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一種微構(gòu)件拉伸測(cè)試系統(tǒng)及測(cè)試結(jié)構(gòu)設(shè)計(jì)

發(fā)布時(shí)間:2018-06-21 15:17

  本文選題:MEMS + 拉伸測(cè)試; 參考:《應(yīng)用力學(xué)學(xué)報(bào)》2017年05期


【摘要】:微機(jī)電系統(tǒng)(Micro-Electro-Mechanical Systems,MEMS)的力學(xué)性能是研究MEMS可靠性的一個(gè)重要部分。目前,微結(jié)構(gòu)片外拉伸測(cè)試的難點(diǎn)在于如何在實(shí)現(xiàn)較高精度的夾持和測(cè)試的同時(shí)能夠較好地控制成本,這是本文著重解決的問(wèn)題。首先,針對(duì)單晶硅各向異性濕法體硅工藝的特點(diǎn),設(shè)計(jì)了一種新穎而經(jīng)濟(jì)的試樣結(jié)構(gòu),利用力學(xué)分析確定其結(jié)構(gòu)尺寸,通過(guò)有限元分析驗(yàn)證其合理性;其次,設(shè)計(jì)了一種簡(jiǎn)單經(jīng)濟(jì)的微結(jié)構(gòu)片外拉伸測(cè)試系統(tǒng);最后,加工出樣本并進(jìn)行準(zhǔn)靜載拉伸強(qiáng)度測(cè)試。結(jié)果表明:微梁尺寸增大,拉伸強(qiáng)度降低,同時(shí)驗(yàn)證了本裝置在微結(jié)構(gòu)拉伸準(zhǔn)靜載測(cè)試中的適用性。
[Abstract]:The mechanical properties of Micro-Electro-Mechanical Systems (MEMS) are an important part of MEMS reliability research. At present, the difficulty of the micro-structure out-of-chip tensile testing is how to achieve high precision clamping and testing at the same time to better control the cost, which is the focus of this paper. Firstly, according to the characteristics of anisotropic wet bulk silicon process, a novel and economical sample structure is designed. The structural size is determined by mechanical analysis, and the rationality is verified by finite element analysis. A simple and economical out of chip tensile test system is designed. Finally, the sample is processed and the tensile strength of quasi static load is tested. The results show that the size of the micro-beam increases and the tensile strength decreases, and the applicability of the device in the quasi-static load test of the micro-structure is verified at the same time.
【作者單位】: 南昌大學(xué)科學(xué)技術(shù)學(xué)院;
【基金】:江西省高等學(xué)校教學(xué)改革研究省級(jí)課題(JXJG-15-30-3)資助項(xiàng)目
【分類號(hào)】:TH-39
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本文編號(hào):2049209

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