本文選題：低溫連接 + 電鍍鎳��； 參考：《哈爾濱工業(yè)大學(xué)》2017年碩士論文

【摘要】：焊接界長(zhǎng)期致力于尋找新的連接技術(shù);經(jīng)過(guò)多年的研究和發(fā)展,一些特種先進(jìn)連接方法,如激光焊、電子束焊、摩擦焊以及微連接技術(shù)等已經(jīng)成為了現(xiàn)代連接技術(shù)的重要組成部分。電鍍作為一種已經(jīng)發(fā)展相對(duì)成熟的表面改性工藝,其在連接領(lǐng)域的用途和潛力并未引起國(guó)內(nèi)外學(xué)者足夠的關(guān)注。本研究旨在通過(guò)電鍍鎳的方式對(duì)Cu-Cu試樣以及Cu-Al試樣進(jìn)行連接,探索電鍍工藝在連接領(lǐng)域的可行性及可靠性,使之成為一種具有特殊用途的新型連接技術(shù)。本文采用電鍍鎳的方式,對(duì)Cu-Cu試樣以及Cu-Al試樣進(jìn)行了低溫連接試驗(yàn),探索了電鍍連接工藝,通過(guò)透射電子顯微鏡等表征手段研究了連接界面的組織結(jié)構(gòu),分析了電流密度對(duì)鍍鎳連接層的影響,并通過(guò)單向拉伸試驗(yàn)測(cè)試了連接接頭的抗拉強(qiáng)度;此外,本文還對(duì)Cu-Al試樣進(jìn)行了老化處理,分析了老化時(shí)間對(duì)Al/Ni界面金屬間化合物的演化及其界面結(jié)合強(qiáng)度的影響�；陔婂僋i的Cu-Cu及Cu-Al的低溫連接工藝,其電鍍液配方以氨基磺酸鎳為主鹽,氯化鎳為活化劑,硼酸為PH值穩(wěn)定劑;得到了形貌均勻、內(nèi)部致密的鍍鎳連接層,實(shí)現(xiàn)了Cu-Cu及Cu-Al的電鍍Ni低溫連接。Cu/Ni界面為一個(gè)60 nm寬度的Cu、Ni原子擴(kuò)散區(qū)域,該區(qū)域是一層FCC結(jié)構(gòu)的銅鎳原子無(wú)限置換固溶體Cu_xNi_(1-x)。Al/Ni界面為一個(gè)寬度約為100 nm的Al、Ni原子擴(kuò)散區(qū)域,界面中靠近Ni側(cè)存在一個(gè)寬度約為20 nm的AlNi相,該相的晶體結(jié)構(gòu)為BCC。Cu-Cu電鍍Ni低溫連接,接頭抗拉強(qiáng)度為100~280 MPa,斷口位于鍍鎳連接層或者銅基材;其連接強(qiáng)度可以超過(guò)基材本身。Cu-Al電鍍Ni接頭在老化前的平均連接強(qiáng)度為124 MPa,200℃恒溫老化1000 h后為122 MPa,等溫老化處理對(duì)Cu-Al電鍍Ni接頭強(qiáng)度無(wú)影響。此外,Cu-Al電鍍Ni接頭在200℃恒溫老化1000 h后,Al/Ni界面并無(wú)IMC生長(zhǎng)。鍍鎳連接層生長(zhǎng)速度方向上硬度隨電流密度增大而增大;而其垂直生長(zhǎng)速度方向的硬度不受電流密度影響。鍍鎳連接層的晶粒在(111)、(200)以及(220)晶面法向上的平均厚度分別為188~208?、138~187?以及83~139?;電流密度越大,鍍鎳連接層的晶粒尺寸減小。
[Abstract]:After many years of research and development, some special advanced connection methods, such as laser welding, electron beam welding, Friction welding and micro-bonding technology have become an important part of modern bonding technology. Electroplating as a relatively mature surface modification process, its application and potential in the field of bonding has not attracted enough attention from domestic and foreign scholars. The purpose of this study is to study the feasibility and reliability of electroplating on Cu-Cu and Cu-Al samples by means of nickel plating, and to make it a new type of bonding technology with special application. In this paper, the low temperature bonding tests of Cu-Cu and Cu-Al samples were carried out by means of electroplating nickel, and the electroplating bonding process was explored. The microstructure of the interface was studied by means of transmission electron microscope (TEM). The effect of current density on the nickel coating is analyzed, and the tensile strength of the joint is tested by uniaxial tensile test. In addition, the aging treatment of Cu-Al sample is also carried out. The influence of aging time on the evolution and bonding strength of intermetallic compounds at Al/Ni interface was analyzed. The low temperature bonding process of Cu-Cu and Cu-Al based on electroplating Ni. The electroplating solution is composed of nickel aminosulfonate as main salt, nickel chloride as activator and boric acid as PH stabilizer. The electroplated Ni / Ni interface of Cu-Cu and Cu-Al is characterized by a 60nm Cu-Ni atom diffusion region. The interface of a layer of FCC structure copper-nickel atom infinite displacement solid solution Cu_xNi_(1-x).Al/Ni is a 100nm wide Alnio Ni atom diffusion region. There is a AlNi phase with a width of about 20nm near the Ni side of the interface. The crystal structure of the phase is BCC.Cu-Cu electroplated Ni low temperature bonding. The tensile strength of the joint is 100 ~ 280MPa. The fracture surface is located in the nickel-plated bonding layer or the copper substrate. The bonding strength can exceed that of the substrate itself. The average bonding strength of Cu-Al electroplated Ni joints before aging is 124MPa after aging at 200 鈩，

本文編號(hào)：1840005