本文選題：集成光學(xué)　切入點(diǎn)：光子集成器件　出處：《激光與光電子學(xué)進(jìn)展》2017年05期

【摘要】：隨著光網(wǎng)絡(luò)通信容量的高速增長,將分立的光學(xué)器件集成化以減小器件尺寸、降低成本成為光電子器件發(fā)展的必然趨勢。光子集成回路具有尺寸小、功耗低、質(zhì)量輕等優(yōu)點(diǎn),是解決未來寬帶光網(wǎng)絡(luò)能耗大、體積大、容量小等問題的關(guān)鍵技術(shù)。綜述了基于多項(xiàng)目晶圓流片的規(guī)模化光子集成技術(shù),主要包括硅基光子集成技術(shù)、Ⅲ-Ⅴ族磷化銦集成技術(shù),以及以氮化硅和二氧化硅多層波導(dǎo)結(jié)構(gòu)為基礎(chǔ)的TriPleX集成技術(shù);介紹了目前可以提供這3種多項(xiàng)目晶圓流片光子集成技術(shù)的代工平臺(tái)以及利用這些代工平臺(tái)實(shí)現(xiàn)的一些光子集成芯片,并對這些平臺(tái)的工藝參數(shù)進(jìn)行了比較。
[Abstract]:With the rapid growth of optical network communication capacity, it is an inevitable trend for optoelectronic devices to integrate discrete optical devices to reduce device size and reduce cost. Photonic integrated circuits have the advantages of small size, low power consumption, light mass, and so on. It is a key technology to solve the problems of large energy consumption, large volume and small capacity in the future broadband optical network. This paper reviews the large-scale photonic integration technology based on multi-item wafer wafer, which mainly includes silicon-based photonic integration technology. 鈪，

本文編號：1673701