本文選題：EB-PVD　切入點：強化機制　出處：《稀有金屬材料與工程》2017年02期 　論文類型：期刊論文

【摘要】：采用電子束物理氣相沉積(EB-PVD)制備了納米鉬顆粒彌散強化銅基復合材料(Mo體積含量為2.5%~10.8%),對其材料微觀結構、鉬含量和硬度、電阻率關系進行了研究。結果表明:Cu-Mo復合材料中銅基體由柱狀晶銅組成,Mo顆粒平均直徑為2.4~8.1 nm;隨著鉬含量增加,銅基體柱狀晶寬度逐漸減小,Mo顆粒平均直徑逐漸增加,硬度、電阻率逐漸增加;EB-PVD制備的Cu-Mo復合材料主要強化機制為Orowan機制。
[Abstract]:Nanometer molybdenum particles dispersion strengthened copper matrix composites were prepared by electron beam physical vapor deposition (EB-PVD). The volume content of Mo was 2.5 and 10.8%. The microstructure, molybdenum content and hardness of the composites were studied. The results show that the average diameter of Mo particles in Cu matrix consists of columnar crystal copper is 2.4nm, and the average diameter of Mo particles decreases with the increase of molybdenum content, and the average diameter of Mo particles increases with the increase of molybdenum content, and the average diameter of Mo particles increases with the increase of Mo content, and the average diameter of Mo particles increases with the increase of Mo content. The main strengthening mechanism of Cu-Mo composites prepared by EB-PVD is the Orowan mechanism.
【作者單位】： 浙江工業(yè)大學;哈爾濱工業(yè)大學;
【基金】：國家自然科學基金(51104131,51201152) 黑龍江省基金(E201247) 浙江省開放基金(20110929)
【分類號】：TB331

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1 袁慶泰;Cu-Mo與Cu-Ni-Mo低合金鋼粉[J];機械工程材料;1980年03期

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本文編號：1557346