銅柱柵陣列互連結(jié)構(gòu)壓曲失穩(wěn)力學(xué)行為研究
發(fā)布時(shí)間：2018-08-29 10:29
【摘要】：隨著電子產(chǎn)品向體積微型化、功能多樣化的方向發(fā)展,對(duì)電子產(chǎn)品中封裝器件可靠性的要求不斷提高。目前,為應(yīng)對(duì)產(chǎn)品高密度、微型化需求而提出的球柵陣列(Ball Grid Array-BGA)封裝器件的可靠性還明顯低于周邊引腳器件,IBM公司開(kāi)發(fā)的柱柵陣列(Ceramic Column Grid Array-CCGA)封裝器件的可靠性較BGA封裝器件有顯著增加,為適應(yīng)無(wú)鉛化發(fā)展趨勢(shì)而采用銅柱代替釬料柱,從而形成銅柱柵陣列(Copper Column Grid Array-Cu CGA)封裝器件。近年來(lái),國(guó)內(nèi)外學(xué)者主要關(guān)注銅柱柵陣列互連結(jié)構(gòu)在熱循環(huán)載荷作用下的可靠性,而對(duì)機(jī)械載荷作用下的力學(xué)行為研究較少。為全面考察多種載荷形式下形狀參數(shù)對(duì)銅柱柵陣列互連結(jié)構(gòu)承載能力的影響,本文借助有限元仿真軟件MSC.Marc,結(jié)合非線(xiàn)性壓曲失穩(wěn)理論,通過(guò)展現(xiàn)銅柱柵陣列互連器件中Cu焊柱的壓曲失穩(wěn)過(guò)程,考察形狀參數(shù)(Cu柱長(zhǎng)徑比、釬焊圓角高度以及焊盤(pán)中心距)對(duì)銅柱柵陣列互連結(jié)構(gòu)承載能力的影響,并對(duì)軸向壓力載荷作用下Cu焊柱的力學(xué)行為及其失效形式進(jìn)行研究,得到如下結(jié)論:1.壓曲失穩(wěn)前,Cu焊柱中Von Mises應(yīng)力分布均勻且Cu柱處Von Mises應(yīng)力明顯大于釬焊圓角處Von Mises應(yīng)力。釬焊圓角處的Von Mises應(yīng)力呈現(xiàn)出以Cu柱軸線(xiàn)為圓心并向外逐漸減小的變化趨勢(shì);壓曲失穩(wěn)后,Cu柱與釬焊圓角中軸對(duì)稱(chēng)的應(yīng)力分布特征被打破。比較銅柱柵陣列互連結(jié)構(gòu)中各Cu焊柱的變形情況,可以看出Cu焊柱彎曲方向不同,表明失穩(wěn)變形方向具有隨機(jī)性的特點(diǎn)。2.釬焊圓角高度為0.33 mm,Cu焊盤(pán)直徑為1.0 mm,Cu直徑為0.32 mm時(shí),隨著Cu柱長(zhǎng)徑比由5增加至16.5,銅柱柵陣列互結(jié)構(gòu)的臨界載荷呈現(xiàn)降低的變化趨勢(shì)。采用擾動(dòng)壓曲分析及弧長(zhǎng)法壓曲分析理論所得到的臨界載荷差異很小。由非線(xiàn)性(擾動(dòng))壓曲分析可知,長(zhǎng)徑比為5~11.5的Cu焊柱壓曲失穩(wěn)前會(huì)因內(nèi)部性能薄弱的釬焊圓角的局部區(qū)域存在超過(guò)釬料極限強(qiáng)度的拉伸應(yīng)力而首先引發(fā)局部微裂紋;長(zhǎng)徑比為11.5~16.5的Cu焊柱則會(huì)首先發(fā)生壓曲失穩(wěn)失效。綜合考慮釬焊圓角局部微裂紋可靠性隱患和Cu焊柱壓曲失穩(wěn)失效,建立Cu柱長(zhǎng)徑比和銅柱柵陣列互連結(jié)構(gòu)臨界應(yīng)力的關(guān)系方程:軸向臨界壓應(yīng)力值在5~11.5長(zhǎng)徑比范圍內(nèi)幾乎保持恒定,而在11.5~16.5長(zhǎng)徑比范圍內(nèi)則隨Cu柱長(zhǎng)徑比λ_0增加以正比于λ_0~(-2)的規(guī)律降低,該變化規(guī)律與描述大柔度壓桿力學(xué)行為的歐拉公式相符合。3.當(dāng)Cu柱長(zhǎng)徑比為10時(shí),隨著釬焊圓角高度的增加,銅柱柵陣列互連結(jié)構(gòu)臨界載荷增大;而隨著焊盤(pán)中心距的增加,銅柱柵陣列互連結(jié)構(gòu)臨界載荷值略有降低。上述銅柱柵陣列互連結(jié)構(gòu)中Cu焊柱發(fā)生壓曲失穩(wěn)前因釬焊圓角局部區(qū)域存在超過(guò)釬料極限強(qiáng)度的拉伸應(yīng)力而首先引發(fā)局部微裂紋,降低結(jié)構(gòu)可靠性。
[Abstract]:With the development of miniaturization of electronic products and diversification of functions, the reliability of packaging devices in electronic products has been improved. At present, in order to cope with the high density of products, The reliability of the spherical gate array (Ball Grid Array-BGA) packaging device proposed for miniaturization is also significantly lower than that of the peripheral pin device developed by IBM. The reliability of the cylindrical gate array (Ceramic Column Grid Array-CCGA) packaging device is significantly higher than that of the BGA packaging device. In order to adapt to the development trend of lead-free, copper column is used instead of solder column to form copper column gate array (Copper Column Grid Array-Cu CGA) packaging device. In recent years, scholars at home and abroad have focused on the reliability of copper column-gate array interconnection structures under thermal cycling load, but less on the mechanical behavior under mechanical load. In order to investigate the influence of shape parameters on the load-carrying capacity of copper column-gate array interconnection structures under various load forms, the finite element simulation software MSC.Marc, is used in this paper and the nonlinear buckling theory is used. The influence of shape parameters (Cu column aspect ratio, brazing angle height and pad center distance) on the bearing capacity of copper column gate array interconnection structures was investigated by demonstrating the buckling instability process of the Cu soldering post in the copper column gate array interconnection devices, and the effect of the shape parameters (Cu column aspect ratio, brazing angle height and pad center distance) on the bearing capacity of the copper column gate array interconnection structures was investigated. The mechanical behavior and failure mode of Cu welding post under axial pressure loading are studied. The conclusion is as follows: 1. The Von Mises stress distribution is uniform and the Von Mises stress at the Cu post is obviously larger than that at the brazing corner before the bending instability. The Von Mises stress at the brazed fillet shows a tendency of decreasing gradually with the axis of Cu column as the center and gradually decreases after buckling, and the axisymmetric stress distribution in the brazed fillet is broken after buckling. By comparing the deformation of each Cu post in the copper column gate array interconnection structure, it can be seen that the bending direction of the Cu post is different, which indicates that the direction of instability deformation is stochastic. 2. The critical load of copper column gate array interstructure decreases with the increase of the ratio of length to diameter of Cu column from 5 to 16.5 when the soldering angle height is 0. 33 mm,Cu and the pad diameter is 0. 32 mm. The critical load difference obtained by using perturbation buckling analysis and arc length buckling analysis theory is very small. According to the nonlinear (perturbed) buckling analysis, it can be seen that the tensile stress in the local region of the brazing fillet with weak internal performance will cause local microcracks first before the buckling of the Cu soldering post with the aspect ratio of 5 to 11.5. The failure of buckling and buckling occurs first when the aspect ratio of Cu is 11.5- 16.5. Considering the reliability hidden trouble of local micro-crack in soldering fillet and the failure of buckling of Cu welding post, The relation equation between the aspect ratio of Cu column and the critical stress of copper column-gate array interconnection structure is established. The axial critical compressive stress value is almost constant in the range of 51.5-aspect ratio. However, in the range of 11.5 / 16.5 aspect ratio of Cu columns, the ratio of length to diameter 位 0 decreases with the increase of the ratio of length to diameter of Cu column, which is in line with the Euler's formula describing the mechanical behavior of large flexible compression bar. When the ratio of length to diameter of Cu column is 10:00, the critical load increases with the increase of brazing angle height, and decreases slightly with the increase of pad center distance. In the above copper column grid array interconnection structure, the local micro-cracks are first caused by the tensile stress in the local region of the brazed fillet due to the local tensile stress of the brazing fillet, which decreases the reliability of the structure before the buckling of the Cu solder post occurs.
【學(xué)位授予單位】：哈爾濱理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類(lèi)號(hào)】：TN05
[Abstract]:With the development of miniaturization of electronic products and diversification of functions, the reliability of packaging devices in electronic products has been improved. At present, in order to cope with the high density of products, The reliability of the spherical gate array (Ball Grid Array-BGA) packaging device proposed for miniaturization is also significantly lower than that of the peripheral pin device developed by IBM. The reliability of the cylindrical gate array (Ceramic Column Grid Array-CCGA) packaging device is significantly higher than that of the BGA packaging device. In order to adapt to the development trend of lead-free, copper column is used instead of solder column to form copper column gate array (Copper Column Grid Array-Cu CGA) packaging device. In recent years, scholars at home and abroad have focused on the reliability of copper column-gate array interconnection structures under thermal cycling load, but less on the mechanical behavior under mechanical load. In order to investigate the influence of shape parameters on the load-carrying capacity of copper column-gate array interconnection structures under various load forms, the finite element simulation software MSC.Marc, is used in this paper and the nonlinear buckling theory is used. The influence of shape parameters (Cu column aspect ratio, brazing angle height and pad center distance) on the bearing capacity of copper column gate array interconnection structures was investigated by demonstrating the buckling instability process of the Cu soldering post in the copper column gate array interconnection devices, and the effect of the shape parameters (Cu column aspect ratio, brazing angle height and pad center distance) on the bearing capacity of the copper column gate array interconnection structures was investigated. The mechanical behavior and failure mode of Cu welding post under axial pressure loading are studied. The conclusion is as follows: 1. The Von Mises stress distribution is uniform and the Von Mises stress at the Cu post is obviously larger than that at the brazing corner before the bending instability. The Von Mises stress at the brazed fillet shows a tendency of decreasing gradually with the axis of Cu column as the center and gradually decreases after buckling, and the axisymmetric stress distribution in the brazed fillet is broken after buckling. By comparing the deformation of each Cu post in the copper column gate array interconnection structure, it can be seen that the bending direction of the Cu post is different, which indicates that the direction of instability deformation is stochastic. 2. The critical load of copper column gate array interstructure decreases with the increase of the ratio of length to diameter of Cu column from 5 to 16.5 when the soldering angle height is 0. 33 mm,Cu and the pad diameter is 0. 32 mm. The critical load difference obtained by using perturbation buckling analysis and arc length buckling analysis theory is very small. According to the nonlinear (perturbed) buckling analysis, it can be seen that the tensile stress in the local region of the brazing fillet with weak internal performance will cause local microcracks first before the buckling of the Cu soldering post with the aspect ratio of 5 to 11.5. The failure of buckling and buckling occurs first when the aspect ratio of Cu is 11.5- 16.5. Considering the reliability hidden trouble of local micro-crack in soldering fillet and the failure of buckling of Cu welding post, The relation equation between the aspect ratio of Cu column and the critical stress of copper column-gate array interconnection structure is established. The axial critical compressive stress value is almost constant in the range of 51.5-aspect ratio. However, in the range of 11.5 / 16.5 aspect ratio of Cu columns, the ratio of length to diameter 位 0 decreases with the increase of the ratio of length to diameter of Cu column, which is in line with the Euler's formula describing the mechanical behavior of large flexible compression bar. When the ratio of length to diameter of Cu column is 10:00, the critical load increases with the increase of brazing angle height, and decreases slightly with the increase of pad center distance. In the above copper column grid array interconnection structure, the local micro-cracks are first caused by the tensile stress in the local region of the brazed fillet due to the local tensile stress of the brazing fillet, which decreases the reliability of the structure before the buckling of the Cu solder post occurs.
【學(xué)位授予單位】：哈爾濱理工大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類(lèi)號(hào)】：TN05
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