本文選題：印制電路板微孔導(dǎo)電化處理 + 膨脹石墨�。� 參考：《南京理工大學(xué)》2015年碩士論文

【摘要】：隨著科學(xué)技術(shù)的發(fā)展,電子產(chǎn)品越來越向小型化、多功能化發(fā)展,由此導(dǎo)致印制線路板的層間通聯(lián)孔徑也越來越小。這些微孔的導(dǎo)電化處理是高端印制線路板封裝工藝的重要工序。由于石墨乳液具有操作簡便、無環(huán)境污染等特點(diǎn),近些年來在日本、韓國、美國和歐盟等電子產(chǎn)品生產(chǎn)技術(shù)強(qiáng)國得到了高度重視和發(fā)展,并逐步取代傳統(tǒng)的化學(xué)鍍工藝,廣泛應(yīng)用于印制線路板的制造。本文主要研究導(dǎo)電石墨乳液的導(dǎo)電原理、方法和技術(shù)。針對印制線路板的層間聯(lián)通孔徑最小已低于1mm的技術(shù)要求,以微米石墨為原料,通過插層改性處理和高溫膨化,制備出膨脹石墨。然后,基于所制備的膨脹石墨,研制了在印制線路板微孔壁面具有良好成膜能力和導(dǎo)電性能的石墨乳液。具體研究內(nèi)容如下：基于石墨的結(jié)構(gòu)和物理化學(xué)性質(zhì),設(shè)計了導(dǎo)電石墨乳液的組成、微米石墨的氧化插層改性方法。以超細(xì)微米級石墨為原料,采用化學(xué)氧化法,以NA-PP-PA-AA為氧化插層體系制備了可膨脹石墨；通過單因素實(shí)驗,確定了由微米級石墨制備可膨脹石墨的工藝。FTIR和SEM等測試分析結(jié)果表明,反應(yīng)試劑的基團(tuán)插入到了石墨層間,并形成了石墨層間化合物。由微米級石墨制備的膨脹石墨,體積增加了6倍。導(dǎo)電石墨乳液主要由所制備的膨脹石墨、有機(jī)粘結(jié)劑、水和助劑等組成。以膨脹石墨為導(dǎo)電物質(zhì),以RX-20為助劑,SP-33為有機(jī)粘結(jié)劑,研制了具有良好成膜能力、導(dǎo)電能力和穩(wěn)定性的石墨乳液,并以塑料平板為基材進(jìn)行了成膜及導(dǎo)電性工藝研究。實(shí)驗結(jié)果表明,在25℃下,反應(yīng)時間為2小時,由5%膨脹石墨、1.00%RX-20和6.00%SP-33組成的水性石墨乳液,最小表面電阻率只有2.36Ω/m2。SEM測試結(jié)果表明,所研制的石墨乳液可以在塑料實(shí)驗板表面形成致密而均勻的導(dǎo)電涂層。以上研究的配方和工藝,為所研制的石墨乳液用于PCB板微孔導(dǎo)電化處理奠定了基礎(chǔ)�；谏鲜鏊兄频囊耘蛎浭珵閷�(dǎo)電物質(zhì)的石墨乳液,研究了PCB板微孔的導(dǎo)電化處理工藝,并分別對單層和多層(3-11)PCB,孔徑分別為0.8mm、1mm和1.2mm的微孔進(jìn)行了處理。結(jié)果表明,將單層和多層PCB板浸漬于所研制的石墨乳液中,浸漬4次,每次15min,干燥時間為1小時,即可滿足PCB板后續(xù)處理的工藝要求。
[Abstract]:With the development of science and technology, electronic products are becoming more and more miniaturized and multifunctional. As a result, the interlayer connection aperture of printed circuit board (PCB) becomes smaller and smaller.The conductive treatment of these micropores is an important process of high-end printed circuit board packaging process.Because graphite emulsion is easy to operate and no environmental pollution, in recent years in Japan, South Korea, the United States and the European Union and other electronic products production technology countries have received great attention and development, and gradually replace the traditional electroless plating process.Widely used in the manufacturing of printed circuit boards.This paper mainly studies the conductive principle, method and technology of conductive graphite emulsion.In view of the technical requirement that the interlaminar connection aperture of printed circuit board is lower than that of 1mm, expanded graphite is prepared by intercalation modification and high temperature expansion with micron graphite as raw material.Then, based on the expanded graphite prepared, graphite emulsion with good film forming ability and conductive property on the microporous wall of printed circuit board (PCB) was developed.The main contents are as follows: based on the structure and physical and chemical properties of graphite, the composition of conductive graphite emulsion and the modification method of micrometer graphite oxide intercalation were designed.Expandable graphite was prepared from ultrafine micron graphite by chemical oxidation and NA-PP-PA-AA as oxidation intercalation system.The process of preparing expandable graphite from micron graphite was determined. FTIR and SEM showed that the group of reaction reagent was inserted into graphite interlayer and formed graphite interlaminar compound.The volume of expanded graphite prepared from micron graphite increased by 6 times.Conductive graphite emulsion mainly consists of expanded graphite, organic binder, water and auxiliaries.Graphite emulsion with good film forming ability, electrical conductivity and stability was prepared by using expanded graphite as conductive material and RX-20 as auxiliary agent SP-33 as organic binder. Film forming and electrical conductivity were studied using plastic plate as substrate.The experimental results show that the minimum surface resistivity of waterborne graphite emulsion composed of 5% expanded graphite 1.00 and RX-20 and 6.00%SP-33 is only 2.36 惟 / m ~ (2) SEM at 25 鈩，

本文編號：1756945