【摘要】：傳統(tǒng)銅箔蝕刻法的PCB布線工藝流程復雜、生產(chǎn)成本高并造成十分嚴重的環(huán)境污染,而新型微流動沉積直寫技術使用材料僅限于功能液體漿料。為實現(xiàn)PCB布線直寫工藝的應用,提出了金屬熔融擠出沉積成型方法。針對PCB基板不耐高溫的難點,設計直寫—轉移—后處理三步驟,利用耐高溫的陶瓷基板中間過渡,完成直寫和圖形轉移兩步流程。該技術方案突破了微流動沉積材料的局限性,并提出了新的PCB布線直寫的可行性工藝流程。本文闡述了氣動式金屬熔融擠出沉積成型裝置的工作原理,分析氣壓驅(qū)動熔融金屬微小孔出流的流場情況,建立了管嘴出流模型,指出相關參數(shù)對出流規(guī)律和沉積成型質(zhì)量的影響。設計并搭建了氣動式擠出沉積成型系統(tǒng),分別對運動系統(tǒng)、氣動控制系統(tǒng)、溫度控制裝置、軟件操作系統(tǒng)四個模塊的組建及功能進行了較為詳細的分析和說明。以金屬熔融擠出沉積成型系統(tǒng)為工作平臺,Sn-0.7Cu為實驗材料,研究了擠出沉積直寫裝置的工作機理與性能,針對PCB基板上直寫不同線型的一般規(guī)律作了相關闡述。結合理論研究和實驗數(shù)據(jù)結果,分析驅(qū)動氣壓、加熱溫度、噴嘴直徑、噴嘴距離基板高度和走線速度對成型導線尺寸的影響。研究了噴嘴“涂抹”直寫模型和成型過程中出現(xiàn)“積高”和“斷流”質(zhì)量缺陷的一般規(guī)律。通過平面布線實驗,不斷調(diào)整各個參數(shù)的交互影響,基本解決了“積高”和“斷流”等質(zhì)量缺陷,成功利用0.2mm直徑噴嘴沉積直寫得到橫截面尺寸為0.15mm高、0.3mm寬的導線圖形,持續(xù)穩(wěn)定布線效率可以達到10mm·s-1。驗證了該裝置的可靠性和氣動擠出沉積原理工藝實現(xiàn)PCB布線的可行性。
[Abstract]:The PCB wiring process of traditional copper foil etching process is complex, the production cost is high and the environment pollution is very serious. However, the new micro-flow deposition direct-writing technology is limited to the functional liquid slurry. In order to realize the application of PCB wiring direct writing process, a metal melt extrusion deposition forming method was proposed. Aiming at the difficulty of high temperature resistance of PCB substrate, three steps of direct write, transfer and post processing are designed, and two steps of direct writing and graphics transfer are completed by using the intermediate transition of high temperature resistant ceramic substrate. The technical scheme breaks through the limitation of micro-flow deposition material, and puts forward a new feasible process of PCB wiring direct writing. In this paper, the working principle of pneumatic metal melt extrusion deposition forming device is described, the flow field of gas pressure driven melt metal micro pore is analyzed, and the outlet flow model of pipe nozzle is established. The influence of relevant parameters on the flow rule and deposition quality is pointed out. A pneumatic extrusion deposition molding system is designed and built. The construction and functions of four modules, namely, motion system, pneumatic control system, temperature control device and software operating system, are analyzed and explained in detail. Based on the metal melt extrusion deposition forming system and Sn-0.7Cu as the experimental material, the working mechanism and performance of the extrusion deposition direct-writing device were studied, and the general rules of different lines of direct writing on the PCB substrate were expounded. The effects of driving pressure, heating temperature, nozzle diameter, nozzle distance from substrate height and line velocity on the dimension of the wire are analyzed. The direct writing model of nozzle "smear" and the general rule of quality defects of "product height" and "cut off" in the molding process are studied. Through the plane wiring experiment, the interactive influence of various parameters is adjusted constantly, and the quality defects such as "product height" and "current breakage" are basically solved, and the traverse pattern with high cross-section size and wide 0.3mm width can be obtained by using 0.2mm diameter nozzle deposition directly. The continuous and stable routing efficiency can reach 10mm s-1. The reliability of the device and the feasibility of PCB routing by pneumatic extrusion deposition process are verified.
【學位授予單位】：華中科技大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TN41

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1 陳鵬;金屬熔融擠出沉積的PCB直寫技術研究[D];華中科技大學;2015年

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本文編號：2269147