【摘要】：目前印刷電路板層間的連接是通過孔金屬化實(shí)現(xiàn)的,傳統(tǒng)的孔金屬化工藝采用的是化學(xué)鍍銅技術(shù),不符合現(xiàn)如今綠色產(chǎn)業(yè)化的要求。本文采用靜電吸附的方法對印刷電路板微孔導(dǎo)電化處理,具體方法是以碳黑為導(dǎo)電介質(zhì),通過表面活性劑分散碳黑制備出黑孔液,經(jīng)黑孔化處理的基材表面吸附碳導(dǎo)電層,從而實(shí)現(xiàn)直接電鍍銅。本文對三種具有代表性的碳黑進(jìn)行了篩選,對其表面化學(xué)性質(zhì)、潤濕性能、沉銅性能等方面進(jìn)行了研究,發(fā)現(xiàn)M1300碳黑的水潤濕性及表面沉銅性優(yōu)于其它兩種。同時(shí),本文對實(shí)驗(yàn)選用的陰離子表面活性劑壬基酚聚氧乙烯醚磷酸酯的添加量及與其他表面活性劑的混合使用效果進(jìn)行了優(yōu)化,發(fā)現(xiàn)當(dāng)壬基酚聚氧乙烯醚磷酸酯的添加為碳黑量的50%時(shí),體系的透過率最低,離心穩(wěn)定性最好;壬基酚聚氧乙烯醚磷酸酯與其它表面活性劑混合使用時(shí),發(fā)現(xiàn)羧甲基纖維素鈉與壬基酚聚氧乙烯醚磷酸酯具有協(xié)同分散的作用。對黑孔液p H值影響的研究中發(fā)現(xiàn),當(dāng)控制p H值為9~11時(shí),碳黑的分散性能及對基材的吸附性能均較好。采用球磨分散2.5h為最佳分散工藝。采用最佳黑孔化工藝處理PCB的板面和孔壁,得到了結(jié)合力良好的沉銅層。研究了銅在酸性鍍銅液中的沉積行為,發(fā)現(xiàn)其屬于擴(kuò)散控制。通過對不同階躍電位下的電流-時(shí)間暫態(tài)曲線的研究,發(fā)現(xiàn)銅在電結(jié)晶初期按三維生長方式進(jìn)行,在低的過電位下,銅電結(jié)晶初期按瞬時(shí)成核方式進(jìn)行,高的過電位下,由于鍍液中的添加劑以及碳黑層上的表面活性劑的影響,使得銅電結(jié)晶初期偏離了瞬時(shí)成核生長。
[Abstract]:At present, the interlayer connection of printed circuit board is realized by hole metallization. The traditional hole metallization technology adopts electroless copper plating technology, which does not meet the requirement of green industrialization nowadays. In this paper, the electrostatic-adsorption method is used to prepare black pore liquid by using carbon black as conductive medium, and the carbon conductive layer is adsorbed on the surface of the substrate treated by black pore treatment, in which carbon black is used as the conductive medium, and the black pore liquid is prepared by dispersing carbon black as the conductive medium. Thus, direct copper plating is realized. In this paper, three kinds of representative carbon black were screened. The surface chemical properties, wettability and copper deposition properties of M1300 carbon black were studied. It was found that the water wettability and surface copper deposition of M1300 carbon black were better than the other two. At the same time, the amount of anionic surfactant nonylphenol polyoxyethylene ether phosphate and its mixing effect with other surfactants were optimized. It was found that the system had the lowest transmittance and the best centrifugal stability when the addition of nonylphenol polyoxyethylene ether phosphate was 50% carbon black. When nonylphenol polyoxyethylene ether phosphate was mixed with other surfactants, it was found that sodium carboxymethyl cellulose and nonylphenol polyoxyethylene ether phosphate had synergistic dispersion effect. The influence of pH value on black pore liquid was studied. It was found that when pH value was 9 ~ 11:00, the dispersion property of carbon black and the adsorption property of carbon black on substrate were better. The best dispersing process was the ball milling and dispersing for 2.5 h. The best black hole process was used to treat the plate and hole wall of PCB, and a fine copper deposition layer with good adhesion was obtained. The deposition behavior of copper in acid copper plating solution was studied and it was found that it belongs to diffusion control. Through the study of current-time transient curves at different step potentials, it is found that copper is grown in three dimensional mode at the initial stage of electrocrystallization, in the low overpotential, in the initial stage of copper crystallization in the mode of instantaneous nucleation, and in the case of high overpotential. Due to the influence of the additives in the bath and the surfactant on the carbon black layer, the initial phase of copper electrocrystallization deviates from the instantaneous nucleation growth.
【學(xué)位授予單位】：哈爾濱工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2016
【分類號(hào)】：TN41
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本文編號(hào)：2337212