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  本文選題：電致化學(xué)拋光 + 靜壓支承��； 參考：《大連理工大學(xué)》2015年碩士論文

【摘要】：電致化學(xué)拋光加工是一種新的表面超精密加工方法,該方法通過電化學(xué)氧化將拋光液中的電活性中介體氧化成刻蝕劑,對工件進(jìn)行刻蝕加工,基于離子擴(kuò)散來控制反應(yīng)進(jìn)程,通過超平滑電極實現(xiàn)工件的拋光加工。該加工方法具有距離敏感性,其加工精度以及材料去除率與加工間隙成反比例關(guān)系,為了實現(xiàn)加工區(qū)域材料去除的一致性和可控性,必須保證加工間隙液膜厚度即工件表面和電極表面間隙的均一高精度控制。因此,超平滑電極的制備以及工件和電極間加工間隙的高精度控制是實現(xiàn)電致化學(xué)拋光的關(guān)鍵技術(shù)。針對大面積電極電致化學(xué)拋光中工作電極與工件之間均勻微納間隙的控制要求,提出了基于液體靜壓支承技術(shù)的微納間隙控制方法,在理論計算的基礎(chǔ)上設(shè)計并制作了一套基于液體靜壓支承的微納間隙控制裝置。對所制作的微納間隙控制裝置進(jìn)行試驗標(biāo)定,可實現(xiàn)0-8μm的調(diào)節(jié)范圍,小于500 nm/kPa的調(diào)節(jié)分辨率以及±0.2μm的重復(fù)定位精度。針對大面積電極電致化學(xué)拋光中對電極的要求,設(shè)計并制作了直徑為50mm的濺射金薄膜和玻碳鑲嵌兩種不同形式的工作電極,并對兩種電極的性能進(jìn)行了分析。最后,利用所設(shè)計的液體靜壓支承微納間隙控制裝置并結(jié)合電化學(xué)工作站三電極體系對濺射銅工件進(jìn)行了電致化學(xué)拋光。在工作電極不自轉(zhuǎn)的情況下,取得了較好的拋光和平坦化效果,工件表面粗糙度Ra值從82nm改善至4nm,刻蝕區(qū)域的線輪廓PV值從290m降低到120 nm,但加工區(qū)域的邊緣處散布著一些凸峰。當(dāng)工作電極加入自轉(zhuǎn)后,與靜態(tài)電致化學(xué)拋光相比,整體面型改善效果不明顯,但是銅工件表面的微觀凸峰得到了極大改善,工件表面粗糙度Ra值也從216 nm減小到6 nm。
[Abstract]:Electro-chemical polishing is a new ultra-precision surface machining method, which oxidizes the electrically active intermediaries in the polishing liquid to etch agents through electrochemical oxidation, and etching the workpiece. The reaction process is controlled based on ion diffusion. The polishing of workpiece is realized by super smooth electrode. The machining method has the sensitivity of distance, the machining precision and the material removal rate are inversely proportional to the machining clearance. In order to realize the consistency and controllability of the material removal in the processing area, It is necessary to ensure the uniform and high precision control of the thickness of the liquid film between the workpiece surface and the electrode surface. Therefore, the preparation of super-smooth electrode and the high precision control of machining gap between workpiece and electrode are the key technologies to realize electro-chemical polishing. Aiming at the control requirement of uniform micro / nano gap between working electrode and workpiece in large area electrochemical polishing, a method of micro / nano gap control based on hydrostatic support technology is proposed. On the basis of theoretical calculation, a micro-nano gap control device based on hydrostatic support is designed and fabricated. The experimental calibration of the micro / nano gap control device can realize the adjustment range of 0-8 渭 m, adjust resolution of less than 500 nm/kPa and repeat positioning accuracy of 鹵0.2 渭 m. In order to meet the requirements of electrode in large area electrochemical polishing, two kinds of working electrodes, sputtering gold thin film with diameter of 50mm and glassy carbon mosaic, were designed and fabricated, and the properties of the two kinds of electrodes were analyzed. Finally, the electro-chemical polishing of the sputtering copper workpiece was carried out by using the designed hydrostatic pressure supporting micro-nano gap control device and the three-electrode system of electrochemical workstation. When the working electrode is not rotating, a better polishing and flattening effect is obtained. The surface roughness Ra value of the workpiece is improved from 82nm to 4 nm, and the line profile PV value of the etching area is reduced from 290 m to 120 nm, but some convex peaks are scattered at the edge of the machining area. When the working electrode is rotated, the effect of surface shape improvement is not obvious compared with static electrochemical polishing, but the micro-convex peak of copper workpiece surface is greatly improved, and the surface roughness Ra value of the workpiece is reduced from 216 nm to 6 nm.
【學(xué)位授予單位】：大連理工大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN305.2

【參考文獻(xiàn)】

相關(guān)期刊論文 前1條

1 段小艷;任冬梅;;激光干涉法微位移測量技術(shù)綜述[J];計測技術(shù);2012年06期

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本文編號：1793027