本文選題：高速背板連接器　切入點：信號完整性　出處：《北京郵電大學(xué)》2015年碩士論文

【摘要】：在傳輸速率高達數(shù)Gbps的高速數(shù)字系統(tǒng)中,由于高速信號的有效頻率已經(jīng)達到微波頻段甚至是毫米波頻段,在信號傳輸過程中,會由于傳輸線效應(yīng)而引發(fā)信號完整性問題。此時傳統(tǒng)的分析方法已經(jīng)無法達到高速產(chǎn)品性能的要求。 信號完整性主要研究的是如何使信號以準(zhǔn)確的時序和可接受的電壓幅值到達接收端,并使接收端作出正確的響應(yīng)。當(dāng)前國內(nèi)對20Gbps以上高速連接器的信號完整性研究并不多見,加上目前高端武器的研發(fā)和民用市場對高速連接器的需求,本文以高速背板連接器(傳輸速率為20Gbps)為研究對象,并結(jié)合信號完整性分析理論,利用三維高頻結(jié)構(gòu)仿真軟件HFSS對該高速背板連接器進行頻域分析和參數(shù)的提取,同時利用電路仿真軟件Ansoft Designer對高速背板連接器分別進行電磁、電路的協(xié)同仿真。通過仿真結(jié)果分析影響高速連接器頻域特性(插入損耗、回波損耗、近端串?dāng)_、遠端串?dāng)_)和時域特性(特性阻抗、眼圖分析、誤碼率)的影響因素。同時利用矢量網(wǎng)絡(luò)分析儀(VNA),時域反射計對連接器的高速技術(shù)指標(biāo)進行精確、穩(wěn)定地測試,進而通過測試結(jié)果分析、驗證被測連接器的高速傳輸性能。 通過仿真結(jié)果的對比分析可知,控制PCB傳輸晶片銅箔粗糙度可以有效減小信號的損耗；差分微帶線之間增加隔離過孔,可以有效的消除諧振現(xiàn)象,同時還增加了差分對間的隔離度,減小了差分對間的串?dāng)_。本課題根據(jù)高速連接器的設(shè)計要求,搭建了一整套針對信號完整性問題的測試系統(tǒng),通過實際測試驗證了仿真的結(jié)果和高速連接器的傳輸性能。
[Abstract]:In a high-speed digital system with a transmission rate of up to several Gbps, since the effective frequency of the high-speed signal has reached the microwave band or even the millimeter-wave band, in the process of signal transmission, Because of the transmission line effect, the problem of signal integrity can be caused, and the traditional analysis method can no longer meet the requirements of high-speed product performance. The main research of signal integrity is how to make the signal arrive at the receiver with accurate timing and acceptable voltage amplitude, and make the receiver make correct response. At present, there are few researches on the signal integrity of high speed connectors above 20Gbps in our country. In addition to the current research and development of high-end weapons and the demand for high-speed connectors in the civil market, this paper takes the high-speed backplane connector (transmission rate is 20Gbps) as the research object, and combines with the theory of signal integrity analysis. The frequency domain analysis and parameter extraction of the high speed backplane connector are carried out by using three dimensional high frequency structure simulation software HFSS, and the high speed backplane connector is separately electromagnetic by circuit simulation software Ansoft Designer. The simulation results are used to analyze the frequency domain characteristics (insertion loss, echo loss, near end crosstalk, remote crosstalk) and time domain characteristics (characteristic impedance, eye diagram analysis) of high speed connectors. At the same time, the high speed technical index of the connector is tested accurately and stably by using the vector network analyzer (VNAN) and time domain reflectometer, and the high speed transmission performance of the tested connector is verified through the analysis of the test results. Through the comparison and analysis of the simulation results, it can be seen that controlling the copper foil roughness of the PCB transmission wafer can effectively reduce the loss of the signal, and increase the isolation hole between the differential microstrip lines, which can effectively eliminate the resonance phenomenon. At the same time, the isolation between differential pairs is increased, and the crosstalk between differential pairs is reduced. According to the design requirements of high-speed connectors, a set of testing system for signal integrity is built. The simulation results and the transmission performance of the high speed connector are verified by actual test.
【學(xué)位授予單位】：北京郵電大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TM503.5

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本文編號：1684878