【摘要】：微電子技術(shù)的飛速發(fā)展使得封裝器件的熱應(yīng)力分析及焊點(diǎn)可靠性研究成為一個(gè)重要課題,目前器件級芯片的熱應(yīng)力分析與焊點(diǎn)的疲勞壽命預(yù)測主要通過理論計(jì)算、有限元仿真和熱循環(huán)試驗(yàn)三種方法來實(shí)現(xiàn),而理論計(jì)算中模型簡化過于理想誤差較大,熱循環(huán)試驗(yàn)成本高且費(fèi)時(shí),有限元仿真沒有一款專用平臺,大型通用軟件操作繁瑣且存在很大的功能浪費(fèi),基于上述現(xiàn)狀本文以典型封裝器件為對象來開展研究工作。基于典型封裝器件,對熱應(yīng)力分析方法進(jìn)行系統(tǒng)研究,闡述了適用于器件級芯片熱應(yīng)力分析的基礎(chǔ)理論,總結(jié)有限元仿真模擬的分析流程,歸納了常用的試驗(yàn)方法,并針對具體插裝DIP器件,分別了進(jìn)行理論計(jì)算和有限元仿真模擬,進(jìn)行結(jié)果對比。根據(jù)封裝器件熱循環(huán)載荷下結(jié)構(gòu)仿真的基本流程,選擇支撐軟件ANSYS和開發(fā)軟件Borland C++Builder編寫了一套專用于典型封裝器件熱應(yīng)力應(yīng)變分析及焊點(diǎn)疲勞壽命預(yù)測的定制軟件,大大簡化了操作過程,并利用具體實(shí)例驗(yàn)證軟件的可行性與有效性,在此基礎(chǔ)上結(jié)合子模型高級分析技術(shù),在保證得到精確結(jié)果的同時(shí),大大節(jié)約了求解時(shí)間。針對富士通公司的BGA-320P-M06芯片,考察了其熱可靠性影響因素,研究了熱循環(huán)載荷參數(shù)、器件結(jié)構(gòu)幾何尺寸及焊點(diǎn)的釬料成份對器件焊點(diǎn)疲勞壽命的影響,并利用響應(yīng)曲面法得到了器件焊點(diǎn)疲勞壽命與焊點(diǎn)高度、焊點(diǎn)直徑、基板厚度及基板尺寸的回歸方程,并進(jìn)行回歸模型驗(yàn)證,為器件的設(shè)計(jì)制造提供參考。
[Abstract]:With the rapid development of microelectronic technology, thermal stress analysis and solder joint reliability research of packaging devices become an important subject. At present, thermal stress analysis and fatigue life prediction of solder joints are mainly based on theoretical calculation. The finite element simulation and thermal cycle test are realized by three methods. However, in theoretical calculation, the simplification of the model is too large, the cost of thermal cycle test is high and time-consuming, and there is no special platform for finite element simulation. The operation of large scale universal software is cumbersome and there is a lot of functional waste. Based on the above situation, this paper takes typical packaging devices as the object to carry out the research work. Based on typical packaging devices, the thermal stress analysis method is systematically studied, the basic theory suitable for thermal stress analysis of device level chips is expounded, the analysis flow of finite element simulation is summarized, and the common test methods are summarized. The theoretical calculation and finite element simulation are carried out for the specific DIP device, and the results are compared. According to the basic flow of structure simulation under the thermal cycling load of packaging devices, a set of customized software for thermal stress-strain analysis of typical packaging devices and prediction of fatigue life of solder joints is developed by selecting the supporting software ANSYS and developing software Borland C Builder. The operation process is greatly simplified, and the feasibility and effectiveness of the software are verified by a concrete example. Based on this, the high level analysis technology of submodel is combined to ensure the accurate results and save the solving time greatly. Based on Fujitsu BGA-320P-M06 chip, the influence factors of thermal reliability are investigated, and the effects of thermal cycle load parameters, device structure geometry and solder composition on the fatigue life of solder joint are studied. The regression equations of fatigue life, solder joint height, solder joint diameter, substrate thickness and substrate size are obtained by using the response surface method, and the regression model is verified, which provides a reference for the design and manufacture of the device.
【學(xué)位授予單位】：西安電子科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN405

【參考文獻(xiàn)】

相關(guān)期刊論文 前7條

1 張亮;孫磊;郭永環(huán);姜海波;鐘素娟;馬佳;鮑麗;;低銀Sn1.0Ag0.5Cu焊點(diǎn)疲勞壽命預(yù)測[J];東南大學(xué)學(xué)報(bào)(自然科學(xué)版);2015年04期

2 包誠;徐幸;程明生;;熱疲勞載荷作用下不同成分BGA互連焊點(diǎn)可靠性研究[J];電子測試;2015年09期

3 王旭艷;徐仁春;劉剛;;Anand本構(gòu)方程在焊點(diǎn)可靠性研究中的應(yīng)用[J];電焊機(jī);2012年12期

4 崔海坡;程恩清;;基于子模型法的焊點(diǎn)熱應(yīng)力分析[J];材料導(dǎo)報(bào);2011年24期

5 韓瀟;丁漢;盛鑫軍;張波;;CSP封裝Sn-3.5Ag焊點(diǎn)的熱疲勞壽命預(yù)測[J];半導(dǎo)體學(xué)報(bào);2006年09期

6 譚艷輝,許紀(jì)倩,徐駿宇,陳娟;微電子金屬封裝溫度場仿真系統(tǒng)的研究[J];電子產(chǎn)品可靠性與環(huán)境試驗(yàn);2005年03期

7 王國忠,程兆年;SnPb釬料合金的粘塑性Anand本構(gòu)方程[J];應(yīng)用力學(xué)學(xué)報(bào);2000年03期

相關(guān)碩士學(xué)位論文 前9條

1 馬瀟;典型PBGA封裝熱—結(jié)構(gòu)分析及其優(yōu)化[D];西安電子科技大學(xué);2013年

2 章霖;熱循環(huán)載荷下BGA復(fù)合焊點(diǎn)疲勞壽命的研究[D];哈爾濱工業(yè)大學(xué);2011年

3 劉婷;無鉛塑料球柵陣列封裝熱失效分析及可靠性研究[D];哈爾濱理工大學(xué);2010年

4 李彥輝;PBGA無鉛焊球熱疲勞可靠性有限元分析[D];南京航空航天大學(xué);2010年

5 譚廣斌;塑料球柵陣列封裝（PBGA）在不同載荷條件下的力學(xué)性能研究及優(yōu)化分析[D];江蘇大學(xué);2009年

6 羅文功;BGA封裝的熱應(yīng)力分析及其熱可靠性研究[D];西安電子科技大學(xué);2009年

7 林丹華;PBGA封裝熱可靠性分析及結(jié)構(gòu)優(yōu)化[D];中南大學(xué);2008年

8 李磊;三維疊層CSP/BGA封裝的熱分析與焊點(diǎn)可靠性分析[D];電子科技大學(xué);2006年

9 劉彪;疊層CSP封裝結(jié)構(gòu)應(yīng)力有限元分析及結(jié)構(gòu)優(yōu)化[D];蘇州大學(xué);2005年

，

本文編號：2317398