【摘要】：本文主要研究新型真空自動覆膜設(shè)備的設(shè)計與使用。隨著芯片封裝行業(yè)的快速發(fā)展,對封裝成型工藝的要求也越來越高。真空覆膜設(shè)備正是針對目前封裝成型技術(shù)存在的弊端而提出來的。真空覆膜技術(shù)利用氣壓差實現(xiàn)PCBA的封裝,由于其功能原理簡單,相比之下成本低,且成型效率高。目前真空覆膜設(shè)備的加工參數(shù)都是通過大量的試驗確定的,不僅造成了極大的人力和物力浪費,而且嚴(yán)重影響了真空覆膜設(shè)備的產(chǎn)業(yè)化發(fā)展。因此本文設(shè)計新型真空覆膜設(shè)備具有重要意義�；诟材ぴO(shè)備需要在真空條件下進行的特點,本文主要研究了以下四個方面的內(nèi)容:(1)確立該設(shè)備研發(fā)的目的、要求、功能等,以此確定設(shè)備的設(shè)計方向;(2)建立合適的輻射傳熱模型,分析膠膜表面溫度分布情況,為設(shè)備實際參數(shù)的確定提供理論依據(jù);(3)設(shè)計覆膜設(shè)備的整體結(jié)構(gòu),包括各個機械加工件的設(shè)計、機械標(biāo)準(zhǔn)件的選型以及整體性能的評估等;(4)進行相關(guān)試驗,觀察封裝效果并進行分析,對封裝參數(shù)和流程進行部分優(yōu)化以提升性能。由于平面間輻射傳熱過程的復(fù)雜性,簡單的利用數(shù)值計算不足以解決問題,因此結(jié)合有限元軟件ANSYS得出最佳的參數(shù)值。本文得到了覆膜設(shè)備的樣機。利用設(shè)備進行相關(guān)封裝試驗,得到了無氣泡、黏貼良好以及沒有破損的封裝產(chǎn)品,表明本文所設(shè)計的覆膜封裝設(shè)備符合預(yù)期的設(shè)計要求。該設(shè)備具有結(jié)構(gòu)精簡、操作方便、穩(wěn)定性高、自動化程度高等優(yōu)點,滿足了現(xiàn)代封裝生產(chǎn)的要求,具有很廣的應(yīng)用前景。
[Abstract]:In this paper, the design and application of a new vacuum automatic film coating equipment are studied. With the rapid development of chip packaging industry, the requirements of packaging molding technology are becoming higher and higher. The vacuum film coating equipment is put forward in view of the disadvantages of the current packaging and forming technology. Vacuum film coating technology uses air pressure difference to realize the packaging of PCBA, because of its simple function principle, low cost and high forming efficiency. At present, the processing parameters of vacuum film mulching equipment are determined by a large number of experiments, which not only cause a great waste of manpower and material resources, but also seriously affect the industrialization development of vacuum film mulching equipment. Therefore, it is of great significance to design a new vacuum film coating equipment in this paper. Based on the characteristics of film mulching equipment under vacuum condition, this paper mainly studies the following four aspects: (1) to establish the purpose, requirements and functions of the equipment research and development, so as to determine the design direction of the equipment; (2) establishing a suitable radiation heat transfer model, analyzing the surface temperature distribution of the film, and providing the theoretical basis for the determination of the actual parameters of the equipment; (3) designing the whole structure of the coating equipment, including the design of each mechanical workpiece, the selection of the mechanical standard parts and the evaluation of the whole performance, etc. (4) relevant experiments were carried out to observe and analyze the package effect and to optimize the package parameters and process to improve the performance. Because of the complexity of the radiation heat transfer process between planes, simple numerical calculation is not enough to solve the problem, so the optimal parameter value can be obtained by using the finite element software ANSYS. In this paper, the prototype of film mulching equipment is obtained. The packaging products with no bubble, good adhesion and no breakage were obtained by using the equipment. It shows that the packaging equipment designed in this paper accords with the expected design requirements. The equipment has the advantages of simple structure, convenient operation, high stability and high degree of automation. It meets the requirements of modern packaging production and has a wide application prospect.
【學(xué)位授予單位】：南京理工大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TN405

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