3D芯片綁定中測試綁定次序?qū)Τ杀镜挠绊?/H1>
發(fā)布時間：2018-06-28 04:11
本文選題：丟棄成本 + 成本模型��； 參考：《電子學(xué)報》2017年09期
【摘要】：針對3D SICs(3D Stacked Integrated Circuits,三維堆疊集成電路)在多次綁定影響下的成本估算問題,現(xiàn)有的方法忽略了實際中經(jīng)常發(fā)生的丟棄成本,從而使得理論的測試技術(shù)不能很好的應(yīng)用于實際生產(chǎn).本文根據(jù)綁定中測試的特點,提出了一種協(xié)同考慮綁定成功率與丟棄成本的3D SICs理論總成本模型.基于該模型,提出了一種3D SICs最優(yōu)綁定次序的搜索算法.最后,進(jìn)一步提出了減少綁定中測試次數(shù)的方法,實現(xiàn)了"多次綁定、一次測試",改進(jìn)了傳統(tǒng)綁定中測試"一綁一測"的方式.實驗結(jié)果表明,本文提出的成本模型更貼近于實際生產(chǎn)現(xiàn)狀,最優(yōu)綁定次序、最優(yōu)綁定中測試次數(shù)可以更加有效指導(dǎo)3D芯片的制造.
[Abstract]:In view of the cost estimation problem of 3D stacked Integrated Circuit (3D stacked Integrated Circuit) under the influence of multiple bindings, the existing methods ignore the discard cost that often occurs in practice, which makes the theoretical testing technology not well applied in practical production. According to the characteristics of binding testing, a 3D SICs theoretical total cost model considering binding success rate and dropping cost is proposed in this paper. Based on this model, a 3D SICs optimal binding order search algorithm is proposed. Finally, the method of reducing the number of tests in binding is put forward. The method of "multiple binding, one test" is realized, and the way of testing "one bound one test" in traditional binding is improved. The experimental results show that the cost model proposed in this paper is closer to the actual production situation, the optimal binding order and the test times in the optimal binding can guide the manufacture of 3D chip more effectively.
【作者單位】： 合肥工業(yè)大學(xué);情感計算與先進(jìn)智能機(jī)器安徽省重點實驗室;中國電子科技集團(tuán)第三十八研究所;
【基金】：國家自然科學(xué)基金重點項目(No.61432004);國家自然科學(xué)基金(No.61474035,No.61204046,No.61306049) 安徽省科技攻關(guān)(No.1206c0805039) 安徽省自然科學(xué)基金(No.1508085QF129) 教育部新教師基金(No.20130111120030)
【分類號】：TN407
，
本文編號：2076675
本文鏈接：http://sikaile.net/kejilunwen/dianzigongchenglunwen/2076675.html
本文選題：丟棄成本 + 成本模型��； 參考：《電子學(xué)報》2017年09期
【摘要】：針對3D SICs(3D Stacked Integrated Circuits,三維堆疊集成電路)在多次綁定影響下的成本估算問題,現(xiàn)有的方法忽略了實際中經(jīng)常發(fā)生的丟棄成本,從而使得理論的測試技術(shù)不能很好的應(yīng)用于實際生產(chǎn).本文根據(jù)綁定中測試的特點,提出了一種協(xié)同考慮綁定成功率與丟棄成本的3D SICs理論總成本模型.基于該模型,提出了一種3D SICs最優(yōu)綁定次序的搜索算法.最后,進(jìn)一步提出了減少綁定中測試次數(shù)的方法,實現(xiàn)了"多次綁定、一次測試",改進(jìn)了傳統(tǒng)綁定中測試"一綁一測"的方式.實驗結(jié)果表明,本文提出的成本模型更貼近于實際生產(chǎn)現(xiàn)狀,最優(yōu)綁定次序、最優(yōu)綁定中測試次數(shù)可以更加有效指導(dǎo)3D芯片的制造.
[Abstract]:In view of the cost estimation problem of 3D stacked Integrated Circuit (3D stacked Integrated Circuit) under the influence of multiple bindings, the existing methods ignore the discard cost that often occurs in practice, which makes the theoretical testing technology not well applied in practical production. According to the characteristics of binding testing, a 3D SICs theoretical total cost model considering binding success rate and dropping cost is proposed in this paper. Based on this model, a 3D SICs optimal binding order search algorithm is proposed. Finally, the method of reducing the number of tests in binding is put forward. The method of "multiple binding, one test" is realized, and the way of testing "one bound one test" in traditional binding is improved. The experimental results show that the cost model proposed in this paper is closer to the actual production situation, the optimal binding order and the test times in the optimal binding can guide the manufacture of 3D chip more effectively.
【作者單位】： 合肥工業(yè)大學(xué);情感計算與先進(jìn)智能機(jī)器安徽省重點實驗室;中國電子科技集團(tuán)第三十八研究所;
【基金】：國家自然科學(xué)基金重點項目(No.61432004);國家自然科學(xué)基金(No.61474035,No.61204046,No.61306049) 安徽省科技攻關(guān)(No.1206c0805039) 安徽省自然科學(xué)基金(No.1508085QF129) 教育部新教師基金(No.20130111120030)
【分類號】：TN407
，
本文編號：2076675
本文鏈接：http://sikaile.net/kejilunwen/dianzigongchenglunwen/2076675.html
最近更新
教材專著
