T字型三電平IGBT模塊瞬態(tài)行為研究
[Abstract]:High-power converter is the core device of smart grid, the three-level inverter circuit is a new type of application. IGBT is the core component of the system. Its behavior characteristics interact with the system and ensure the high reliability of the system. One of the determinants of safety and efficiency. In this paper, the transient behavior of IGBT is studied by using T-shaped three-level topology as the starting point, which provides theoretical and empirical support for improving the reliability of the system and optimizing the design of the system. In this paper, 14 commutation modes of T-shaped three-level inverter circuits are studied. The results of theoretical analysis show that: in each output mode, the IGBT module will exhibit special transient behavior characteristics, and will trigger the Vce desaturation detection circuit of IGBT, which will cause the malfunction, stop the output and turn off the system. Then the stability of the system is affected. In this paper, an experimental platform of 15kW inverter circuit is established to verify for the first time the misfiring of T-shaped three-level IGBT module to Vce desaturation detection circuit. It is also verified that the output current and the capacitive effect of diode will aggravate the false trigger probability. At the same time, according to the experimental results, the control strategy to improve the phenomenon is obtained. In addition, aiming at the requirement of parallel connection of IGBT module in the high power environment of T-shaped three-level circuit, the transient behavior of this type of IGBT module is analyzed theoretically and experimentally for the first time. The effect of the end temperature difference on the transient behavior of parallel is analyzed and the parallel difference between T type three level and two level is compared. The experimental results show that the consistency of parallel opening behavior of IGBT can be improved under certain temperature difference. For turn-off behavior, when the temperature difference increases, the energy loss mismatch will increase, and the risk of overvoltage and di/dt will also increase. Moreover, due to the special topology of the T type, extra current channels will be formed in parallel, which will increase the loss. Finally, the parallel effect of T-shaped three-level module is better than that of two-level parallel. The theoretical and experimental results in this paper not only provide a reference for the DSP implementation of the circuit or the realization of the hardware drive protection circuit, but also protect it from unexpected faults. At the same time, it also provides guidance for the heat dissipation and structure design in the realization of high power T type three-level inverter circuit.
【學(xué)位授予單位】:復(fù)旦大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2014
【分類號】:TM464
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