. This paper introduces the development of 3D integration technology in imaging sensing, optical integrated microsystems, inertial sensing microsystems, RF microsystems, biological microsystems and logical microsystems, including 3D heterogeneous integration of MEMS and IC. The technology of SiP3D integration and heterogeneous 3D integration with Si inserters and their respective characteristics, as well as the revolutionary achievements in various application fields. The latest research progress of TSV reliability in micro-system three-dimensional integration is also introduced.
【作者單位】： 中國電子科技集團公司;專用集成電路重點實驗室;
【分類號】：TN409

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