超薄納米銅薄膜在接觸變形下變形機(jī)制的研究
[Abstract]:Nanocrystalline metal thin films have been widely used in high-tech fields such as microelectronics and semiconductors. This new material can be used not only as a hard coating on MEMS parts, but also as a thermal conductive coating on electronic devices. The mechanical properties of nanocrystalline films have become the focus of study because they are often subjected to cyclic stress in the working process. Revealing the deformation mechanism of the film plays an important role in the study of the mechanical properties of nanocrystalline films. In this paper, the microstructure and deformation mechanism of ultrathin nanocrystalline copper films under contact deformation were studied by a thin film transfer technique. Firstly, the "photoresist / Sio _ 2 / Si" composite structure with special pattern was fabricated by photoetching technique, and then the ultrathin nanocrystalline copper thin films with 50nm thickness were deposited on the composite substrate by DC magnetron sputtering. Scanning and transmission electron microscopy (TEM) techniques were used to study the microstructure and microstructure of nano-indentation films. The mechanism of nano-indentation deformation was also discussed. The results are as follows: (1) under the scanning and transmission electron microscopy, the indentation is equilateral triangle, its shape is consistent with the indentation head, and there is an obvious "pile-up" phenomenon around the indentation area. Compared with the non-indentation site, the number of grains in the indentation area decreased and the grain orientation changed. (2) under the high resolution transmission electron microscope, the grains in the indentation region were equiaxed. The grain size is larger than that in the unindented region. In addition, there are a large number of deformation twins in the grains, and the twins have obvious orientation. (3) in the process of nanocrystalline indentation, the grain growth can pass through the grain boundary migration, the rotation of the grains and the adjustment of the twins. (4) deformation twinning is another main way of film deformation under contact deformation. Deformation twins emit incomplete dislocations through grain boundaries on the slip plane and change the shape of the grains at the same time. Deformation twins are formed by multiple self-proliferation of incomplete dislocations in grains under local stress. In addition, incomplete dislocations can also be used to form "V" zigzag and parallelogram twin regions in the grains by means of springback mechanism.
【學(xué)位授予單位】:太原理工大學(xué)
【學(xué)位級別】:碩士
【學(xué)位授予年份】:2015
【分類號】:TB383.1;O614.121
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