本文選題：溫度控制 + IGBT　； 參考：《西北大學(xué)》2015年碩士論文

【摘要】：隨著集成電路(IC)性能及集成度的提高,對(duì)器件工藝的要求愈加嚴(yán)格,特別是對(duì)氧化擴(kuò)散溫度精度要求越來(lái)越高。溫度對(duì)器件的氧化速率和摻入的雜質(zhì)分布具有決定性的影響,致使溫度控制精度不僅直接影響集成芯片產(chǎn)品質(zhì)量,而且影響著產(chǎn)品的成本,研究開(kāi)發(fā)性能優(yōu)異的氧化擴(kuò)散爐溫度控制系統(tǒng)成為微電子制造行業(yè)的熱點(diǎn)問(wèn)題之一。論文基于IC制造行業(yè)的特點(diǎn),分析了氧化擴(kuò)散爐溫度控制系統(tǒng)的參數(shù)需求,通過(guò)論證提出了一種基于FPGA的IGBT大功率開(kāi)關(guān)加熱裝置溫度控制系統(tǒng)研究方案。論文分析了FPGA控制電路、信號(hào)調(diào)理電路和IGBT半橋逆變及其驅(qū)動(dòng)電路的原理和結(jié)構(gòu)。利用邏輯電路速度快、C語(yǔ)言處理數(shù)據(jù)能力強(qiáng)的優(yōu)點(diǎn),采用SOPC技術(shù)將NiosII軟核處理器嵌入到FPGA中,設(shè)計(jì)并實(shí)現(xiàn)系統(tǒng)溫度測(cè)量；采用FPGA自帶的參數(shù)化模塊庫(kù)設(shè)計(jì)了增量式PID控制器；通過(guò)可編程邏輯語(yǔ)言設(shè)計(jì)并實(shí)現(xiàn)了可調(diào)脈寬的脈沖信號(hào)發(fā)生器；搭建基于IGBT加熱裝置,結(jié)合控制軟件實(shí)現(xiàn)溫度的控制,最后完成了系統(tǒng)的裝配和調(diào)試。本系統(tǒng)的測(cè)試結(jié)果為,系統(tǒng)升溫速率最大可達(dá)22℃/min,恒溫至1000℃時(shí)溫度波動(dòng)小于2℃,達(dá)到了預(yù)期的設(shè)計(jì)目標(biāo)。
[Abstract]:With the improvement of IC (Integrated Circuit) performance and integration, the requirement of device technology is becoming more and more strict, especially the precision of oxidation diffusion temperature is becoming higher and higher. Temperature has a decisive effect on the oxidation rate and impurity distribution of the device, which results in the temperature control accuracy directly affecting not only the quality of integrated chip products, but also the cost of the products. The research and development of oxidation diffusion furnace temperature control system with excellent performance has become one of the hot issues in microelectronics manufacturing industry. Based on the characteristics of IC manufacturing industry, this paper analyzes the parameter requirements of temperature control system of oxidation diffusion furnace, and puts forward a research scheme of temperature control system of IGBT high power switch heating device based on FPGA. The principle and structure of FPGA control circuit, signal conditioning circuit, IGBT half-bridge inverter and its driving circuit are analyzed in this paper. Taking advantage of the fast speed of logic circuit and the strong ability of data processing in C language, the NiosII soft core processor is embedded into FPGA by SOPC technology, and the temperature measurement of the system is designed and realized, and the incremental PID controller is designed by using the parameterized module library of FPGA. The pulse signal generator with adjustable pulse width is designed and realized by programmable logic language, and the system is assembled and debugged based on IGBT heating device and control software. The test results show that the maximum heating rate of the system can reach 22 鈩，

本文編號(hào)：1888383